Inventor · disambiguated record
Shang Y. Hou
Also filed as: HOU SHANG Y · HOU SHANG-YU
3 granted patents·78 citations·filing 2003–2006
75Inventor score
Files withTAIWAN SEMICONDUCTOR MFG3
Top patents by PatentIndex Score
3 records- 0194US7294937B2Apparatus and method for manufacturing a semiconductor wafer with reduced delamination and peelingTAIWAN SEMICONDUCTOR MFG·Filed 2006·Granted Nov 13, 2007·26 cites·30 claims
- 0288US7157734B2Semiconductor bond pad structures and methods of manufacturing thereofTAIWAN SEMICONDUCTOR MFG·Filed 2005·Granted Jan 2, 2007·23 cites·20 claims
- 0385US7126225B2Apparatus and method for manufacturing a semiconductor wafer with reduced delamination and peelingTAIWAN SEMICONDUCTOR MFG·Filed 2003·Granted Oct 24, 2006·29 cites·14 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →