Inventor · disambiguated record
Byung-Heon Kwak
Also filed as: KWAK BYUNG-HEON
6 granted patents·2 pending applications·78 citations·filing 1996–2008
82Inventor score
Top patents by PatentIndex Score
8 records- 0186US7746712B2Semiconductor memory device including post package repair control circuit and post package repair methodSAMSUNG ELECTRONICS CO LTD·Filed 2008·Granted Jun 29, 2010·24 cites·24 claims
- 0276US7460428B2Dynamic random access memory and communications terminal including the sameSAMSUNG ELECTRONICS CO LTD·Filed 2006·Granted Dec 2, 2008·11 cites·21 claims
- 0369US5914626AVoltage clamping circuit for semiconductor devicesSAMSUNG ELECTRONICS CO LTD·Filed 1996·Granted Jun 22, 1999·30 cites·5 claims
- 0457US7476983B2Semiconductor device including wire bonding pads and pad layout methodSAMSUNG ELECTRONICS CO LTD·Filed 2006·Granted Jan 13, 2009·2 cites·18 claims
- 0544US5949724ABurn-in stress circuit for semiconductor memory deviceSAMSUNG ELECTRONICS CO LTD·Filed 1997·Granted Sep 7, 1999·11 cites·14 claims
- 0634US2009044063A1Semiconductor memory device and test system of a semiconductor memory deviceSAMSUNG ELECTRONICS CO LTD·Filed 2007·Application pending·0 cites
- 0733US6909654B2Bit line pre-charge circuit of semiconductor memory deviceSAMSUNG ELECTRONICS CO LTD·Filed 2003·Granted Jun 21, 2005·0 cites·18 claims
- 0831US2006132183A1Semiconductor deviceLIM DONG-JIN·Filed 2005·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →