Inventor · disambiguated record
Jordan D. Greenlee
Also filed as: GREENLEE JORDAN · GREENLEE JORDAN D · GREENLEE JORDAN DOUGLAS
118 granted patents·55 pending applications·101 citations·filing 2015–2025
99Inventor score
Files withMICRON TECHNOLOGY INC149LODESTAR LICENSING GROUP LLC19US NAVY2GEORGIA TECH RES INST1MICRON TECH WAY1
Top patents by PatentIndex Score
173 records- 0197US11805651B2Integrated assemblies and methods of forming integrated assembliesMICRON TECHNOLOGY INC·Filed 2022·Granted Oct 31, 2023·2 cites·31 claims
- 0297US11393756B2Methods of forming microelectronic devices, and related microelectronic devices, memory devices, and electronic systemsMICRON TECHNOLOGY INC·Filed 2020·Granted Jul 19, 2022·5 cites·24 claims
- 0397US10283524B1Methods of filling horizontally-extending openings of integrated assembliesMICRON TECHNOLOGY INC·Filed 2017·Granted May 7, 2019·17 cites·9 claims
- 0497US10170493B1Assemblies having vertically-stacked conductive structuresMICRON TECHNOLOGY INC·Filed 2017·Granted Jan 1, 2019·13 cites·16 claims
- 0596US12002759B2Apparatuses including a conductive contact including a dielectric material surrounded by a conductive materialLODESTAR LICENSING GROUP LLC·Filed 2022·Granted Jun 4, 2024·2 cites·20 claims
- 0695US12230325B2Memory arrays comprising strings of memory cells and methods used in forming a memory array comprising strings of memory cellsMICRON TECHNOLOGY INC·Filed 2021·Granted Feb 18, 2025·2 cites·22 claims
- 0795US11476332B2Integrated assemblies, and methods of forming integrated assembliesMICRON TECHNOLOGY INC·Filed 2020·Granted Oct 18, 2022·3 cites·28 claims
- 0895US11404436B2Memory arrays comprising strings of memory cells and methods used in forming a memory array comprising strings of memory cellsMICRON TECHNOLOGY INC·Filed 2020·Granted Aug 2, 2022·3 cites·11 claims
- 0993US11705500B2Assemblies having conductive structures with three or more different materialsMICRON TECHNOLOGY INC·Filed 2021·Granted Jul 18, 2023·2 cites·16 claims
- 1093US9543168B2Defects annealing and impurities activation in semiconductors at thermodynamically non-stable conditionsUS NAVY·Filed 2016·Granted Jan 10, 2017·11 cites·30 claims
- 1192US11791268B2Tungsten structures and methods of forming the structuresMICRON TECHNOLOGY INC·Filed 2022·Granted Oct 17, 2023·2 cites·21 claims
- 1292US10847367B2Methods of forming tungsten structuresMICRON TECHNOLOGY INC·Filed 2018·Granted Nov 24, 2020·7 cites·26 claims
- 1391US11646206B2Methods of forming tungsten structuresMICRON TECHNOLOGY INC·Filed 2020·Granted May 9, 2023·2 cites·20 claims
- 1490US12245426B2Staircase formation in a memory arrayMICRON TECHNOLOGY INC·Filed 2022·Granted Mar 4, 2025·1 cites·10 claims
- 1590US10361214B2Methods of filling openings with conductive material, and assemblies having vertically-stacked conductive structuresMICRON TECHNOLOGY INC·Filed 2018·Granted Jul 23, 2019·3 cites·17 claims
- 1689US11715692B2Microelectronic devices including conductive rails, and related methodsMICRON TECHNOLOGY INC·Filed 2020·Granted Aug 1, 2023·2 cites·16 claims
- 1789US2024407160A1Methods of Filling Openings with Conductive Material, and Assemblies Having Vertically-Stacked Conductive StructuresMICRON TECHNOLOGY INC·Filed 2024·Application pending·0 cites
- 1888US12426266B2Memory arrays comprising strings of memory cells with conductive islandsMICRON TECHNOLOGY INC·Filed 2024·Granted Sep 23, 2025·0 cites·14 claims
- 1988US11315877B2Methods of forming microelectronic devices, and related microelectronic devices, memory devices, and electronic systemsMICRON TECHNOLOGY INC·Filed 2020·Granted Apr 26, 2022·2 cites·24 claims
- 2088US11056505B2Integrated assemblies having one or more modifying substances distributed within semiconductor material, and methods of forming integrated assembliesMICRON TECHNOLOGY INC·Filed 2019·Granted Jul 6, 2021·3 cites·39 claims
- 2188US2025336826A1Microelectronic devces and memory devicesLODESTAR LICENSING GROUP LLC·Filed 2025·Application pending·0 cites
- 2287US11342265B2Apparatus including a dielectric material in a central portion of a contact via, and related methods, memory devices and electronic systemsMICRON TECHNOLOGY INC·Filed 2019·Granted May 24, 2022·3 cites·23 claims
- 2387US10957775B2Assemblies having conductive structures with three or more different materialsMICRON TECHNOLOGY INC·Filed 2019·Granted Mar 23, 2021·3 cites·33 claims
- 2486US12368101B2Apparatuses including interconnect structures including dielectric material surrounded by conductive material, and related memory devicesLODESTAR LICENSING GROUP LLC·Filed 2024·Granted Jul 22, 2025·0 cites·20 claims
- 2585US12274063B2Integrated assemblies and methods of forming integrated assembliesLODESTAR LICENSING GROUP LLC·Filed 2023·Granted Apr 8, 2025·0 cites·20 claims
- 2685US11244903B2Tungsten structures and methods of forming the structuresMICRON TECHNOLOGY INC·Filed 2019·Granted Feb 8, 2022·4 cites·24 claims
- 2785US2025098168A1Integrated assemblies having vertically-spaced channel material segments, and methods of forming integrated assembliesLODESTAR LICENSING GROUP LLC·Filed 2024·Application pending·0 cites
- 2884US11127899B2Conductive interconnects suitable for utilization in integrated assemblies, and methods of forming conductive interconnectsMICRON TECHNOLOGY INC·Filed 2019·Granted Sep 21, 2021·3 cites·25 claims
- 2984US10573661B2Methods of filling horizontally-extending openings of integrated assembliesMICRON TECHNOLOGY INC·Filed 2019·Granted Feb 25, 2020·2 cites·18 claims
- 3083US12507405B2Integrated assemblies and methods of forming integrated assembliesMICRON TECHNOLOGY INC·Filed 2024·Granted Dec 23, 2025·0 cites·22 claims
- 3183US2025234551A1Integrated assemblies and methods of forming integrated assembliesLODESTAR LICENSING GROUP LLC·Filed 2025·Application pending·0 cites
- 3283US2025104770A1Memory Arrays Comprising Strings Of Memory Cells And Methods Used In Forming A Memory Array Comprising Strings Of Memory CellsMICRON TECHNOLOGY INC·Filed 2024·Application pending·0 cites
- 3382US2024224524A1Integrated Assemblies, and Methods of Forming Integrated AssembliesMICRON TECHNOLOGY INC·Filed 2024·Application pending·0 cites
- 3482US2025359282A1Transistor and Memory Circuitry Comprising Strings of Memory CellsMICRON TECHNOLOGY INC·Filed 2025·Application pending·0 cites
- 3581US12453089B2Memory arrays comprising strings of memory cells and methods used in forming a memory array comprising strings of memory cellsLODESTAR LICENSING GROUP LLC·Filed 2023·Granted Oct 21, 2025·0 cites·12 claims
- 3681US12342542B2Integrated circuitry comprising a memory array comprising strings of memory cells and comprising a stack containing non-stoichiometric silicon nitrideMICRON TECHNOLOGY INC·Filed 2023·Granted Jun 24, 2025·0 cites·18 claims
- 3781US2024381638A1Memory Arrays Comprising Strings Of Memory Cells And Methods Used In Forming A Memory Array Comprising Strings Of Memory CellsMICRON TECHNOLOGY INC·Filed 2024·Application pending·0 cites
- 3881US2025280539A1Integrated Circuitry Comprising a Memory Array Comprising Strings of Memory Cells and Methods Used in Forming a Memory Array Comprising Strings of Memory CellsMICRON TECHNOLOGY INC·Filed 2025·Application pending·0 cites
- 3981US2025293164A1Microelectronic devices including barrier structures, and related memory devicesLODESTAR LICENSING GROUP LLC·Filed 2025·Application pending·0 cites
- 4081US2025384929A1Microelectronic devices and related memory devicesMICRON TECHNOLOGY INC·Filed 2025·Application pending·0 cites
- 4180US11963359B2Integrated assemblies, and methods of forming integrated assembliesMICRON TECHNOLOGY INC·Filed 2023·Granted Apr 16, 2024·0 cites·6 claims
- 4280US10361216B2Methods used in forming an array of elevationally-extending transistorsMICRON TECHNOLOGY INC·Filed 2017·Granted Jul 23, 2019·2 cites·29 claims
- 4380US2025107089A1Integrated assemblies having one or more modifying substances distributed within semiconductor material, and methods of forming integrated assembliesLODESTAR LICENSING GROUP LLC·Filed 2024·Application pending·0 cites
- 4480US2025273576A1Memory device including staircase structure having conductive padsMICRON TECHNOLOGY INC·Filed 2025·Application pending·0 cites
- 4579US12426261B2Integrated circuitry comprising a memory array comprising strings of memory cells and methods used in forming a memory array comprising strings of memory cellsMICRON TECHNOLOGY INC·Filed 2022·Granted Sep 23, 2025·0 cites·18 claims
- 4679US12185544B2Integrated assemblies having vertically-spaced channel material segments, and methods of forming integrated assembliesLODESTAR LICENSING GROUP LLC·Filed 2022·Granted Dec 31, 2024·0 cites·16 claims
- 4779US2025056800A1Memory arrays and methods used in forming a memory array comprising strings of memory cellsLODESTAR LICENSING GROUP LLC·Filed 2024·Application pending·0 cites
- 4878US12462852B2Metal-containing structures, and methods of treating metal-containing material to increase grain size and/or reduce contaminant concentrationMICRON TECHNOLOGY INC·Filed 2022·Granted Nov 4, 2025·0 cites·15 claims
- 4978US12300616B2Memory device including staircase structure having conductive padsMICRON TECHNOLOGY INC·Filed 2023·Granted May 13, 2025·0 cites·20 claims
- 5078US2025159890A1Microelectronic devices with conductive rails formed on promoter material on conductive tiers of stack, and related methodsMICRON TECHNOLOGY INC·Filed 2025·Application pending·0 cites
Showing the top 50 of 173 patent records by PatentIndex Score.
Join the waitlist — get patent alerts
Get an alert when Jordan D. Greenlee files or is granted a new patent.
We store only your email — no account needed. See our privacy policy.
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →