Inventor · disambiguated record
Takaaki Niwa
Also filed as: NIWA TAKAAKI
2 granted patents·4 pending applications·68 citations·filing 1999–2024
67Inventor score
Top patents by PatentIndex Score
6 records- 0182US6360421B1Automotive manufacturing system for frame componentHONDA MOTOR CO LTD·Filed 1999·Granted Mar 26, 2002·51 cites·13 claims
- 0272US6675467B2Automotive manufacturing systemHONDA MOTOR CO LTD·Filed 2001·Granted Jan 13, 2004·17 cites·11 claims
- 0359US2025266385A1Film adhesive, dicing/die bonding integrated film, and semiconductor device and method for producing sameRESONAC CORP·Filed 2024·Application pending·0 cites
- 0457US2025293077A1Film adhesive, dicing and die-bonding integral film, semiconductor device, and manufacturing method for sameRESONAC CORP·Filed 2024·Application pending·0 cites
- 0548US2025226347A1Adhesive film for semiconductors, dicing die bonding film, and method for producing semiconductor deviceRESONAC CORP·Filed 2023·Application pending·0 cites
- 0648US2025226348A1Adhesive film for semiconductors, dicing/die-bonding film, and method for manufacturing semiconductor deviceRESONAC CORP·Filed 2023·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →