Inventor · disambiguated record
Barry Jay Thaler
Also filed as: THALER BARRY J · THALER BARRY JAY
30 granted patents·1 pending application·1,764 citations·filing 1981–2005
98Inventor score
Top patents by PatentIndex Score
31 records- 0197US6455930B1Integrated heat sinking packages using low temperature co-fired ceramic metal circuit board technologyLAMINA CERAMICS INC·Filed 2000·Granted Sep 24, 2002·126 cites·8 claims
- 0295US5846396ALiquid distribution systemSARNOFF CORP·Filed 1995·Granted Dec 8, 1998·575 cites·59 claims
- 0394US5842106AMethod of producing micro-electrical conduitsSARNOFF CORP·Filed 1995·Granted Nov 24, 1998·145 cites·22 claims
- 0493US6713862B2Low temperature co-fired ceramic-metal packaging technologyLAMINA CERAMICS·Filed 2002·Granted Mar 30, 2004·67 cites·10 claims
- 0592US6653009B2Solid oxide fuel cells and interconnectorsSARNOFF CORP·Filed 2002·Granted Nov 25, 2003·47 cites·36 claims
- 0691US6739047B2Method of making ceramic multilayer circuit boards mounted in a patterned metal support substrateLAMINA CERAMICS INC·Filed 2002·Granted May 25, 2004·61 cites·6 claims
- 0789US6518502B2Ceramic multilayer circuit boards mounted on a patterned metal support substrateLAMINA CERAMICS IN·Filed 2001·Granted Feb 11, 2003·66 cites·13 claims
- 0889US5581876AMethod of adhering green tape to a metal support substrate with a bonding glassSARNOFF DAVID RES CENTER·Filed 1995·Granted Dec 10, 1996·104 cites·12 claims
- 0981US5847935AElectronic circuit chip packageSARNOFF CORP·Filed 1996·Granted Dec 8, 1998·63 cites·14 claims
- 1080US5565262AElectrical feedthroughs for ceramic circuit board support substratesSARNOFF DAVID RES CENTER·Filed 1995·Granted Oct 15, 1996·50 cites·16 claims
- 1180US5216207ALow temperature co-fired multilayer ceramic circuit boards with silver conductorsSARNOFF DAVID RES CENTER·Filed 1991·Granted Jun 1, 1993·63 cites·18 claims
- 1277US5858145AMethod to control cavity dimensions of fired multilayer circuit boards on a supportSARNOFF CORP·Filed 1996·Granted Jan 12, 1999·64 cites·11 claims
- 1377US5256469AMulti-layered, co-fired, ceramic-on-metal circuit board for microelectronic packagingGEN ELECTRIC·Filed 1991·Granted Oct 26, 1993·64 cites·16 claims
- 1473US6300267B1High dielectric constant buried capacitors with extended operating temperature rangesSARNOFF CORP·Filed 1999·Granted Oct 9, 2001·27 cites·12 claims
- 1572US7183640B2Method and structures for enhanced temperature control of high power components on multilayer LTCC and LTCC-M boardsLAMINA CERAMICS INC·Filed 2003·Granted Feb 27, 2007·17 cites·8 claims
- 1671US5958807ALow dielectric loss glass ceramic compositionsSARNOFF CORP·Filed 1997·Granted Sep 28, 1999·34 cites·4 claims
- 1770US6017642ALow dielectric loss glassesSARNOFF CORP·Filed 1997·Granted Jan 25, 2000·32 cites·6 claims
- 1867US7011725B2High performance embedded RF filtersLAMINA CERAMICS INC·Filed 2005·Granted Mar 14, 2006·3 cites·3 claims
- 1966US4772488AOrganic binder removal using CO2 plasmaGEN ELECTRIC·Filed 1987·Granted Sep 20, 1988·32 cites·6 claims
- 2066US4413510ACoating adhesion testingRCA CORP·Filed 1981·Granted Nov 8, 1983·24 cites·3 claims
- 2165US6690123B1Electron gun with resistor and capacitorSARNOFF CORP·Filed 2000·Granted Feb 10, 2004·6 cites·33 claims
- 2263US5514451AConductive via fill inks for ceramic multilayer circuit boards on support substratesSARNOFF DAVID RES CENTER·Filed 1995·Granted May 7, 1996·29 cites·16 claims
- 2360US6628057B2Slightly conducting insulators for cathode-ray tube (CRT) applicationsTHOMSON LICENSING SA·Filed 2000·Granted Sep 30, 2003·4 cites·8 claims
- 2455US5876536AMethod for the reduction of lateral shrinkage in multilayer circuit boards on a substrateSARNOFF CORP·Filed 1997·Granted Mar 2, 1999·20 cites·6 claims
- 2549US5681444AElectrical feedthroughs for ceramic circuit board support substratesSARNOFF DAVID RES CENTER·Filed 1996·Granted Oct 28, 1997·13 cites·6 claims
- 2644US5653834AProcess for making electrical feedthroughs for ceramic circuit board support substratesSARNOFF DAVID RES CENTER·Filed 1995·Granted Aug 5, 1997·9 cites·7 claims
- 2743US6709749B1Method for the reduction of lateral shrinkage in multilayer circuit boards on a substrateLAMINA CERAMICS INC·Filed 1998·Granted Mar 23, 2004·10 cites·2 claims
- 2836US6471805B1Method of forming metal contact pads on a metal support substrateSARNOFF CORP·Filed 1999·Granted Oct 29, 2002·4 cites·11 claims
- 2935US4675639ATransformer assembly and winding thereforRCA CORP·Filed 1985·Granted Jun 23, 1987·4 cites·12 claims
- 3031US6914501B1High performance embedded RF filtersLAMINA CERAMICS INC·Filed 1999·Granted Jul 5, 2005·1 cites·2 claims
- 3123US2001001406A1Method of making transmission lines and buried passive components in green tapeFiled 1998·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →