Inventor · disambiguated record
Ya-Mei Lin
Also filed as: Lin ya-mei
3 granted patents·2 pending applications·6 citations·filing 2011–2025
60Inventor score
Top patents by PatentIndex Score
5 records- 0176US9258900B2Copper foil structure having blackened ultra-thin foil and manufacturing method thereofNANYA PLASTICS CORP·Filed 2014·Granted Feb 9, 2016·1 cites·5 claims
- 0275US9078353B2Copper foil structure having blackened ultra-thin foil and manufacturing method thereofNANYA PLASTICS CORP·Filed 2013·Granted Jul 7, 2015·3 cites·6 claims
- 0375US8329315B2Ultra thin copper foil with very low profile copper foil as carrier and its manufacturing methodTZOU MING JEN·Filed 2011·Granted Dec 11, 2012·2 cites·3 claims
- 0457US2025092553A1Electrodeposited copper foil with a uniform matte surfaceDUPONT ELECTRONICS INC·Filed 2024·Application pending·0 cites
- 0549US2025297396A1Electrodeposited copper foil with a preffered orientation of (200) crystal plane and applications thereofDUPONT ELECTRONICS INC·Filed 2025·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →