Inventor · disambiguated record
Suk-Chul Bang
Also filed as: BANG SUK · BANG SUK C · BANG SUK-CHUL
18 granted patents·5 pending applications·206 citations·filing 1994–2015
94Inventor score
Top patents by PatentIndex Score
23 records- 0196US8076234B1Semiconductor device and method of fabricating the same including a conductive structure is formed through at least one dielectric layer after forming a via structurePARK BYUNG-LYUL·Filed 2010·Granted Dec 13, 2011·40 cites·19 claims
- 0294US9691684B2Integrated circuit device including through-silicon via structure and decoupling capacitor and method of manufacturing the samePARK JAE-HWA·Filed 2014·Granted Jun 27, 2017·21 cites·20 claims
- 0393US9379042B2Integrated circuit devices having through silicon via structures and methods of manufacturing the samePARK JAE-HWA·Filed 2014·Granted Jun 28, 2016·15 cites·19 claims
- 0493US8592310B2Methods of manufacturing a semiconductor devicePARK BYUNG-LYUL·Filed 2011·Granted Nov 26, 2013·18 cites·20 claims
- 0590US9214411B2Integrated circuit devices including a through-silicon via structure and methods of fabricating the samePARK JAE-HWA·Filed 2014·Granted Dec 15, 2015·12 cites·15 claims
- 0690US9142490B2Integrated circuit device having through-silicon-via structure and method of manufacturing the integrated circuit devicePARK JAE-HWA·Filed 2014·Granted Sep 22, 2015·11 cites·20 claims
- 0787US9018768B2Integrated circuit having through silicon via structure with minimized deteriorationPARK BYUNG-LYUL·Filed 2012·Granted Apr 28, 2015·10 cites·7 claims
- 0886US8546256B2Method of forming semiconductor deviceJUNG DEOK-YOUNG·Filed 2011·Granted Oct 1, 2013·7 cites·20 claims
- 0980US8860221B2Electrode connecting structures containing copperSAMSUNG ELECTRONICS CO LTD·Filed 2012·Granted Oct 14, 2014·5 cites·20 claims
- 1075US5573323ARefrigerator having a pressure equilbrium apparatusSAMSUNG ELECTRONICS CO LTD·Filed 1994·Granted Nov 12, 1996·40 cites·20 claims
- 1168US8847399B2Semiconductor device and method of fabricating the samePARK BYUNG-LYUL·Filed 2011·Granted Sep 30, 2014·2 cites·16 claims
- 1261US8497157B2Method of manufacturing a semiconductor device and method of manufacturing a semiconductor package including the sameMOON KWANG-JIN·Filed 2012·Granted Jul 30, 2013·1 cites·14 claims
- 1359US8419853B2Stacked semiconductor device and related methodKANG YUN-SEUNG·Filed 2009·Granted Apr 16, 2013·1 cites·12 claims
- 1452US2013337647A1Methods of forming a semiconductor deviceSAMSUNG ELECTRONICS CO LTD·Filed 2013·Application pending·0 cites
- 1551US5557942AMethods and apparatus for equalizing pressure between a refrigerating compartment and ambient airSAMSUNG ELECTRONICS CO LTD·Filed 1994·Granted Sep 24, 1996·20 cites·10 claims
- 1649US7682450B2Stacked semiconductor device and related methodSAMSUNG ELECTRONICS CO LTD·Filed 2006·Granted Mar 23, 2010·0 cites·14 claims
- 1749US7268029B2Method of fabricating CMOS transistor that prevents gate thinningSAMSUNG ELECTRONICS CO LTD·Filed 2004·Granted Sep 11, 2007·3 cites·23 claims
- 1846US2007281434A1Capacitor of semiconductor device applying damascene process and method of fabricating the sameSAMSUNG ELECTRONICS CO LTD·Filed 2007·Application pending·0 cites
- 1940US9490216B2Semiconductor device and semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2015·Granted Nov 8, 2016·0 cites·18 claims
- 2038US2012132986A1Semiconductor devices and methods of manufacturing the sameKANG PIL-KYU·Filed 2011·Application pending·0 cites
- 2138US2008087933A1Semiconductor memory device and method of manufacturing the sameCHUNG EUN-KUK·Filed 2007·Application pending·0 cites
- 2237US7585757B2Semiconductor device and method of manufacturing the sameSAMSUNG ELECTRONICS CO LTD·Filed 2006·Granted Sep 8, 2009·0 cites·6 claims
- 2337US2005110143A1Capacitor of semiconductor device applying damascene process and method of fabricating the sameFiled 2004·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →