Inventor · disambiguated record
Hakeem B. S. Akinmade-Yusuff
Also filed as: AKINMADE-YUSUFF HAKEEM · AKINMADE-YUSUFF HAKEEM B · AKINMADE-YUSUFF HAKEEM B S
8 granted patents·2 pending applications·29 citations·filing 2008–2013
83Inventor score
Top patents by PatentIndex Score
10 records- 0182US8796150B2Bilayer trench first hardmask structure and process for reduced defectivityAKINMADE-YUSUFF HAKEEM B S·Filed 2011·Granted Aug 5, 2014·8 cites·11 claims
- 0279US8835307B2Method and structure for reworking antireflective coating over semiconductor substrateAKINMADE-YUSUFF HAKEEM·Filed 2012·Granted Sep 16, 2014·4 cites·11 claims
- 0375US8138093B2Method for forming trenches having different widths and the same depthAKINMADE-YUSUFF HAKEEM B S·Filed 2009·Granted Mar 20, 2012·6 cites·20 claims
- 0475US8030157B1Liner protection in deep trench etchingIBM·Filed 2010·Granted Oct 4, 2011·4 cites·8 claims
- 0574US8450212B2Method of reducing critical dimension process bias differences between narrow and wide damascene wiresANGYAL MATTHEW S·Filed 2011·Granted May 28, 2013·4 cites·25 claims
- 0674US8287980B2Edge protection seal for bonded substratesFAROOQ MUKTA G·Filed 2009·Granted Oct 16, 2012·3 cites·22 claims
- 0756US8771533B2Edge protection seal for bonded substratesIBM·Filed 2013·Granted Jul 8, 2014·0 cites·20 claims
- 0855US8679611B2Edge protection seal for bonded substratesFAROOQ MUKTA G·Filed 2012·Granted Mar 25, 2014·0 cites·20 claims
- 0948US2009283912A1Damascene wiring fabrication methods incorporating dielectric cap etch process with hard mask retentionAKINMADE-YUSUFF HAKEEM B S·Filed 2008·Application pending·0 cites
- 1047US2012205786A1Method and structure for reworking antireflective coating over semiconductor substrateAKINMADE-YUSUFF HAKEEM·Filed 2012·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →