Inventor · disambiguated record

Kuei-Yuam Hsu

Also filed as: HSU KUEI-YUAM

1 granted patent·3 citations·filing 2004–2004

21Inventor score

Technology areasY10S

Files withTAIWAN SEMICONDUCTOR MFG1

Top patents by PatentIndex Score

1 record

0134US6951803B2Method to prevent passivation layer peeling in a solder bump formation processTAIWAN SEMICONDUCTOR MFG·Filed 2004·Granted Oct 4, 2005·3 cites·20 claims

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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →