Inventor · disambiguated record
Charles C. Goldsmith
Also filed as: GOLDSMITH CHARLES C · GOLDSMITH CHARLES CURTIS
12 granted patents·2 pending applications·138 citations·filing 1997–2013
91Inventor score
Top patents by PatentIndex Score
14 records- 0193US6805974B2Lead-free tin-silver-copper alloy solder compositionIBM·Filed 2002·Granted Oct 19, 2004·59 cites·73 claims
- 0288US9379007B2Electromigration-resistant lead-free solder interconnect structuresGLOBALFOUNDRIES INC·Filed 2013·Granted Jun 28, 2016·10 cites·20 claims
- 0382US8420537B2Stress locking layer for reliable metallizationCHANDA KAUSHIK·Filed 2008·Granted Apr 16, 2013·11 cites·11 claims
- 0482US7731077B2Structure and method to gain substantial reliability improvements in lead-free BGAs assembled with lead-bearing soldersIBM·Filed 2007·Granted Jun 8, 2010·7 cites·14 claims
- 0574US6126761AProcess of controlling grain growth in metal filmsIBM·Filed 1998·Granted Oct 3, 2000·29 cites·5 claims
- 0661US7287685B2Structure and method to gain substantial reliability improvements in lead-free BGAs assembled with lead-bearing soldersIBM·Filed 2004·Granted Oct 30, 2007·6 cites·11 claims
- 0759US7276296B2Immersion plating and plated structuresIBM·Filed 2005·Granted Oct 2, 2007·1 cites·4 claims
- 0850US7037559B2Immersion plating and plated structuresIBM·Filed 2003·Granted May 2, 2006·3 cites·41 claims
- 0946US2013249066A1Electromigration-resistant lead-free solder interconnect structuresARVIN CHARLES L·Filed 2012·Application pending·0 cites
- 1045US6638374B2Device produced by a process of controlling grain growth in metal filmsIBM·Filed 2002·Granted Oct 28, 2003·2 cites·7 claims
- 1145US6361627B1Process of controlling grain growth in metal filmsIBM·Filed 2000·Granted Mar 26, 2002·2 cites·9 claims
- 1244US7875806B2Structure and method to gain substantial reliability improvements in lead-free BGAs assembled with lead-bearing soldersIBM·Filed 2010·Granted Jan 25, 2011·0 cites·20 claims
- 1337US2005104208A1Stabilizing copper overlayer for enhanced c4 interconnect reliabilityIBM·Filed 2003·Application pending·0 cites
- 1434US5876795AMethod for producing a low-stress electrolessly deposited nickel layerIBM·Filed 1997·Granted Mar 2, 1999·8 cites·14 claims
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