Inventor · disambiguated record
Ichiro Anjo
Also filed as: ANJO ICHIRO
43 granted patents·1,237 citations·filing 1989–2010
98Inventor score
Files withHITACHI LTD24RENESAS TECH CORP13ELPIDA MEMORY INC2WATANABE YUJI2HITACHI LTD INTELLECTUAL PROPE1
Top patents by PatentIndex Score
43 records- 0198US5068712ASemiconductor deviceHITACHI LTD·Filed 1989·Granted Nov 26, 1991·165 cites·36 claims
- 0296US7466577B2Semiconductor storage device having a plurality of stacked memory chipsHITACHI LTD INTELLECTUAL PROPE·Filed 2006·Granted Dec 16, 2008·107 cites·19 claims
- 0395US7119428B2Semiconductor deviceELPIDA MEMORY INC·Filed 2004·Granted Oct 10, 2006·109 cites·8 claims
- 0492US6861742B2Wafer level chip size package having rerouting layersRENESAS TECH CORP·Filed 2002·Granted Mar 1, 2005·64 cites·19 claims
- 0591US6627997B1Semiconductor module and method of mountingHITACHI LTD·Filed 1999·Granted Sep 30, 2003·124 cites·8 claims
- 0691US6621154B1Semiconductor apparatus having stress cushioning layerHITACHI LTD·Filed 2000·Granted Sep 16, 2003·65 cites·29 claims
- 0787US6784541B2Semiconductor module and mounting method for sameHITACHI LTD·Filed 2002·Granted Aug 31, 2004·37 cites·10 claims
- 0886US6989600B2Integrated circuit device having reduced substrate size and a method for manufacturing the sameRENESAS TECH CORP·Filed 2001·Granted Jan 24, 2006·45 cites·15 claims
- 0986US6770547B1Method for producing a semiconductor deviceRENESAS TECH CORP·Filed 2000·Granted Aug 3, 2004·40 cites·28 claims
- 1086US6624504B1Semiconductor device and method for manufacturing the sameHITACHI LTD·Filed 2000·Granted Sep 23, 2003·43 cites·24 claims
- 1184US6404049B1Semiconductor device, manufacturing method thereof and mounting boardHITACHI LTD·Filed 1996·Granted Jun 11, 2002·59 cites·30 claims
- 1283US7546506B2DRAM stacked package, DIMM, and semiconductor manufacturing methodHITACHI LTD·Filed 2006·Granted Jun 9, 2009·15 cites·7 claims
- 1383US6930388B2Semiconductor device and method for manufacturing the same and semiconductor device-mounted structureRENESAS TECH CORP·Filed 2001·Granted Aug 16, 2005·37 cites·24 claims
- 1483US6822317B1Semiconductor apparatus including insulating layer having a protrusive portionRENESAS TECH CORP·Filed 2000·Granted Nov 23, 2004·37 cites·16 claims
- 1581US7057283B2Semiconductor device and method for producing the sameHITACHI LTD·Filed 2004·Granted Jun 6, 2006·26 cites·30 claims
- 1680US6940162B2Semiconductor module and mounting method for sameRENESAS TECH CORP·Filed 2004·Granted Sep 6, 2005·23 cites·24 claims
- 1780US6326681B1Semiconductor deviceHITACHI LTD·Filed 2000·Granted Dec 4, 2001·14 cites·14 claims
- 1878US8164186B2BGA semiconductor device having a dummy bumpWATANABE YUJI·Filed 2005·Granted Apr 24, 2012·8 cites·5 claims
- 1977US8222737B2BGA semiconductor device having a dummy bumpWATANABE YUJI·Filed 2010·Granted Jul 17, 2012·4 cites·7 claims
- 2077US6348741B1Semiconductor apparatus and a manufacturing method thereofHITACHI LTD·Filed 2000·Granted Feb 19, 2002·25 cites·22 claims
- 2174US6303982B2Semiconductor deviceHITACHI LTD·Filed 2001·Granted Oct 16, 2001·10 cites·28 claims
- 2272US6720591B2Semiconductor integrated circuit deviceRENESAS TECH CORP·Filed 2002·Granted Apr 13, 2004·16 cites·19 claims
- 2370US6621160B2Semiconductor device and mounting boardHITACHI LTD·Filed 2002·Granted Sep 16, 2003·13 cites·1 claims
- 2469US6563212B2Semiconductor deviceHITACHI LTD·Filed 2002·Granted May 13, 2003·12 cites·2 claims
- 2568US6946723B2Semiconductor device and manufacturing method thereofRENESAS TECH CORP·Filed 2001·Granted Sep 20, 2005·13 cites·13 claims
- 2668US6307269B1Semiconductor device with chip size packageHITACHI LTD·Filed 1998·Granted Oct 23, 2001·32 cites·23 claims
- 2767US6531760B1Semiconductor deviceFiled 2000·Granted Mar 11, 2003·6 cites·8 claims
- 2867US6515371B2Semiconductor device with elastic structure and wiringHITACHI LTD·Filed 2001·Granted Feb 4, 2003·13 cites·8 claims
- 2963US6100580ASemiconductor device having all outer leads extending from one side of a resin memberHITACHI LTD·Filed 1998·Granted Aug 8, 2000·17 cites·19 claims
- 3063US6069029ASemiconductor device chip on lead and lead on chip manufacturingHITACHI LTD·Filed 1998·Granted May 30, 2000·13 cites·36 claims
- 3162US6949416B2Method of manufacturing a semiconductor integrated circuit deviceRENESAS TECH CORP·Filed 2004·Granted Sep 27, 2005·9 cites·12 claims
- 3257US6639323B2Semiconductor device and its manufacturing methodHITACHI LTD·Filed 2001·Granted Oct 28, 2003·6 cites·29 claims
- 3353US6720208B2Semiconductor deviceRENESAS TECH CORP·Filed 2002·Granted Apr 13, 2004·2 cites·13 claims
- 3451US5821606ASemiconductor deviceHITACHI LTD·Filed 1997·Granted Oct 13, 1998·9 cites·45 claims
- 3550US5863817ASemiconductor deviceHITACHI LTD·Filed 1998·Granted Jan 26, 1999·7 cites·23 claims
- 3648US6946327B2Semiconductor device and manufacturing method of thatRENESAS TECH CORP·Filed 2004·Granted Sep 20, 2005·2 cites·7 claims
- 3747US7812439B2Semiconductor package with reduced length interconnect and manufacturing method thereofELPIDA MEMORY INC·Filed 2008·Granted Oct 12, 2010·0 cites·12 claims
- 3846US7378333B2Semiconductor device and manufacturing method thereofRENESAS TECH CORP·Filed 2005·Granted May 27, 2008·0 cites·19 claims
- 3944US6919622B2Semiconductor deviceRENESAS TECH CORP·Filed 2004·Granted Jul 19, 2005·0 cites·6 claims
- 4041US6204552B1Semiconductor deviceHITACHI LTD·Filed 2000·Granted Mar 20, 2001·0 cites·15 claims
- 4137US6124629ASemiconductor device including a resin sealing member which exposes the rear surface of the sealed semiconductor chipHITACHI LTD·Filed 1998·Granted Sep 26, 2000·3 cites·9 claims
- 4235US4974054AResin molded semiconductor deviceHITACHI LTD·Filed 1989·Granted Nov 27, 1990·6 cites·11 claims
- 4332US6100115ASemiconductor deviceHITACHI LTD·Filed 1998·Granted Aug 8, 2000·1 cites·9 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →