Inventor · disambiguated record
Koji Hosokawa
Also filed as: HOSOKAWA KOJI
14 granted patents·7 pending applications·152 citations·filing 1996–2022
91Inventor score
Top patents by PatentIndex Score
21 records- 0189US7633147B2Semiconductor unit having two device terminals for every one input/output signalELPIDA MEMORY INC·Filed 2003·Granted Dec 15, 2009·60 cites·10 claims
- 0289US7046475B2Apparatus and method for controlling head unload operation in disk driveTOSHIBA KK·Filed 2004·Granted May 16, 2006·31 cites·12 claims
- 0382US10431556B2Semiconductor device including semiconductor chips mounted over both surfaces of substrateMICRON TECHNOLOGY INC·Filed 2017·Granted Oct 1, 2019·3 cites·23 claims
- 0479US9418968B2Semiconductor device including semiconductor chips mounted over both surfaces of substrateMICRON TECHNOLOGY INC·Filed 2015·Granted Aug 16, 2016·3 cites·20 claims
- 0578US8164186B2BGA semiconductor device having a dummy bumpWATANABE YUJI·Filed 2005·Granted Apr 24, 2012·8 cites·5 claims
- 0677US8222737B2BGA semiconductor device having a dummy bumpWATANABE YUJI·Filed 2010·Granted Jul 17, 2012·4 cites·7 claims
- 0773US8873247B2Device and manufacturing method of the sameHOSOKAWA KOJI·Filed 2011·Granted Oct 28, 2014·5 cites·17 claims
- 0872US9574159B2Grease composition for image forming apparatus and image forming apparatus with grease compositionKYODO YUSHI·Filed 2014·Granted Feb 21, 2017·1 cites·6 claims
- 0971US7659623B2Semiconductor device having improved wiringELPIDA MEMORY INC·Filed 2006·Granted Feb 9, 2010·5 cites·21 claims
- 1069US5732042ADram array with local latchesIBM·Filed 1996·Granted Mar 24, 1998·30 cites·14 claims
- 1166US9799611B2Semiconductor device including semiconductor chips mounted over both surfaces of substrateMICRON TECHNOLOGY INC·Filed 2016·Granted Oct 24, 2017·1 cites·20 claims
- 1261US9748204B2Semiconductor device including semiconductor chips stacked over substrateMICRON TECHNOLOGY INC·Filed 2015·Granted Aug 29, 2017·1 cites·18 claims
- 1352US11847238B2Image reading apparatus and method of transmitting scan data including password-protectable scan dataTOSHIBA TEC KK·Filed 2022·Granted Dec 19, 2023·0 cites·12 claims
- 1444US2016079207A1Semiconductor device and method for manufacturing samePS4 LUXCO SARL·Filed 2014·Application pending·0 cites
- 1543US2007262437A1Semiconductor device with temperature cycle life improvedELPIDA MEMORY INC·Filed 2007·Application pending·0 cites
- 1641US2014008775A1Semiconductor deviceELPIDA MEMORY INC·Filed 2013·Application pending·0 cites
- 1740US2019098162A1Controlling an image forming apparatusTOSHIBA KK·Filed 2017·Application pending·0 cites
- 1837US7573128B2Semiconductor module in which a semiconductor package is bonded on a mount substrateHITACHI LTD·Filed 2004·Granted Aug 11, 2009·0 cites·6 claims
- 1937US2013137217A1Method of manufacturing semiconductor deviceELPIDA MEMORY INC·Filed 2012·Application pending·0 cites
- 2034US2011134558A1Disk device, head distance calculation method, and offset control methodTOSHIBA KK·Filed 2010·Application pending·0 cites
- 2133US2010224988A1Semiconductor package substrate, semiconductor package using the substrate, and method of manufacturing semiconductor package substrateELPIDA MEMORY INC·Filed 2010·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →