Inventor · disambiguated record
Toshiaki Hibino
Also filed as: HIBINO TOSHIAKI
4 granted patents·20 citations·filing 2012–2018
68Inventor score
Top patents by PatentIndex Score
4 records- 0187US9420708B2Method for manufacturing multilayer printed wiring boardHIBINO TOSHIAKI·Filed 2012·Granted Aug 16, 2016·16 cites·20 claims
- 0266US9451711B2Printed wiring board and method for manufacturing printed wiring boardIBIDEN CO LTD·Filed 2014·Granted Sep 20, 2016·2 cites·23 claims
- 0366US8931168B2Method for manufacturing multilayer printed wiring boardHIBINO TOSHIAKI·Filed 2012·Granted Jan 13, 2015·2 cites·20 claims
- 0437US10420214B2Printed wiring boardIBIDEN CO LTD·Filed 2018·Granted Sep 17, 2019·0 cites·20 claims
Join the waitlist — get patent alerts
Get an alert when Toshiaki Hibino files or is granted a new patent.
We store only your email — no account needed. See our privacy policy.
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →