Inventor · disambiguated record
Masataka Mizukoshi
Also filed as: MIZUKOSHI MASATAKA
64 granted patents·12 pending applications·1,934 citations·filing 1984–2015
99Inventor score
Top patents by PatentIndex Score
76 records- 0195US6344407B1Method of manufacturing solder bumps and solder joints using formic acidFUJITSU LTD·Filed 2000·Granted Feb 5, 2002·75 cites·25 claims
- 0295US5643831AProcess for forming solder balls on a plate having apertures using solder paste and transferring the solder balls to semiconductor deviceFUJITSU LTD·Filed 1995·Granted Jul 1, 1997·231 cites·13 claims
- 0394US7670940B2Plating method, semiconductor device fabrication method and circuit board fabrication methodFUJITSU LTD·Filed 2005·Granted Mar 2, 2010·26 cites·11 claims
- 0494US6580169B2Method for forming bumps, semiconductor device, and solder pasteFUJITSU LTD·Filed 2002·Granted Jun 17, 2003·52 cites·9 claims
- 0593US7884459B2Semiconductor device suitable for a stacked structureFUJITSU SEMICONDUCTOR LTD·Filed 2008·Granted Feb 8, 2011·23 cites·9 claims
- 0693US7863524B2Interposer and method for manufacturing the sameFUJITSU LTD·Filed 2007·Granted Jan 4, 2011·24 cites·12 claims
- 0793US5801439ASemiconductor device and semiconductor device unit for a stack arrangementFUJITSU LTD·Filed 1997·Granted Sep 1, 1998·168 cites·20 claims
- 0892US7355290B2Interposer and method for fabricating the sameFUJITSU LTD·Filed 2006·Granted Apr 8, 2008·20 cites·9 claims
- 0992US6229320B1IC socket, a test method using the same and an IC socket mounting mechanismFUJITSU LTD·Filed 1997·Granted May 8, 2001·82 cites·22 claims
- 1090US6518163B2Method for forming bumps, semiconductor device, and solder pasteFUJITSU LTD·Filed 2000·Granted Feb 11, 2003·36 cites·34 claims
- 1190US5578525ASemiconductor device and a fabrication process thereofFUJITSU LTD·Filed 1996·Granted Nov 26, 1996·102 cites·7 claims
- 1290US5297006AThree-dimensional multi-chip moduleFUJITSU LTD·Filed 1992·Granted Mar 22, 1994·116 cites·18 claims
- 1389US6535002B2IC socket, a test method using the same and an IC socket mounting mechanismFUJITSU LTD·Filed 2001·Granted Mar 18, 2003·36 cites·8 claims
- 1488US7935573B2Electronic device and method for fabricating the sameFUJITSU LTD·Filed 2009·Granted May 3, 2011·13 cites·14 claims
- 1587US6347037B2Semiconductor device and method of forming the sameFUJITSU LTD·Filed 1998·Granted Feb 12, 2002·99 cites·14 claims
- 1686US8216934B2Semiconductor device suitable for a stacked structureYOSHIDA EIJI·Filed 2010·Granted Jul 10, 2012·7 cites·12 claims
- 1786US7846852B2Method for manufacturing capacitor embedded in interposerFUJITSU LTD·Filed 2010·Granted Dec 7, 2010·6 cites·3 claims
- 1886US6025258AMethod for fabricating solder bumps by forming solder balls with a solder ball forming memberFUJITSU LTD·Filed 1995·Granted Feb 15, 2000·94 cites·41 claims
- 1985US7514295B2Method for processing a base that includes connecting a first base to a second base with an insulating filmFUJITSU LTD·Filed 2005·Granted Apr 7, 2009·12 cites·10 claims
- 2085US6732911B2Solder jointing system, solder jointing method, semiconductor device manufacturing method, and semiconductor device manufacturing systemFUJITSU LTD·Filed 2001·Granted May 11, 2004·35 cites·39 claims
- 2184US7633148B2Semiconductor device with semiconductor chips mounted on mounting board via conductive anaotubesFUJITSU LTD·Filed 2007·Granted Dec 15, 2009·13 cites·10 claims
- 2283US8704106B2Ferroelectric component and manufacturing the sameMIZUKOSHI MASATAKA·Filed 2011·Granted Apr 22, 2014·8 cites·9 claims
- 2383US7745924B2Capacitor embedded in interposer, semiconductor device including the same, and method for manufacturing capacitor embedded in interposerFUJITSU LTD·Filed 2008·Granted Jun 29, 2010·8 cites·15 claims
- 2483US7614142B2Method for fabricating an interposerFUJITSU LTD·Filed 2008·Granted Nov 10, 2009·11 cites·12 claims
- 2583US6184133B1Method of forming an assembly board with insulator filled through holesFUJITSU LTD·Filed 2000·Granted Feb 6, 2001·26 cites·7 claims
- 2682US6063640ASemiconductor wafer testing method with probe pin contactFUJITSU LTD·Filed 1998·Granted May 16, 2000·68 cites·31 claims
- 2782US5760471ASemiconductor device having an inner lead extending over a central portion of a semiconductor device sealed in a plastic package and an outer lead exposed to the outside of a side face of the plastic packageFUJITSU LTD·Filed 1997·Granted Jun 2, 1998·71 cites·12 claims
- 2882US5521435ASemiconductor device and a fabrication process thereofFUJITSU LTD·Filed 1994·Granted May 28, 1996·63 cites·12 claims
- 2981US5831441ATest board for testing a semiconductor device, method of testing the semiconductor device, contact device, test method using the contact device, and test jig for testing the semiconductor deviceFUJITSU LTD·Filed 1996·Granted Nov 3, 1998·58 cites·2 claims
- 3079US8479386B2Method for manufacturing interposerSHIOGA TAKESHI·Filed 2010·Granted Jul 9, 2013·5 cites·4 claims
- 3177US7485962B2Semiconductor device, wiring substrate forming method, and substrate processing apparatusFUJITSU LTD·Filed 2005·Granted Feb 3, 2009·4 cites·15 claims
- 3277US6319810B1Method for forming solder bumpsFUJITSU LTD·Filed 1996·Granted Nov 20, 2001·55 cites·6 claims
- 3376US8915418B2Electronic component bonding methodALPHA DESIGN CO LTD·Filed 2014·Granted Dec 23, 2014·5 cites·13 claims
- 3476US6528346B2Bump-forming method using two plates and electronic deviceFUJITSU LTD·Filed 2000·Granted Mar 4, 2003·24 cites·3 claims
- 3575US7432114B2Semiconductor device manufacturing methodFUJITSU LTD·Filed 2006·Granted Oct 7, 2008·6 cites·12 claims
- 3673US4618879ASemiconductor device having adjacent bonding wires extending at different anglesFUJITSU LTD·Filed 1984·Granted Oct 21, 1986·42 cites·8 claims
- 3772US7830009B2Semiconductor package and method of manufacturing the sameFUJITSU LTD·Filed 2007·Granted Nov 9, 2010·4 cites·17 claims
- 3871US7816180B2Method for processing a base that includes connecting a first base to a second baseFUJITSU LTD·Filed 2009·Granted Oct 19, 2010·4 cites·17 claims
- 3971US7778009B2Thin-film capacitor and method of manufacturing the sameFUJITSU LTD·Filed 2007·Granted Aug 17, 2010·6 cites·10 claims
- 4070US6090301AMethod for fabricating bump forming plate memberFUJITSU LTD·Filed 1997·Granted Jul 18, 2000·37 cites·5 claims
- 4169US6893681B2Surface conductive resin, a coaxial cable, a wiring board, and process for manufacturing the sameFUJITSU LTD·Filed 2002·Granted May 17, 2005·10 cites·22 claims
- 4268US8293577B2Semiconductor package and method of manufacturing the sameAWANO YUJI·Filed 2010·Granted Oct 23, 2012·2 cites·4 claims
- 4368US7402461B2Method of connecting base materialsFUJITSU LTD·Filed 2004·Granted Jul 22, 2008·14 cites·12 claims
- 4466US6896998B2Pattern forming methodFUJITSU LTD·Filed 2002·Granted May 24, 2005·12 cites·14 claims
- 4565US7049229B2Method of fabricating semiconductor device and semiconductor deviceFUJITSU LTD·Filed 2004·Granted May 23, 2006·12 cites·36 claims
- 4664US7811835B2Method for processing a base that includes connecting a first base to a second base with an insulating filmFUJITSU LTD·Filed 2009·Granted Oct 12, 2010·2 cites·7 claims
- 4764US5729435ASemiconductor device and assembly board having through-holes filled with filling coreFUJITSU LTD·Filed 1997·Granted Mar 17, 1998·22 cites·6 claims
- 4862US5937277ASemiconductor device with reliable electrodes of projecting shape and method of forming sameFUJITSU LTD·Filed 1997·Granted Aug 10, 1999·18 cites·7 claims
- 4961US6979644B2Method of manufacturing electronic circuit componentFUJITSU LTD·Filed 2003·Granted Dec 27, 2005·8 cites·10 claims
- 5059US8735274B2Manufacture method for semiconductor device with bristled conductive nanotubesMIZUKOSHI MASATAKA·Filed 2010·Granted May 27, 2014·1 cites·6 claims
Showing the top 50 of 76 patent records by PatentIndex Score.
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →