Inventor · disambiguated record
Karl Weidner
Also filed as: WEIDNER KARL
50 granted patents·13 pending applications·343 citations·filing 1991–2023
98Inventor score
Files withSIEMENS AG14OSRAM OPTO SEMICONDUCTORS GMBH13WEIDNER KARL12EPCOS AG3ADOLF WUERTH GMBH & CO KG2
Top patents by PatentIndex Score
63 records- 0195US8723192B2Method for producing an optoelectronic semiconductor component and optoelectronic semiconductor componentWEIDNER KARL·Filed 2010·Granted May 13, 2014·19 cites·6 claims
- 0289US6504104B2Flexible wiring for the transformation of a substrate with edge contacts into a ball grid arraySIEMENS AG·Filed 2001·Granted Jan 7, 2003·67 cites·9 claims
- 0388US9484508B2Optoelectronic semiconductor componentOSRAM OPTO SEMICONDUCTORS GMBH·Filed 2013·Granted Nov 1, 2016·7 cites·10 claims
- 0488US8901592B2Optoelectronic component and method for producing itWEIDNER KARL·Filed 2011·Granted Dec 2, 2014·11 cites·16 claims
- 0585US12002901B2Optoelectronic semiconductor componentOSRAM OPTO SEMICONDUCTORS GMBH·Filed 2023·Granted Jun 4, 2024·0 cites·16 claims
- 0685US7897881B2Arrangement for hermetically sealing components, and method for the production thereofSIEMENS AG·Filed 2006·Granted Mar 1, 2011·14 cites·41 claims
- 0783US9159889B2Radiation-emitting component and method for producing radiation-emitting componentsWEIDNER KARL·Filed 2011·Granted Oct 13, 2015·7 cites·6 claims
- 0883US7524775B2Method for producing a dielectric layer for an electronic componentINFINEON TECHNOLOGIES AG·Filed 2006·Granted Apr 28, 2009·9 cites·23 claims
- 0982US9653670B2Method for producing an optoelectronic semiconductor component, and optoelectronic semiconductor componentOSRAM OPTO SEMICONDUCTORS GMBH·Filed 2013·Granted May 16, 2017·6 cites·20 claims
- 1082US9490396B2Optoelectronic semiconductor componentOSRAM OPTO SEMICONDUCTORS GMBH·Filed 2015·Granted Nov 8, 2016·2 cites·14 claims
- 1178US11749776B2Optoelectronic semiconductor componentOSRAM OPTO SEMICONDUCTORS GMBH·Filed 2021·Granted Sep 5, 2023·0 cites·17 claims
- 1278US9985171B2Optoelectronic semiconductor componentOSRAM OPTO SEMICONDUCTORS GMBH·Filed 2017·Granted May 29, 2018·1 cites·14 claims
- 1378US9209328B2Optoelectronic semiconductor componentOSRAM OPTO SEMICONDUCTORS GMBH·Filed 2014·Granted Dec 8, 2015·2 cites·15 claims
- 1473US11239386B2Optoelectronic semiconductor componentOSRAM OPTO SEMICONDUCTORS GMBH·Filed 2020·Granted Feb 1, 2022·0 cites·10 claims
- 1573US7208347B2Connection technology for power semiconductors comprising a layer of electrically insulating material that follows the surface contoursSIEMENS AG·Filed 2004·Granted Apr 24, 2007·18 cites·16 claims
- 1673US6555758B1Multiple blank for electronic components such as SAW components, and method of building up bumps, solder frames, spacers and the likeEPCOS AG·Filed 2000·Granted Apr 29, 2003·20 cites·6 claims
- 1770US7859005B2Method for the production of a semiconductor component comprising a planar contact, and semiconductor componentOSRAM OPTO SEMICONDUCTORS GMBH·Filed 2006·Granted Dec 28, 2010·4 cites·20 claims
- 1869US9105771B2Method for producing at least one optoelectronic semiconductor componentWEIDNER KARL·Filed 2011·Granted Aug 11, 2015·3 cites·12 claims
- 1967US7402457B2Method for making contact with electrical contact with electrical contact surfaces of substrate and device with substrate having electrical contact surfacesSIEMENS AG·Filed 2002·Granted Jul 22, 2008·18 cites·16 claims
- 2067US6685168B1Surface acoustic wave componentEPCOS AG·Filed 1999·Granted Feb 3, 2004·21 cites·7 claims
- 2166US10665747B2Optoelectronic semiconductor componentOSRAM OPTO SEMICONDUCTORS GMBH·Filed 2018·Granted May 26, 2020·0 cites·8 claims
- 2266US5438523AApparatus for storing and delivering sale unitsADOLF WUERTH GMBH & CO KG·Filed 1994·Granted Aug 1, 1995·55 cites·23 claims
- 2363US8513682B2Optoelectronic component and production method for an optoelectronic componentWEGLEITER WALTER·Filed 2008·Granted Aug 20, 2013·3 cites·20 claims
- 2462US8461604B2Optoelectronic module having a carrier substrate and a plurality of radiation-emitting semiconductor componentsBRAUNE BERT·Filed 2009·Granted Jun 11, 2013·2 cites·9 claims
- 2560US11239170B2Stacked modulesSNAPTRACK INC·Filed 2016·Granted Feb 1, 2022·1 cites·10 claims
- 2660US9728683B2Optoelectronic semiconductor componentOSRAM OPTO SEMICONDUCTORS GMBH·Filed 2016·Granted Aug 8, 2017·0 cites·19 claims
- 2760US7368324B2Method of manufacturing self-supporting contacting structuresSIEMENS AG·Filed 2004·Granted May 6, 2008·10 cites·21 claims
- 2856US9419193B2Optoelectronic component and method for producing an opto-electronic componentBARCHMANN BERND·Filed 2010·Granted Aug 16, 2016·1 cites·19 claims
- 2955US7427532B2Method of manufacturing a device having a contacting structureSIEMENS AG·Filed 2004·Granted Sep 23, 2008·7 cites·20 claims
- 3054US7759754B2Economical miniaturized assembly and connection technology for LEDs and other optoelectronic modulesOSRAM OPTO SEMICONDUCTORS GMBH·Filed 2004·Granted Jul 20, 2010·6 cites·19 claims
- 3151US8570748B2Planar electrical power electronic modules for high-temperature applications, and corresponding production methodsLUPP FRIEDRICH·Filed 2009·Granted Oct 29, 2013·1 cites·12 claims
- 3248US9331010B2System support for electronic components and method for production thereofPAHL WOLFGANG·Filed 2009·Granted May 3, 2016·0 cites·21 claims
- 3348US7855451B2Device having a contacting structureSIEMENS AG·Filed 2007·Granted Dec 21, 2010·0 cites·13 claims
- 3448US2014030829A1Optoelectronic Module Having a Carrier Substrate and a Plurality of Radiation-Emitting Semiconductor Components and Method for the Production ThereofBRAUNE BERT·Filed 2013·Application pending·0 cites
- 3546US9972759B2Optoelectronic semiconductor device having contact track with relieved thermo-mechanical stressOSRAM OPTO SEMICONDUCTORS GMBH·Filed 2014·Granted May 15, 2018·0 cites·19 claims
- 3645US8846456B2Method and apparatus for manufacturing an electronic module, and electronic moduleWEIDNER KARL·Filed 2007·Granted Sep 30, 2014·0 cites·21 claims
- 3745US2010133577A1Method for producing electronic component and electronic componentHOFFMANN WERNER·Filed 2008·Application pending·0 cites
- 3844US9506831B2Micromechanical measuring element and method for producing a micromechanical measuring elementEPCOS AG·Filed 2013·Granted Nov 29, 2016·0 cites·15 claims
- 3943US7910470B2Metallised film for sheet contactingSIEMENS AG·Filed 2005·Granted Mar 22, 2011·0 cites·19 claims
- 4043US6256877B1Method for transforming a substrate with edge contacts into a ball grid arraySIEMENS AG·Filed 1998·Granted Jul 10, 2001·11 cites·5 claims
- 4143US5321625AApparatus for storing and delivering sale unitsADOLF WUERTH GMBH & CO KG·Filed 1991·Granted Jun 14, 1994·16 cites·14 claims
- 4242US2009109024A1Hardware Protection System For Deep-Drawn Printed Circuit Boards, As Half-ShellsWEIDNER KARL·Filed 2005·Application pending·0 cites
- 4341US9170226B2Micromechanical substrate for a diaphragm with a diffusion barrier layerFLEISCHER MAXIMILIAN·Filed 2011·Granted Oct 27, 2015·0 cites·10 claims
- 4441US8809180B2Producing SiC packs on a wafer planeWEIDNER KARL·Filed 2005·Granted Aug 19, 2014·0 cites·6 claims
- 4541US7807931B2Electrical component on a substrate and method for production thereofSIEMENS AG·Filed 2004·Granted Oct 5, 2010·1 cites·4 claims
- 4638US2013193470A1Optoelectronic Component and Method for Producing an Optoelectronic ComponentWEIDNER KARL·Filed 2011·Application pending·0 cites
- 4738US2008191360A1Adhesive Strip Conductor on an Insulating LayerWEIDNER KARL·Filed 2005·Application pending·0 cites
- 4837US8847247B2Optoelectronic module comprising at least one first semiconductor body having a radiation outlet side and an insulation layer and method for the production thereofWEIDNER KARL·Filed 2010·Granted Sep 30, 2014·0 cites·10 claims
- 4937US8591689B2Method for selectively producing film laminates for packaging and for insulating unpackaged electronic components and functional patterns and corresponding deviceNAUNDORF JOERG·Filed 2006·Granted Nov 26, 2013·0 cites·16 claims
- 5037US8395257B2Electronic module and method for producing an electric functional layer on a substrate by blowing powder particles of an electrically conductive materialHOLST JENS-CHRISTIAN·Filed 2007·Granted Mar 12, 2013·0 cites·24 claims
Showing the top 50 of 63 patent records by PatentIndex Score.
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