Inventor · disambiguated record
Paul J. Fischer
Also filed as: FISCHER PAUL · FISCHER PAUL J · FISCHER PAUL JAMES
21 granted patents·2 pending applications·1,312 citations·filing 1989–2025
97Inventor score
Top patents by PatentIndex Score
23 records- 0196US6544638B2Electronic chip packageGORE ENTERPRISE HOLDINGS INC·Filed 2001·Granted Apr 8, 2003·129 cites·12 claims
- 0293US6015722AMethod for assembling an integrated circuit chip package having an underfill material between a chip and a substrateGORE ENTERPRISE HOLDINGS INC·Filed 1999·Granted Jan 18, 2000·143 cites·2 claims
- 0393US4996097AHigh capacitance laminatesGORE & ASS·Filed 1989·Granted Feb 26, 1991·86 cites·7 claims
- 0492US5786270AMethod of forming raised metallic contacts on electrical circuits for permanent bondingGORE & ASS·Filed 1996·Granted Jul 28, 1998·88 cites·7 claims
- 0590US5919329AMethod for assembling an integrated circuit chip package having at least one semiconductor deviceGORE ENTERPRISE HOLDINGS INC·Filed 1998·Granted Jul 6, 1999·102 cites·1 claims
- 0689US5034801AIntergrated circuit element having a planar, solvent-free dielectric layerGORE & ASS·Filed 1989·Granted Jul 23, 1991·85 cites·17 claims
- 0786US5847327ADimensionally stable core for use in high density chip packagesGORE & ASS·Filed 1996·Granted Dec 8, 1998·77 cites·9 claims
- 0885US6143401AElectronic chip packageGORE & ASS·Filed 1998·Granted Nov 7, 2000·69 cites·11 claims
- 0984US6011697AConstraining ring for use in electronic packagingGORE & ASS·Filed 1998·Granted Jan 4, 2000·43 cites·17 claims
- 1082US5868887AMethod for minimizing warp and die stress in the production of an electronic assemblyGORE & ASS·Filed 1996·Granted Feb 9, 1999·61 cites·9 claims
- 1182US5747358AMethod of forming raised metallic contacts on electrical circuitsGORE & ASS·Filed 1996·Granted May 5, 1998·46 cites·6 claims
- 1281US6344371B2Dimensionally stable core for use in high density chip packages and a method of fabricating sameGORE & ASS·Filed 1998·Granted Feb 5, 2002·57 cites·11 claims
- 1380US5525834AIntegrated circuit packageGORE & ASS·Filed 1994·Granted Jun 11, 1996·68 cites·26 claims
- 1478US5970319AMethod for assembling an integrated circuit chip package having at least one semiconductor deviceGORE ENTERPRISE HOLDINGS INC·Filed 1999·Granted Oct 19, 1999·46 cites·2 claims
- 1577US6027590AMethod for minimizing warp and die stress in the production of an electronic assemblyGORE & ASS·Filed 1998·Granted Feb 22, 2000·44 cites·12 claims
- 1677US5473119AStress-resistant circuit boardGORE & ASS·Filed 1994·Granted Dec 5, 1995·60 cites·8 claims
- 1776US6184589B1Constraining ring for use in electronic packagingFiled 1998·Granted Feb 6, 2001·39 cites·7 claims
- 1873US5701032AIntegrated circuit packageGORE & ASS·Filed 1995·Granted Dec 23, 1997·48 cites·3 claims
- 1959US2025195726A1Epithelializing microporous biomaterial for use in avascular environments and in corneal implantsGORE & ASS·Filed 2025·Application pending·0 cites
- 2058US12257368B2Epithelializing microporous biomaterial for use in avascular environments and in corneal implantsGORE & ASS·Filed 2019·Granted Mar 25, 2025·0 cites·20 claims
- 2149US5879786AConstraining ring for use in electronic packagingGORE & ASS·Filed 1996·Granted Mar 9, 1999·11 cites·6 claims
- 2242US5976974AMethod of forming redundant signal traces and corresponding electronic componentsGORE & ASS·Filed 1997·Granted Nov 2, 1999·10 cites·7 claims
- 2331US2008255663A1Artificial Cornea and Method of Making SameAKPEK ESEN K·Filed 2007·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →