Inventor · disambiguated record
Youhai Zhang
Also filed as: ZHANG YOUHAI
3 granted patents·2 pending applications·2 citations·filing 2013–2014
49Inventor score
Top patents by PatentIndex Score
5 records- 0151US9627303B2Etching-before-packaging three-dimensional system-level metal circuit board structure inversely provided with chip, and technological methodJIANGSU CHANGJIANG ELECTRONICS TECH CO LTD·Filed 2013·Granted Apr 18, 2017·1 cites·20 claims
- 0250US9640413B2Etching-before-packaging horizontal chip 3D system-level metal circuit board structure and technique thereofJIANGSU CHANGJIANG ELECTRONICS TECH CO LTD·Filed 2013·Granted May 2, 2017·1 cites·19 claims
- 0333US9633985B2First-etched and later-packaged three-dimensional system-in-package normal chip stack package structure and processing method thereofJIANGSU CHANGJIANG ELECTRONICS TECH CO LTD·Filed 2014·Granted Apr 25, 2017·0 cites·10 claims
- 0433US2016141233A1First-packaged and later-etched normal chip three dimension system-in-package metal circuit board structure and processing method thereofJIANGSU CHANGJIANG ELECTRONICS·Filed 2014·Application pending·0 cites
- 0533US2016163622A1Packaging-before-etching flip chip 3d system-level metal circuit board structure and technique thereofJIANGSU CHANGJIANG ELECTRONICS·Filed 2013·Application pending·0 cites
Join the waitlist — get patent alerts
Get an alert when Youhai Zhang files or is granted a new patent.
We store only your email — no account needed. See our privacy policy.
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →