Inventor · disambiguated record
Yoshihiro Bessho
Also filed as: BESSHO YOSHIHIRO
51 granted patents·3 pending applications·2,890 citations·filing 1988–2004
99Inventor score
Files withMATSUSHITA ELECTRIC INDUSTRIAL CO LTD52
Top patents by PatentIndex Score
54 records- 0196US7134198B2Method for manufacturing electric element built-in module with sealed electric elementMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 2003·Granted Nov 14, 2006·113 cites·22 claims
- 0296US6756663B2Semiconductor device including wiring board with three dimensional wiring patternMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 2003·Granted Jun 29, 2004·91 cites·23 claims
- 0396US6525414B2Semiconductor device including a wiring board and semiconductor elements mounted thereonMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 2000·Granted Feb 25, 2003·88 cites·21 claims
- 0496US5920142AElectronic part and a method of production thereofMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 1997·Granted Jul 6, 1999·206 cites·48 claims
- 0595US6372548B2Method for fabricating a semiconductor package with a semiconductor device attached to a multilayered substrateMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 1999·Granted Apr 16, 2002·170 cites·16 claims
- 0695US5090119AMethod of forming an electrical contact bumpMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 1990·Granted Feb 25, 1992·178 cites·6 claims
- 0795US5014111AElectrical contact bump and a package provided with the sameMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 1988·Granted May 7, 1991·138 cites·24 claims
- 0894US6798121B2Module with built-in electronic elements and method of manufacture thereofMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 2001·Granted Sep 28, 2004·80 cites·15 claims
- 0993US5641996ASemiconductor unit package, semiconductor unit packaging method, and encapsulant for use in semiconductor unit packagingMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 1996·Granted Jun 24, 1997·190 cites·29 claims
- 1093US5485949ACapillary for a wire bonding apparatus and a method for forming an electric connection bump using the capillaryMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 1994·Granted Jan 23, 1996·159 cites·19 claims
- 1192US6229209B1Chip carrierMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 1996·Granted May 8, 2001·112 cites·35 claims
- 1292US6088236ASemiconductor device having a bump having a rugged sideMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 1997·Granted Jul 11, 2000·125 cites·14 claims
- 1390US6774316B1Wiring board and production method thereofMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 2000·Granted Aug 10, 2004·50 cites·27 claims
- 1490US6518514B2Circuit board and production of the sameMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 2001·Granted Feb 11, 2003·48 cites·17 claims
- 1590US5545589AMethod of forming a bump having a rugged side, a semiconductor device having the bump, and a method of mounting a semiconductor unit and a semiconductor deviceMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 1994·Granted Aug 13, 1996·101 cites·13 claims
- 1689US6710682B2Surface acoustic wave device, method for producing the same, and circuit module using the sameMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 2001·Granted Mar 23, 2004·43 cites·33 claims
- 1789US6154940AElectronic part and a method of production thereofMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 1998·Granted Dec 5, 2000·93 cites·62 claims
- 1888US6691409B2Method of producing a circuit boardMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 2002·Granted Feb 17, 2004·40 cites·9 claims
- 1988US5844320ASemiconductor unit with semiconductor device mounted with conductive adhesiveMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 1997·Granted Dec 1, 1998·78 cites·5 claims
- 2086US6300576B1Printed-circuit board having projection electrodes and method for producing the sameMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 1998·Granted Oct 9, 2001·74 cites·18 claims
- 2185US5640051AChip package, a chip carrier, a terminal electrode for a circuit substrate and a chip package-mounted complexMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 1994·Granted Jun 17, 1997·74 cites·31 claims
- 2284US6365499B1Chip carrier and method of manufacturing and mounting the sameMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 2000·Granted Apr 2, 2002·29 cites·11 claims
- 2381US5670826AMethod for mounting a semiconductor device on a circuit board using a conductive adhesive and a thermosetting resin, and a circuit board with a semiconductor device mounted thereon using the methodMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 1996·Granted Sep 23, 1997·55 cites·7 claims
- 2480US6103551ASemiconductor unit and method for manufacturing the sameMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 1997·Granted Aug 15, 2000·51 cites·2 claims
- 2577US5547530AMethod of manufacturing a ceramic substrateMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 1994·Granted Aug 20, 1996·46 cites·26 claims
- 2675US6694613B2Method for producing a printed-circuit board having projection electrodesMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 2001·Granted Feb 24, 2004·18 cites·18 claims
- 2775US5940679AMethod of checking electric circuits of semiconductor device and conductive adhesive for checking usageMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 1995·Granted Aug 17, 1999·49 cites·9 claims
- 2874US5628919AMethods for producing a chip carrier and terminal electrode for a circuit substrateMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 1995·Granted May 13, 1997·40 cites·12 claims
- 2972US6429382B1Electrical mounting structure having an elution preventive filmMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 2000·Granted Aug 6, 2002·16 cites·23 claims
- 3071US6372547B2Method for manufacturing electronic device with resin layer between chip carrier and circuit wiring boardMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 1998·Granted Apr 16, 2002·30 cites·8 claims
- 3171US5651179AMethod for mounting a semiconductor device on a circuit boardMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 1996·Granted Jul 29, 1997·34 cites·10 claims
- 3267US5496619AAssembly formed from conductive paste and insulating pasteMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 1994·Granted Mar 5, 1996·36 cites·4 claims
- 3366US5525402ACeramic substrate and manufacturing method thereofMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 1995·Granted Jun 11, 1996·27 cites·5 claims
- 3466US5503777AThixotropic conductive pasteMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 1994·Granted Apr 2, 1996·30 cites·4 claims
- 3565US6465082B1Stress relaxation electronic part, stress relaxation wiring board, and stress relaxation electronic part mounted bodyMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 1998·Granted Oct 15, 2002·31 cites·27 claims
- 3664US6376051B1Mounting structure for an electronic component and method for producing the sameMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 2000·Granted Apr 23, 2002·4 cites·18 claims
- 3764US6207550B1Method for fabricating bump electrodes with a leveling step for uniform heightsMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 1998·Granted Mar 27, 2001·30 cites·6 claims
- 3858US5688441AThixotropic conductive pasteMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 1995·Granted Nov 18, 1997·20 cites·7 claims
- 3957US6538315B2Semiconductor device and method of manufacturing sameMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 2000·Granted Mar 25, 2003·6 cites·20 claims
- 4056US6749889B2Method for producing mounting structure for an electronic componentMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 2003·Granted Jun 15, 2004·4 cites·9 claims
- 4153US6603207B2Electrode structure for semiconductor device, method for forming the same, mounted body including semiconductor device and semiconductor deviceMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 2002·Granted Aug 5, 2003·4 cites·17 claims
- 4253US6569512B2Mounting structure for an electronic component and method for producing the sameMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 2001·Granted May 27, 2003·3 cites·5 claims
- 4352US5407473AConductive inkMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 1993·Granted Apr 18, 1995·19 cites·5 claims
- 4451US6452280B1Flip chip semiconductor apparatus with projecting electrodes and method for producing sameMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 1997·Granted Sep 17, 2002·17 cites·18 claims
- 4551US2005017268A1Display apparatus and its manufacturing methodFiled 2002·Application pending·0 cites
- 4647US6369450B1Method of producing mounting structure and mounting structure produced by the sameMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 2000·Granted Apr 9, 2002·4 cites·6 claims
- 4745US6310393B1Electric circuit and package for semiconductorMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 1999·Granted Oct 30, 2001·12 cites·18 claims
- 4844US6818461B2Method of producing mounting structure and mounting structure produced by the sameMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 2002·Granted Nov 16, 2004·1 cites·19 claims
- 4944US5662755AMethod of making multi-layered ceramic substratesMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 1995·Granted Sep 2, 1997·12 cites·11 claims
- 5043US6488869B2Conductive paste, its manufacturing method, and printed wiring board using the sameMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 1998·Granted Dec 3, 2002·8 cites·24 claims
Showing the top 50 of 54 patent records by PatentIndex Score.
Join the waitlist — get patent alerts
Get an alert when Yoshihiro Bessho files or is granted a new patent.
We store only your email — no account needed. See our privacy policy.
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →