Inventor · disambiguated record
Tsukasa Shiraishi
Also filed as: SHIRAISHI TSUKASA
20 granted patents·10 pending applications·661 citations·filing 1997–2013
95Inventor score
Files withMATSUSHITA ELECTRIC INDUSTRIAL CO LTD17PANASONIC CORP6SHIRAISHI TSUKASA2HIRANO KOICHI1KAWAKAMI YUSUKE1
Top patents by PatentIndex Score
30 records- 0196US6756663B2Semiconductor device including wiring board with three dimensional wiring patternMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 2003·Granted Jun 29, 2004·91 cites·23 claims
- 0296US6525414B2Semiconductor device including a wiring board and semiconductor elements mounted thereonMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 2000·Granted Feb 25, 2003·88 cites·21 claims
- 0396US5920142AElectronic part and a method of production thereofMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 1997·Granted Jul 6, 1999·206 cites·48 claims
- 0489US6909180B2Semiconductor device, mounting circuit board, method of producing the same, and method of producing mounting structure using the sameMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 2001·Granted Jun 21, 2005·36 cites·16 claims
- 0589US6154940AElectronic part and a method of production thereofMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 1998·Granted Dec 5, 2000·93 cites·62 claims
- 0686US6300576B1Printed-circuit board having projection electrodes and method for producing the sameMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 1998·Granted Oct 9, 2001·74 cites·18 claims
- 0775US6694613B2Method for producing a printed-circuit board having projection electrodesMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 2001·Granted Feb 24, 2004·18 cites·18 claims
- 0874US9076752B2Semiconductor device and method for manufacturing the samePANASONIC CORP·Filed 2013·Granted Jul 7, 2015·4 cites·13 claims
- 0972US6429382B1Electrical mounting structure having an elution preventive filmMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 2000·Granted Aug 6, 2002·16 cites·23 claims
- 1070US7850803B2Method for connecting electronic components, method for forming bump and conductive connection film and fabrication apparatus for electronic component mounted body, bump and conductive correction filmPANASONIC CORP·Filed 2007·Granted Dec 14, 2010·3 cites·19 claims
- 1163US8822753B2Absorbent articleSHIRAISHI TSUKASA·Filed 2009·Granted Sep 2, 2014·5 cites·8 claims
- 1260US7649267B2Package equipped with semiconductor chip and method for producing samePANASONIC CORP·Filed 2006·Granted Jan 19, 2010·2 cites·13 claims
- 1358US7752749B2Electronic component mounting method and electronic component mounting devicePANASONIC CORP·Filed 2006·Granted Jul 13, 2010·2 cites·25 claims
- 1456US8353102B2Wiring board connection methodPANASONIC CORP·Filed 2008·Granted Jan 15, 2013·1 cites·12 claims
- 1554US7963310B2Method for connecting electronic components, method for forming bump and conductive connection film and fabrication apparatus for electronic component mounted body, bump and conductive connection filmPANASONIC CORP·Filed 2010·Granted Jun 21, 2011·0 cites·6 claims
- 1651US6452280B1Flip chip semiconductor apparatus with projecting electrodes and method for producing sameMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 1997·Granted Sep 17, 2002·17 cites·18 claims
- 1751US2010331801A1Absorbent articleKAWAKAMI YUSUKE·Filed 2008·Application pending·0 cites
- 1848US8063486B2Circuit board, method for manufacturing the same, and semiconductor deviceHIRANO KOICHI·Filed 2007·Granted Nov 22, 2011·0 cites·14 claims
- 1948US2008186045A1Test mark structure, substrate sheet laminate, multilayered circuit substrate, method for inspecting lamination matching precision of multilayered circuit substrate, and method for designing substrate sheet laminateMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 2008·Application pending·0 cites
- 2047US6369450B1Method of producing mounting structure and mounting structure produced by the sameMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 2000·Granted Apr 9, 2002·4 cites·6 claims
- 2144US6818461B2Method of producing mounting structure and mounting structure produced by the sameMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 2002·Granted Nov 16, 2004·1 cites·19 claims
- 2244US2005163982A1Circuit substrate for packaging semiconductor device, method for producing the same, and method for producing semiconductor device package structure using the sameFiled 2005·Application pending·0 cites
- 2343US2008298023A1Electronic component-containing module and manufacturing method thereofMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 2008·Application pending·0 cites
- 2443US2004212075A1Semiconductor device including a wiring board with a three-dimensional wiring patternFiled 2004·Application pending·0 cites
- 2542US2009085227A1Flip-chip mounting body and flip-chip mounting methodMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 2006·Application pending·0 cites
- 2641US2006087020A1Semiconductor device and method for producing the sameMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 2005·Application pending·0 cites
- 2741US2012029453A1Absorbent articleNODA YUKI·Filed 2010·Application pending·0 cites
- 2838US2001033032A1Manufacturing method for semiconductor device, mounting method of semiconductor device, semiconductor device, and inspecting method of semiconductor deviceMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 2001·Application pending·0 cites
- 2938US2008304237A1Electronic component built-in module and method for manufacturing the sameSHIRAISHI TSUKASA·Filed 2008·Application pending·0 cites
- 3030US6284640B1Manufacturing method for semiconductor device, mounting method of semiconductor device, semiconductor device, and inspecting method of semiconductor deviceMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 1999·Granted Sep 4, 2001·0 cites·21 claims
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