Inventor · disambiguated record
Takao Shibuya
Also filed as: SHIBUYA TAKAO
17 granted patents·2 pending applications·227 citations·filing 1991–2021
93Inventor score
Top patents by PatentIndex Score
19 records- 0189US6737285B2Semiconductor device manufacturing methodSANYO ELECTRIC CO·Filed 2001·Granted May 18, 2004·67 cites·6 claims
- 0285US6080602AMethod of producing a semiconductor device using a reduced mounting areaSANYO ELECTRIC CO·Filed 1998·Granted Jun 27, 2000·76 cites·11 claims
- 0376US11837400B2Electronic component surface-mountable on circuit boardTAIYO YUDEN KK·Filed 2020·Granted Dec 5, 2023·0 cites·11 claims
- 0472US10658098B2Electronic component surface-mountable on circuit boardTAIYO YUDEN KK·Filed 2019·Granted May 19, 2020·0 cites·16 claims
- 0572US6451628B1Method fabricating a semiconductor device with a decreased mounting areaSANYO ELECTRIC CO·Filed 2000·Granted Sep 17, 2002·17 cites·8 claims
- 0672US6309911B2Method of fabricating semiconductor deviceSANYO ELECTRIC CO·Filed 2001·Granted Oct 30, 2001·15 cites·7 claims
- 0769US10804016B2Electronic component surface-mountable on circuit boardTAIYO YUDEN KK·Filed 2020·Granted Oct 13, 2020·0 cites·19 claims
- 0869US10418162B2Electronic component surface-mountable on circuit boardTAIYO YUDEN KK·Filed 2018·Granted Sep 17, 2019·0 cites·15 claims
- 0966US10090089B2Electronic component surface-mountable on circuit boardTAIYO YUDEN KK·Filed 2017·Granted Oct 2, 2018·0 cites·12 claims
- 1061US6121168AWet type paper friction material with combined improved friction characteristics and compression fatigue strengthDYNAX CORP·Filed 1999·Granted Sep 19, 2000·23 cites·2 claims
- 1159US6368893B1Method of fabricating semiconductor deviceSANYO ELECTRIC CO·Filed 2000·Granted Apr 9, 2002·8 cites·5 claims
- 1254US6919624B2Semiconductor device with exposed electrodesKANTO SANYO SEMICONDUCTORS CO·Filed 2003·Granted Jul 19, 2005·6 cites·17 claims
- 1349US2021356318A1Vibration sensorTAIYO YUDEN KK·Filed 2021·Application pending·0 cites
- 1442US6197616B1Method of fabricating semiconductor deviceSANYO ELECTRIC CO·Filed 1999·Granted Mar 6, 2001·8 cites·6 claims
- 1539US6784523B2Method of fabricating semiconductor deviceSANYO ELECTRIC CO·Filed 2001·Granted Aug 31, 2004·0 cites·20 claims
- 1639US6511864B2Method of fabricating semiconductor deviceSANYO ELECTRIC CO·Filed 2001·Granted Jan 28, 2003·0 cites·8 claims
- 1737US6326232B1Method of fabricating semiconductor deviceSANYO ELECTRIC CO·Filed 1999·Granted Dec 4, 2001·6 cites·20 claims
- 1837US2002081769A1Method of fabricating semiconductor deviceFiled 2002·Application pending·0 cites
- 1925US5109966AMating plate in friction engagement deviceDYNAX CORP·Filed 1991·Granted May 5, 1992·1 cites·6 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →