Inventor · disambiguated record
Toshiaki Shinohara
Also filed as: SHINOHARA TOSHIAKI
50 granted patents·6 pending applications·914 citations·filing 1987–2020
98Inventor score
Files withMITSUBISHI ELECTRIC CORP31MATSUSHITA ELECTRIC INDUSTRIAL CO LTD10PANASONIC IP MAN CO LTD4TERUMO CORP3OTA TATSUO2
Top patents by PatentIndex Score
56 records- 0195US6421244B1Power moduleMITSUBISHI ELECTRIC CORP·Filed 2000·Granted Jul 16, 2002·117 cites·13 claims
- 0294US10612633B2Screw apparatusTHK CO LTD·Filed 2016·Granted Apr 7, 2020·7 cites·10 claims
- 0394US7656016B2Power semiconductor deviceMITSUBISHI ELECTRIC CORP·Filed 2005·Granted Feb 2, 2010·38 cites·16 claims
- 0493US6313520B1Resin-sealed power semiconductor device including substrate with all electronic components for control circuit mounted thereonMITSUBISHI ELECTRIC CORP·Filed 2000·Granted Nov 6, 2001·83 cites·10 claims
- 0592US10008240B2Case video processing apparatus, case video processing system, and case video processing methodPANASONIC IP MAN CO LTD·Filed 2016·Granted Jun 26, 2018·20 cites·5 claims
- 0691US6979909B2Semiconductor device and method of manufacturing sameMITSUBISHI ELECTRIC CORP·Filed 2001·Granted Dec 27, 2005·55 cites·7 claims
- 0791US6914321B2Semiconductor deviceMITSUBISHI ELECTRIC CORP·Filed 2001·Granted Jul 5, 2005·66 cites·5 claims
- 0889USD421969SSemiconductor deviceMITSUBISHI ELECTRIC CORP·Filed 1999·Granted Mar 28, 2000·36 cites·1 claims
- 0988US6791602B1Frame switcher and method of switching, digital camera and monitoring systemMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 2000·Granted Sep 14, 2004·43 cites·21 claims
- 1087US7045907B2Semiconductor device and method of manufacturing sameMITSUBISHI ELECTRIC CORP·Filed 2005·Granted May 16, 2006·13 cites·5 claims
- 1186US7848104B2Power moduleMITSUBISHI ELECTRIC CORP·Filed 2009·Granted Dec 7, 2010·14 cites·9 claims
- 1285US10026448B2Case video log data generating apparatus, case video processing system, and case video log data generating methodPANASONIC IP MAN CO LTD·Filed 2016·Granted Jul 17, 2018·7 cites·15 claims
- 1385US6787900B2Semiconductor module and insulating substrate thereofMITSUBISHI ELECTRIC CORP·Filed 2000·Granted Sep 7, 2004·43 cites·10 claims
- 1484USD418485SSemiconductor deviceMITSUBISHI ELECTRIC CORP·Filed 1999·Granted Jan 4, 2000·26 cites·1 claims
- 1583US9343388B2Power semiconductor deviceTERAI MAMORU·Filed 2012·Granted May 17, 2016·8 cites·10 claims
- 1678US10769448B2Surveillance system and surveillance methodPANASONIC I PRO SENSING SOLUTIONS CO LTD·Filed 2018·Granted Sep 8, 2020·4 cites·21 claims
- 1778US7642640B2Semiconductor device and manufacturing process thereofMITSUBISHI ELECTRIC CORP·Filed 2005·Granted Jan 5, 2010·8 cites·21 claims
- 1877US7742269B2Circuit breakerMITSUBISHI ELECTRIC CORP·Filed 2007·Granted Jun 22, 2010·8 cites·3 claims
- 1976US6084292ALead frame and semiconductor device using the lead frameMITSUBISHI ELECTRIC CORP·Filed 1998·Granted Jul 4, 2000·49 cites·16 claims
- 2075US6181009B1Electronic component with a lead frame and insulating coatingMITSUBISHI ELECTRIC CORP·Filed 1999·Granted Jan 30, 2001·28 cites·1 claims
- 2172USD428859SSemiconductor deviceMITSUBISHI ELECTRIC CORP·Filed 1999·Granted Aug 1, 2000·16 cites·1 claims
- 2271US6611892B1Network bus bridge and systemMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 2000·Granted Aug 26, 2003·18 cites·40 claims
- 2369US10318792B2Target pickup device and target detection methodPANASONIC IP MAN CO LTD·Filed 2015·Granted Jun 11, 2019·2 cites·12 claims
- 2469US8674492B2Power moduleOTA TATSUO·Filed 2013·Granted Mar 18, 2014·3 cites·5 claims
- 2566US8558367B2Semiconductor moduleOTA TATSUO·Filed 2012·Granted Oct 15, 2013·2 cites·5 claims
- 2665US6765285B2Power semiconductor device with high radiating efficiencyMITSUBISHI ELECTRIC CORP·Filed 2003·Granted Jul 20, 2004·12 cites·21 claims
- 2765US4942455ALead frame for a semiconductor device and a method for manufacturing a semiconductor device using the lead frameMITSUBISHI ELECTRIC CORP·Filed 1987·Granted Jul 17, 1990·26 cites·3 claims
- 2864US6707947B1Frame switcher and method of switching, digital camera, and monitoring systemMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 2000·Granted Mar 16, 2004·7 cites·23 claims
- 2962US6310395B1Electronic component with anodically bonded contactMITSUBISHI ELECTRIC CORP·Filed 2000·Granted Oct 30, 2001·6 cites·2 claims
- 3059US5606376ADifferential motion detection method using background imageMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 1995·Granted Feb 25, 1997·30 cites·5 claims
- 3157US6358778B1Semiconductor package comprising lead frame with punched parts for terminalsMITSUBISHI ELECTRIC CORP·Filed 1999·Granted Mar 19, 2002·34 cites·10 claims
- 3257US6087201AMethod of manufacturing ball grid array electronic componentMITSUBISHI ELECTRIC CORP·Filed 1999·Granted Jul 11, 2000·13 cites·1 claims
- 3357US5026669AMethod of eliminating burrs on a lead frame with a thin metal coatingMITSUBISHI ELECTRIC CORP·Filed 1989·Granted Jun 25, 1991·18 cites·3 claims
- 3455US5900671AElectronic component including conductor connected to electrode and anodically bonded to insulating coatingMITSUBISHI ELECTRIC CORP·Filed 1995·Granted May 4, 1999·12 cites·6 claims
- 3550US11992240B2Puncture systemTERUMO CORP·Filed 2020·Granted May 28, 2024·0 cites·19 claims
- 3650US2013341775A1Semiconductor moduleMITSUBISHI ELECTRIC CORP·Filed 2013·Application pending·0 cites
- 3749US6977677B1Imaging apparatus with video data transmissionMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 1999·Granted Dec 20, 2005·13 cites·15 claims
- 3848USRE38043ELead frameMITSUBISHI ELECTRIC CORP·Filed 2000·Granted Mar 25, 2003·2 cites·22 claims
- 3947US11264318B2Semiconductor device, method for manufacturing the same, and semiconductor moduleMITSUBISHI ELECTRIC CORP·Filed 2018·Granted Mar 1, 2022·0 cites·20 claims
- 4047US10573346B2Case video log data generating apparatus, case video processing system, and case video log data generating methodPANASONIC I PRO SENSING SOLUTIONS CO LTD·Filed 2018·Granted Feb 25, 2020·0 cites·8 claims
- 4146US7239663B2Image capture and transmission systemMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 2003·Granted Jul 3, 2007·0 cites·5 claims
- 4246US6268647B1Electronic component with an insulating coatingMITSUBISHI ELECTRIC CORP·Filed 1999·Granted Jul 31, 2001·7 cites·1 claims
- 4345US2014180325A1DilatorTERUMO CORP·Filed 2014·Application pending·0 cites
- 4442US7476966B2Semiconductor moduleMITSUBISHI ELECTRIC CORP·Filed 2006·Granted Jan 13, 2009·0 cites·11 claims
- 4540US5872394ALead frameMITSUBISHI ELECTRIC CORP·Filed 1996·Granted Feb 16, 1999·7 cites·22 claims
- 4639US2018182111A1Illumination system, illumination method, and programPANASONIC IP MAN CO LTD·Filed 2017·Application pending·0 cites
- 4739US2012080800A1Power module and method for manufacturing the sameSHINOHARA TOSHIAKI·Filed 2011·Application pending·0 cites
- 4837US10512532B2Therapeutic device for the treatment methods and inguinal herniaTERUMO CORP·Filed 2017·Granted Dec 24, 2019·0 cites·12 claims
- 4937US6133069AMethod of manufacturing the electronic using the anode junction methodMITSUBISHI ELECTRIC CORP·Filed 1999·Granted Oct 17, 2000·3 cites·1 claims
- 5037US2003042624A1Power semiconductor deviceMITSUBISHI ELECTRIC CORP·Filed 2002·Application pending·0 cites
Showing the top 50 of 56 patent records by PatentIndex Score.
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