Inventor · disambiguated record
Frederick G. Anderson
Also filed as: ANDERSON FREDERICK G · ANDERSON FREDERICK GUSTAV
10 granted patents·2 pending applications·59 citations·filing 2007–2023
87Inventor score
Top patents by PatentIndex Score
12 records- 0191US8492866B1Isolated Zener diodeANDERSON FREDERICK G·Filed 2012·Granted Jul 23, 2013·15 cites·23 claims
- 0290US7943445B2Asymmetric junction field effect transistorIBM·Filed 2009·Granted May 17, 2011·16 cites·10 claims
- 0385US9582621B2Modeling localized temperature changes on an integrated circuit chip using thermal potential theoryGLOBALFOUNDRIES INC·Filed 2015·Granted Feb 28, 2017·5 cites·5 claims
- 0483US8901710B2Interdigitated capacitors with a zero quadratic voltage coefficient of capacitance or zero linear temperature coefficient of capacitanceIBM·Filed 2013·Granted Dec 2, 2014·7 cites·20 claims
- 0582US8421181B2Schottky barrier diode with perimeter capacitance well junctionANDERSON FREDERICK G·Filed 2010·Granted Apr 16, 2013·8 cites·24 claims
- 0682US8169007B2Asymmetric junction field effect transistorANDERSON FREDERICK G·Filed 2011·Granted May 1, 2012·6 cites·15 claims
- 0758US9916415B2Integrated circuit performance modeling that includes substrate-generated signal distortionsGLOBALFOUNDRIES INC·Filed 2016·Granted Mar 13, 2018·1 cites·18 claims
- 0856US7692271B2Differential junction varactorIBM·Filed 2007·Granted Apr 6, 2010·1 cites·26 claims
- 0954US2024402486A1Signal propagation simulation tool including virtual optical probing and/or bidirectional simulationGLOBALFOUNDRIES US INC·Filed 2023·Application pending·0 cites
- 1051US8796108B2Isolated zener diode, an integrated circuit incorporating multiple instances of the zener diode, a method of forming the zener diode and a design structure for the zener diodeIBM·Filed 2013·Granted Aug 5, 2014·0 cites·19 claims
- 1147US9971859B2Modeling localized temperature changes on an integrated circuit chip using thermal potential theoryGLOBALFOUNDRIES INC·Filed 2017·Granted May 15, 2018·0 cites·20 claims
- 1243US2009251848A1Design structure for metal-insulator-metal capacitor using via as top plate and method for formingIBM·Filed 2008·Application pending·0 cites
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