Inventor · disambiguated record
Arun Malhotra
Also filed as: MALHOTRA ARUN · MALHOTRA ARUN K
23 granted patents·1 pending application·534 citations·filing 1986–2021
96Inventor score
Files withAIWA RES AND DEV INC11AIWA CO3RISST LTD3AIWA RESEARCH & DEV INC2EXEL MICROELECTRONICS INC1
Top patents by PatentIndex Score
24 records- 0192US6417109B1Chemical-mechanical etch (CME) method for patterned etching of a substrate surfaceAIWA CO·Filed 2000·Granted Jul 9, 2002·58 cites·22 claims
- 0291US6744550B2Two-dimensional micro-mirror array enhancementsXROS INC·Filed 2002·Granted Jun 1, 2004·48 cites·26 claims
- 0391US4769340AMethod for making electrically programmable memory device by doping the floating gate by implantEXEL MICROELECTRONICS INC·Filed 1986·Granted Sep 6, 1988·86 cites·18 claims
- 0489US5909346AThin magnetic film including multiple geometry gap structures on a common substrateAIWA RESEARCH & DEV INC·Filed 1997·Granted Jun 1, 1999·73 cites·12 claims
- 0580US6529449B1Magneto-optical head involving solid immersion lens with two-layer heat-dispersive coilAIWA CO·Filed 2000·Granted Mar 4, 2003·15 cites·10 claims
- 0679US5684660AThin film coil head assembly with protective planarizing cocoon structureAIWA RES AND DEV INC·Filed 1995·Granted Nov 4, 1997·35 cites·12 claims
- 0778US5490028AThin film magnetic head including an integral layered shield structureAIWA RES AND DEV INC·Filed 1994·Granted Feb 6, 1996·29 cites·21 claims
- 0877US5563754AThin film magnetic head including a durable wear layer and gap structureAIWA RES AND DEV INC·Filed 1994·Granted Oct 8, 1996·23 cites·12 claims
- 0975US11055944B2Fingerprint sensors and systems incorporating fingerprint sensorsRISST LTD·Filed 2019·Granted Jul 6, 2021·2 cites·20 claims
- 1075US9280860B2Fingerprint sensors and systems incorporating fingerprint sensorsMALHOTRA ARUN·Filed 2013·Granted Mar 8, 2016·11 cites·33 claims
- 1173US10223851B2Fingerprint sensors and systems incorporating fingerprint sensorsRISST LTD·Filed 2016·Granted Mar 5, 2019·2 cites·21 claims
- 1273US5754377AThin film magnetic head including an elevated gap structureAIWA RES AND DEV INC·Filed 1994·Granted May 19, 1998·20 cites·6 claims
- 1372US5621594AElectroplated thin film conductor coil assemblyAIWA RES AND DEV INC·Filed 1995·Granted Apr 15, 1997·23 cites·16 claims
- 1468US11986287B2Fingerprint sensors and systems incorporating fingerprint sensorsRISST LTD·Filed 2021·Granted May 21, 2024·0 cites·18 claims
- 1564US5748417AThin film magnetic head including layered magnetic side polesAIWA RES AND DEV INC·Filed 1996·Granted May 5, 1998·19 cites·10 claims
- 1662US5853558AMethod of fabricating a thin film conductor coil assemblyAIWA RES AND DEV INC·Filed 1997·Granted Dec 29, 1998·14 cites·32 claims
- 1760US5801909AThin film magnetic head including durable wear layer and non-magnetic gap structuresAIWA RES AND DEV INC·Filed 1996·Granted Sep 1, 1998·17 cites·14 claims
- 1859US5673474AMethod of fabricating a thin film magnetic head including layered magnetic side polesAIWA RES AND DEV INC·Filed 1996·Granted Oct 7, 1997·16 cites·20 claims
- 1958US7031045B2Two-dimensional micro-mirror array enhancementsNEUKERMANS ARMAND P·Filed 2003·Granted Apr 18, 2006·5 cites·10 claims
- 2054US6069015AMethod of fabricating thin film magnetic head including durable wear layer and non-magnetic gap structureAIWA RES AND DEV INC·Filed 1998·Granted May 30, 2000·12 cites·19 claims
- 2151US5737825AMethod of making thin film magnetic head including a durable wear layer and gap structureAIWA RESEARCH & DEV INC·Filed 1996·Granted Apr 14, 1998·9 cites·11 claims
- 2249US5950301AMethod for fabricating thin flim magnetic head including an elevated gap structureAIWA RES AND DEV INC·Filed 1997·Granted Sep 14, 1999·8 cites·10 claims
- 2348US6091581AThin film magnetic head including a separately deposited diamond-like carbon gap structure and magnetic control wellsAIWA CO·Filed 1997·Granted Jul 18, 2000·9 cites·34 claims
- 2439US2002137344A1Etched substrateFiled 2002·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →