Inventor · disambiguated record
Keith Kwietniak
Also filed as: KWIETNIAK KEITH · KWIETNIAK KEITH T · KWIETNIAK KEITH THOMAS
13 granted patents·7 pending applications·608 citations·filing 1996–2007
93Inventor score
Top patents by PatentIndex Score
20 records- 0199US6224690B1Flip-Chip interconnections using lead-free soldersIBM·Filed 1996·Granted May 1, 2001·191 cites·12 claims
- 0297US5937320ABarrier layers for electroplated SnPb eutectic solder jointsIBM·Filed 1998·Granted Aug 10, 1999·297 cites·18 claims
- 0392US7863189B2Methods for fabricating silicon carriers with conductive through-vias with low stress and low defect densityIBM·Filed 2007·Granted Jan 4, 2011·32 cites·10 claims
- 0488US6974531B2Method for electroplating on resistive substratesIBM·Filed 2002·Granted Dec 13, 2005·20 cites·23 claims
- 0583US7060624B2Deep filled viasIBM·Filed 2003·Granted Jun 13, 2006·28 cites·16 claims
- 0674US7101784B2Method to generate porous organic dielectricIBM·Filed 2005·Granted Sep 5, 2006·5 cites·20 claims
- 0767US6592747B2Method of controlling additives in copper plating bathsIBM·Filed 2001·Granted Jul 15, 2003·7 cites·16 claims
- 0859US6331237B1Method of improving contact reliability for electroplatingIBM·Filed 1999·Granted Dec 18, 2001·12 cites·17 claims
- 0959US2005199502A1Method for electroplating on resistive substratesIBM·Filed 2005·Application pending·0 cites
- 1057US7678258B2Void-free damascene copper deposition process and means of monitoring thereofIBM·Filed 2003·Granted Mar 16, 2010·1 cites·11 claims
- 1157US7553400B2Plating apparatus and plating methodEBARA CORP·Filed 2004·Granted Jun 30, 2009·6 cites·16 claims
- 1253US7479213B2Plating method and plating apparatusEBARA CORP·Filed 2004·Granted Jan 20, 2009·4 cites·23 claims
- 1353US6921978B2Method to generate porous organic dielectricIBM·Filed 2003·Granted Jul 26, 2005·4 cites·13 claims
- 1444US7227265B2Electroplated copper interconnection structure, process for making and electroplating bathIBM·Filed 2004·Granted Jun 5, 2007·1 cites·21 claims
- 1544US2009095634A1Plating methodMAKINO NATSUKI·Filed 2007·Application pending·0 cites
- 1644US2002027082A1Method of improving contact reliability for electroplatingFiled 2001·Application pending·0 cites
- 1743US2007034526A1Electrolytic processing apparatus and methodMAKINO NATSUKI·Filed 2005·Application pending·0 cites
- 1841US2006163055A1Apparatus for direct plating on resistive linersIBM·Filed 2005·Application pending·0 cites
- 1939US2005061659A1Plating apparatus and plating methodFiled 2004·Application pending·0 cites
- 2037US2004077140A1Apparatus and method for forming uniformly thick anodized films on large substratesFiled 2002·Application pending·0 cites
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