Inventor · disambiguated record
Minjung Choi
Also filed as: CHOI MINJUNG
12 granted patents·5 pending applications·5 citations·filing 2020–2025
83Inventor score
Files withSAMSUNG ELECTRONICS CO LTD17
Top patents by PatentIndex Score
17 records- 0191US11049827B2Semiconductor devices including a thick metal layer and a bumpSAMSUNG ELECTRONICS CO LTD·Filed 2020·Granted Jun 29, 2021·3 cites·20 claims
- 0288US11670559B2Semiconductor deviceSAMSUNG ELECTRONICS CO LTD·Filed 2021·Granted Jun 6, 2023·2 cites·20 claims
- 0380US2025385127A1Semiconductor device including multi-capping layer and method for manufacturing the sameSAMSUNG ELECTRONICS CO LTD·Filed 2025·Application pending·0 cites
- 0478US12080663B2Semiconductor devices including a thick metal layer and a bumpSAMSUNG ELECTRONICS CO LTD·Filed 2023·Granted Sep 3, 2024·0 cites·20 claims
- 0577US11817408B2Semiconductor devices including a thick metal layer and a bumpSAMSUNG ELECTRONICS CO LTD·Filed 2023·Granted Nov 14, 2023·0 cites·20 claims
- 0672US11557556B2Semiconductor devices including a thick metal layer and a bumpSAMSUNG ELECTRONICS CO LTD·Filed 2021·Granted Jan 17, 2023·0 cites·20 claims
- 0772US2025300042A1Semiconductor devices including a through-hole electrodeSAMSUNG ELECTRONICS CO LTD·Filed 2025·Application pending·0 cites
- 0868US12424489B2Semiconductor device including multi-capping layer and method for manufacturing the sameSAMSUNG ELECTRONICS CO LTD·Filed 2022·Granted Sep 23, 2025·0 cites·20 claims
- 0965US12230587B2Semiconductor device with crack-preventing structureSAMSUNG ELECTRONICS CO LTD·Filed 2022·Granted Feb 18, 2025·0 cites·6 claims
- 1065US11756843B2Semiconductor devices including scribe lane and method of manufacturing the semiconductor devicesSAMSUNG ELECTRONICS CO LTD·Filed 2022·Granted Sep 12, 2023·0 cites·7 claims
- 1164US12347747B2Semiconductor devices including a through-hole electrodeSAMSUNG ELECTRONICS CO LTD·Filed 2022·Granted Jul 1, 2025·0 cites·20 claims
- 1264US2025157948A1Semiconductor device with crack-preventing structureSAMSUNG ELECTRONICS CO LTD·Filed 2025·Application pending·0 cites
- 1362US11342235B2Semiconductor devices including scribe lane and method of manufacturing the semiconductor devicesSAMSUNG ELECTRONICS CO LTD·Filed 2020·Granted May 24, 2022·0 cites·20 claims
- 1453US2023076238A1Semiconductor chip with stepped sidewall, semiconductor package including the same, and method of fabricating the sameSAMSUNG ELECTRONICS CO LTD·Filed 2022·Application pending·0 cites
- 1552US2023138616A1Semiconductor device and semiconductor package including the sameSAMSUNG ELECTRONICS CO LTD·Filed 2022·Application pending·0 cites
- 1651US12072374B2Detection pad structure for analysis in a semiconductor deviceSAMSUNG ELECTRONICS CO LTD·Filed 2021·Granted Aug 27, 2024·0 cites·20 claims
- 1745US11776894B2Semiconductor chip including low-k dielectric layerSAMSUNG ELECTRONICS CO LTD·Filed 2020·Granted Oct 3, 2023·0 cites·18 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →