Inventor · disambiguated record
Joonsik Shin
Also filed as: SHIN JOONSIK
2 granted patents·7 citations·filing 2008–2010
54Inventor score
Technology areasH05K
Top patents by PatentIndex Score
2 records- 0178US8174128B2Method of manufacturing semiconductor package having a first board, second boards electrically connected to both sides of the first board, and at least one component connected to the first board by a flip chip methodIKEGUCHI NOBUYUKI·Filed 2010·Granted May 8, 2012·5 cites·18 claims
- 0263US8030752B2Method of manufacturing semiconductor package and semiconductor plastic package using the sameSAMSUNG ELECTRO MECH·Filed 2008·Granted Oct 4, 2011·2 cites·19 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →