Inventor · disambiguated record
Brian Condie
Also filed as: CONDIE BRIAN · CONDIE BRIAN W · CONDIE BRIAN WILLIAM
13 granted patents·2 pending applications·119 citations·filing 2002–2022
91Inventor score
Files withFREESCALE SEMICONDUCTOR INC7WOLFSPEED INC2CONDIE BRIAN W1CREE INC1INFINEON TECHNOLOGIES AG1
Top patents by PatentIndex Score
15 records- 0192US7429790B2Semiconductor structure and method of manufactureFREESCALE SEMICONDUCTOR INC·Filed 2005·Granted Sep 30, 2008·33 cites·27 claims
- 0290US8907467B2PCB based RF-power package window frameKOMPOSCH ALEXANDER·Filed 2012·Granted Dec 9, 2014·20 cites·29 claims
- 0387US7446411B2Semiconductor structure and method of assemblyFREESCALE SEMICONDUCTOR INC·Filed 2005·Granted Nov 4, 2008·20 cites·27 claims
- 0485US7435625B2Semiconductor device with reduced package cross-talk and lossFREESCALE SEMICONDUCTOR INC·Filed 2005·Granted Oct 14, 2008·14 cites·12 claims
- 0579US11488923B2High reliability semiconductor devices and methods of fabricating the sameCREE INC·Filed 2019·Granted Nov 1, 2022·2 cites·33 claims
- 0679US7683480B2Methods and apparatus for a reduced inductance wirebond arrayFREESCALE SEMICONDUCTOR INC·Filed 2006·Granted Mar 23, 2010·10 cites·15 claims
- 0775US9293407B2Semiconductor package having a baseplate with a die attach region and a peripheral regionINFINEON TECHNOLOGIES AG·Filed 2014·Granted Mar 22, 2016·3 cites·20 claims
- 0870US7701074B2Semiconductor device with a buffer region with tightly-packed filler particlesFREESCALE SEMICONDUCTOR INC·Filed 2008·Granted Apr 20, 2010·4 cites·18 claims
- 0970US7332414B2Chemical die singulation techniqueFREESCALE SEMICONDUCTOR INC·Filed 2005·Granted Feb 19, 2008·3 cites·19 claims
- 1066US2023019230A1High reliability semiconductor devices and methods of fabricating the sameWOLFSPEED INC·Filed 2022·Application pending·0 cites
- 1161US7432133B2Plastic packaged device with die interface layerFREESCALE SEMICONDUCTOR INC·Filed 2005·Granted Oct 7, 2008·2 cites·8 claims
- 1258US7042103B2Low stress semiconductor die attachMOTOROLA INC·Filed 2002·Granted May 9, 2006·8 cites·20 claims
- 1350US11908823B2Devices incorporating stacked bonds and methods of forming the sameWOLFSPEED INC·Filed 2021·Granted Feb 20, 2024·0 cites·37 claims
- 1441US9373577B2Hybrid semiconductor packageINFINEON TECHNOLOGIES CORP·Filed 2013·Granted Jun 21, 2016·0 cites·22 claims
- 1540US2007090545A1Semiconductor device with improved encapsulationCONDIE BRIAN W·Filed 2005·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →