Inventor · disambiguated record
Yuen-Han Wang
Also filed as: WANG YUEN-HAN
1 granted patent·1 pending application·2 citations·filing 2012–2012
19Inventor score
Technology areasH10W
Files withWANG YUEN-HAN2
Top patents by PatentIndex Score
2 records- 0153US8970053B2Semiconductor package having light-emitting-diode solder-bonded on first and second conductive pads separated by at least 75 UMWANG YUEN-HAN·Filed 2012·Granted Mar 3, 2015·2 cites·20 claims
- 0226US2013175563A1Led chip structure, packaging substrate, package structure and fabrication method thereofWANG YUEN-HAN·Filed 2012·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →