Inventor · disambiguated record
Salman Akram
Also filed as: AKRAM SALMAN · FARNWORTH WARREN M · HEMBREE DAVID R
726 granted patents·66 pending applications·42,031 citations·filing 1994–2021
99Inventor score
Files withMICRON TECHNOLOGY INC692AKRAM SALMAN42APTINA IMAGING CORP5KONINKLIJKE PHILIPS NV5LUMILEDS LLC5
Top patents by PatentIndex Score
792 records- 0199US7109068B2Through-substrate interconnect fabrication methodsMICRON TECHNOLOGY INC·Filed 2005·Granted Sep 19, 2006·143 cites·78 claims
- 0299US6583503B2Semiconductor package with stacked substrates and multiple semiconductor diceMICRON TECHNOLOGY INC·Filed 2002·Granted Jun 24, 2003·275 cites·27 claims
- 0399US6544821B2Stereolithographic methods of fabricating semiconductor devices having protective layers thereon through which contact pads are exposedMICRON TECHNOLOGY INC·Filed 2001·Granted Apr 8, 2003·125 cites·40 claims
- 0499US6359456B1Probe card and test system for semiconductor wafersMICRON TECHNOLOGY INC·Filed 2001·Granted Mar 19, 2002·149 cites·25 claims
- 0599US6351028B1Multiple die stack apparatus employing T-shaped interposer elementsMICRON TECHNOLOGY INC·Filed 1999·Granted Feb 26, 2002·257 cites·82 claims
- 0699US6326698B1Semiconductor devices having protective layers thereon through which contact pads are exposed and stereolithographic methods of fabricating such semiconductor devicesMICRON TECHNOLOGY INC·Filed 2000·Granted Dec 4, 2001·438 cites·54 claims
- 0799US6297547B1Mounting multiple semiconductor dies in a packageMICRON TECHNOLOGY INC·Filed 2000·Granted Oct 2, 2001·264 cites·2 claims
- 0899US6235554B1Method for fabricating stackable chip scale semiconductor packageMICRON TECHNOLOGY INC·Filed 1999·Granted May 22, 2001·647 cites·25 claims
- 0999US6228687B1Wafer-level package and methods of fabricatingMICRON TECHNOLOGY INC·Filed 1999·Granted May 8, 2001·355 cites·50 claims
- 1099US6188232B1Temporary package, system, and method for testing semiconductor dice and chip scale packagesMICRON TECHNOLOGY INC·Filed 1998·Granted Feb 13, 2001·229 cites·12 claims
- 1199US6181144B1Semiconductor probe card having resistance measuring circuitry and method fabricationMICRON TECHNOLOGY INC·Filed 1998·Granted Jan 30, 2001·308 cites·20 claims
- 1299US6124634AMicromachined chip scale packageMICRON TECHNOLOGY INC·Filed 1998·Granted Sep 26, 2000·328 cites·30 claims
- 1399US6114240AMethod for fabricating semiconductor components using focused laser beamMICRON TECHNOLOGY INC·Filed 1999·Granted Sep 5, 2000·522 cites·28 claims
- 1499US6107109AMethod for fabricating a semiconductor interconnect with laser machined electrical paths through substrateMICRON TECHNOLOGY INC·Filed 1997·Granted Aug 22, 2000·403 cites·30 claims
- 1599US6072236AMicromachined chip scale packageMICRON TECHNOLOGY INC·Filed 1996·Granted Jun 6, 2000·520 cites·49 claims
- 1699US6060891AProbe card for semiconductor wafers and method and system for testing wafersMICRON TECHNOLOGY INC·Filed 1997·Granted May 9, 2000·218 cites·21 claims
- 1799US6051878AMethod of constructing stacked packagesMICRON TECHNOLOGY INC·Filed 1999·Granted Apr 18, 2000·422 cites·32 claims
- 1899US6028365AIntegrated circuit package and method of fabricationMICRON TECHNOLOGY INC·Filed 1998·Granted Feb 22, 2000·563 cites·27 claims
- 1999US6025728ASemiconductor package with wire bond protective memberMICRON TECHNOLOGY INC·Filed 1997·Granted Feb 15, 2000·230 cites·24 claims
- 2099US6013948AStackable chip scale semiconductor package with mating contacts on opposed surfacesMICRON TECHNOLOGY INC·Filed 1998·Granted Jan 11, 2000·684 cites·27 claims
- 2199US5994166AMethod of constructing stacked packagesMICRON TECHNOLOGY INC·Filed 1997·Granted Nov 30, 1999·339 cites·6 claims
- 2299US5899705AStacked leads-over chip multi-chip moduleFiled 1998·Granted May 4, 1999·200 cites·17 claims
- 2399US5869974AMicromachined probe card having compliant contact members for testing semiconductor wafersMICRON TECHNOLOGY INC·Filed 1996·Granted Feb 9, 1999·259 cites·27 claims
- 2499US5866953APackaged die on PCB with heat sink encapsulantMICRON TECHNOLOGY INC·Filed 1996·Granted Feb 2, 1999·290 cites·61 claims
- 2599US5739585ASingle piece package for semiconductor dieMICRON TECHNOLOGY INC·Filed 1996·Granted Apr 14, 1998·728 cites·30 claims
- 2699US5674785AMethod of producing a single piece package for semiconductor dieMICRON TECHNOLOGY INC·Filed 1995·Granted Oct 7, 1997·514 cites·41 claims
- 2799US5495667AMethod for forming contact pins for semiconductor dice and interconnectsMICRON TECHNOLOGY INC·Filed 1994·Granted Mar 5, 1996·538 cites·30 claims
- 2899US5483741AMethod for fabricating a self limiting silicon based interconnect for testing bare semiconductor diceMICRON TECHNOLOGY INC·Filed 1994·Granted Jan 16, 1996·426 cites·29 claims
- 2998US7683458B2Through-wafer interconnects for photoimager and memory wafersMICRON TECHNOLOGY INC·Filed 2007·Granted Mar 23, 2010·54 cites·17 claims
- 3098US7129114B2Methods relating to singulating semiconductor wafers and wafer scale assembliesMICRON TECHNOLOGY INC·Filed 2004·Granted Oct 31, 2006·123 cites·32 claims
- 3198US6717245B1Chip scale packages performed by wafer level processingMICRON TECHNOLOGY INC·Filed 2000·Granted Apr 6, 2004·170 cites·25 claims
- 3298US6707141B2Multi-chip module substrate for use with leads-over chip type semiconductor devicesMICRON TECHNOLOGY INC·Filed 2001·Granted Mar 16, 2004·94 cites·28 claims
- 3398US6613662B2Method for making projected contact structures for engaging bumped semiconductor devicesMICRON TECHNOLOGY INC·Filed 2001·Granted Sep 2, 2003·128 cites·121 claims
- 3498US6578458B1Method for sawing wafers employing multiple indexing techniques for multiple die dimensionsMICRON TECHNOLOGY INC·Filed 2002·Granted Jun 17, 2003·106 cites·24 claims
- 3598US6563712B2Heak sink chip packageMICRON TECHNOLOGY INC·Filed 2002·Granted May 13, 2003·154 cites·21 claims
- 3698US6544880B1Method of improving copper interconnects of semiconductor devices for bondingMICRON TECHNOLOGY INC·Filed 1999·Granted Apr 8, 2003·188 cites·46 claims
- 3798US6529027B1Interposer and methods for fabricating sameMICRON TECHNOLOGY INC·Filed 2000·Granted Mar 4, 2003·118 cites·24 claims
- 3898US6313522B1Semiconductor structure having stacked semiconductor devicesMICRON TECHNOLOGY INC·Filed 1998·Granted Nov 6, 2001·216 cites·43 claims
- 3998US6310484B1Semiconductor test interconnect with variable flexure contactsMICRON TECHNOLOGY INC·Filed 1999·Granted Oct 30, 2001·147 cites·15 claims
- 4098US6294837B1Semiconductor interconnect having laser machined contactsMICRON TECHNOLOGY INC·Filed 1999·Granted Sep 25, 2001·336 cites·21 claims
- 4198US6261865B1Multi chip semiconductor package and method of constructionMICRON TECHNOLOGY INC·Filed 1998·Granted Jul 17, 2001·299 cites·5 claims
- 4298US6150717ADirect die contact (DDC) semiconductor packageMICRON TECHNOLOGY INC·Filed 1998·Granted Nov 21, 2000·296 cites·19 claims
- 4398US6122171AHeat sink chip package and method of makingMICRON TECHNOLOGY INC·Filed 1999·Granted Sep 19, 2000·311 cites·26 claims
- 4498US6107122ADirect die contact (DDC) semiconductor packageMICRON TECHNOLOGY INC·Filed 1997·Granted Aug 22, 2000·286 cites·20 claims
- 4598US6094058ATemporary semiconductor package having dense array external contactsMICRON TECHNOLOGY INC·Filed 1997·Granted Jul 25, 2000·173 cites·14 claims
- 4698US6089920AModular die sockets with flexible interconnects for packaging bare semiconductor dieMICRON TECHNOLOGY INC·Filed 1998·Granted Jul 18, 2000·205 cites·44 claims
- 4798US6020624ASemiconductor package with bi-substrate dieMICRON TECHNOLOGY INC·Filed 1998·Granted Feb 1, 2000·304 cites·25 claims
- 4898US6018249ATest system with mechanical alignment for semiconductor chip scale packages and diceMICRON TECHNOLGOY INC·Filed 1997·Granted Jan 25, 2000·268 cites·18 claims
- 4998US5990566AHigh density semiconductor packageMICRON TECHNOLOGY INC·Filed 1998·Granted Nov 23, 1999·317 cites·22 claims
- 5098US5946553AProcess for manufacturing a semiconductor package with bi-substrate dieMICRON TECHNOLOGY INC·Filed 1995·Granted Aug 31, 1999·351 cites·13 claims
Showing the top 50 of 792 patent records by PatentIndex Score.
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