Inventor · disambiguated record
Jeffrey Drue David
Also filed as: DAVID JEFFREY D · DAVID JEFFREY DRUE
107 granted patents·22 pending applications·1,017 citations·filing 2000–2024
99Inventor score
Top patents by PatentIndex Score
129 records- 0198US7764377B2Spectrum based endpointing for chemical mechanical polishingAPPLIED MATERIALS INC·Filed 2005·Granted Jul 27, 2010·48 cites·32 claims
- 0297US11295993B2Maintenance scheduling for semiconductor manufacturing equipmentPDF SOLUTIONS INC·Filed 2020·Granted Apr 5, 2022·6 cites·20 claims
- 0397US7409260B2Substrate thickness measuring during polishingAPPLIED MATERIALS INC·Filed 2007·Granted Aug 5, 2008·60 cites·19 claims
- 0497US7406394B2Spectra based endpointing for chemical mechanical polishingAPPLIED MATERIALS INC·Filed 2005·Granted Jul 29, 2008·38 cites·17 claims
- 0597US7226339B2Spectrum based endpointing for chemical mechanical polishingAPPLIED MATERIALS INC·Filed 2005·Granted Jun 5, 2007·26 cites·8 claims
- 0697US7097537B1Determination of position of sensor measurements during polishingAPPLIED MATERIALS INC·Filed 2004·Granted Aug 29, 2006·81 cites·35 claims
- 0796US10430719B2Process control techniques for semiconductor manufacturing processesSTREAM MOSAIC INC·Filed 2016·Granted Oct 1, 2019·28 cites·14 claims
- 0896US8260446B2Spectrographic monitoring of a substrate during processing using index valuesDAVID JEFFREY DRUE·Filed 2010·Granted Sep 4, 2012·14 cites·7 claims
- 0995US8088298B2Spectra based endpointing for chemical mechanical polishingSWEDEK BOGUSLAW A·Filed 2008·Granted Jan 3, 2012·25 cites·12 claims
- 1095US7306507B2Polishing pad assembly with glass or crystalline windowAPPLIED MATERIALS INC·Filed 2005·Granted Dec 11, 2007·17 cites·6 claims
- 1195US7210980B2Sealed polishing pad, system and methodsAPPLIED MATERIALS INC·Filed 2005·Granted May 1, 2007·20 cites·12 claims
- 1295US7112119B1Sealed polishing pad methodsAPPLIED MATERIALS INC·Filed 2006·Granted Sep 26, 2006·29 cites·13 claims
- 1394US10734293B2Process control techniques for semiconductor manufacturing processesSTREAM MOSAIC INC·Filed 2015·Granted Aug 4, 2020·12 cites·20 claims
- 1494US9117751B2Endpointing detection for chemical mechanical polishing based on spectrometryAPPLIED MATERIALS INC·Filed 2013·Granted Aug 25, 2015·8 cites·19 claims
- 1594US8747189B2Method of controlling polishingDAVID JEFFREY DRUE·Filed 2011·Granted Jun 10, 2014·14 cites·19 claims
- 1694US8039397B2Using optical metrology for within wafer feed forward process controlAPPLIED MATERIALS INC·Filed 2009·Granted Oct 18, 2011·20 cites·24 claims
- 1794US7774086B2Substrate thickness measuring during polishingAPPLIED MATERIALS INC·Filed 2008·Granted Aug 10, 2010·22 cites·19 claims
- 1893US9362186B2Polishing with eddy current feed meaurement prior to deposition of conductive layerAPPLIED MATERIALS INC·Filed 2015·Granted Jun 7, 2016·10 cites·8 claims
- 1993US8944884B2Fitting of optical model to measured spectrumDAVID JEFFREY DRUE·Filed 2013·Granted Feb 3, 2015·10 cites·20 claims
- 2093US8292693B2Using optical metrology for wafer to wafer feed back process controlDAVID JEFFREY DRUE·Filed 2009·Granted Oct 23, 2012·16 cites·24 claims
- 2193US8190285B2Feedback for polishing rate correction in chemical mechanical polishingQIAN JUN·Filed 2010·Granted May 29, 2012·10 cites·20 claims
- 2292US11029673B2Generating robust machine learning predictions for semiconductor manufacturing processesPDF SOLUTIONS INC·Filed 2018·Granted Jun 8, 2021·9 cites·17 claims
- 2392US8992286B2Weighted regression of thickness maps from spectral dataAPPLIED MATERIALS INC·Filed 2013·Granted Mar 31, 2015·9 cites·20 claims
- 2492US8977379B2Endpoint method using peak location of spectra contour plots versus timeDAVID JEFFREY DRUE·Filed 2010·Granted Mar 10, 2015·8 cites·18 claims
- 2592US8834229B2Dynamically tracking spectrum features for endpoint detectionDAVID JEFFREY DRUE·Filed 2011·Granted Sep 16, 2014·9 cites·18 claims
- 2692US7614933B2Polishing pad assembly with glass or crystalline windowAPPLIED MATERIALS INC·Filed 2007·Granted Nov 10, 2009·10 cites·17 claims
- 2792US6435942B1Chemical mechanical polishing processes and componentsAPPLIED MATERIALS INC·Filed 2000·Granted Aug 20, 2002·74 cites·19 claims
- 2891US8535115B2Gathering spectra from multiple optical headsDAVID JEFFREY DRUE·Filed 2011·Granted Sep 17, 2013·8 cites·25 claims
- 2991US8352061B2Semi-quantitative thickness determinationAPPLIED MATERIALS INC·Filed 2008·Granted Jan 8, 2013·14 cites·21 claims
- 3091US7952708B2High throughput measurement systemAPPLIED MATERIALS INC·Filed 2008·Granted May 31, 2011·13 cites·21 claims
- 3191US7074109B1Chemical mechanical polishing control system and methodAPPLIED MATERIALS INC·Filed 2004·Granted Jul 11, 2006·50 cites·24 claims
- 3290US10012494B2Grouping spectral data from polishing substratesAPPLIED MATERIALS INC·Filed 2013·Granted Jul 3, 2018·8 cites·17 claims
- 3390US7840375B2Methods and apparatus for generating a library of spectraAPPLIED MATERIALS INC·Filed 2008·Granted Nov 23, 2010·12 cites·23 claims
- 3490US7444198B2Determining physical property of substrateAPPLIED MATERIALS INC·Filed 2006·Granted Oct 28, 2008·17 cites·15 claims
- 3590US7153185B1Substrate edge detectionAPPLIED MATERIALS INC·Filed 2004·Granted Dec 26, 2006·35 cites·58 claims
- 3689US8814631B2Tracking spectrum features in two dimensions for endpoint detectionDAVID JEFFREY DRUE·Filed 2011·Granted Aug 26, 2014·13 cites·15 claims
- 3789US8808059B1Spectraphic monitoring based on pre-screening of theoretical libraryAPPLIED MATERIALS INC·Filed 2013·Granted Aug 19, 2014·9 cites·15 claims
- 3888US9551567B2Reducing noise in spectral data from polishing substratesAPPLIED MATERIALS INC·Filed 2013·Granted Jan 24, 2017·6 cites·19 claims
- 3988US9227293B2Multi-platen multi-head polishing architectureAPPLIED MATERIALS INC·Filed 2013·Granted Jan 5, 2016·6 cites·19 claims
- 4088US8718810B2Semi-quantitative thickness determinationAPPLIED MATERIALS INC·Filed 2012·Granted May 6, 2014·7 cites·15 claims
- 4188US8202738B2Endpoint method using peak location of modified spectraDAVID JEFFREY DRUE·Filed 2011·Granted Jun 19, 2012·9 cites·20 claims
- 4288US7163437B1System with sealed polishing padAPPLIED MATERIALS INC·Filed 2006·Granted Jan 16, 2007·12 cites·15 claims
- 4387US9142466B2Using spectra to determine polishing endpointsAPPLIED MATERIALS INC·Filed 2013·Granted Sep 22, 2015·6 cites·16 claims
- 4487US7614936B2Spectrum based endpointing for chemical mechanical polishingAPPLIED MATERIALS INC·Filed 2007·Granted Nov 10, 2009·5 cites·7 claims
- 4586US9833874B2Applying dimensional reduction to spectral data from polishing substratesAPPLIED MATERIALS INC·Filed 2017·Granted Dec 5, 2017·3 cites·15 claims
- 4686US7025658B2Platen and head rotation rates for monitoring chemical mechanical polishingAPPLIED MATERIALS INC·Filed 2003·Granted Apr 11, 2006·23 cites·24 claims
- 4785US11183435B2Endpointing detection for chemical mechanical polishing based on spectrometryAPPLIED MATERIALS INC·Filed 2019·Granted Nov 23, 2021·1 cites·4 claims
- 4883US10086492B2Applying dimensional reduction to spectral data from polishing substratesAPPLIED MATERIALS INC·Filed 2017·Granted Oct 2, 2018·2 cites·12 claims
- 4983US2025138505A1Sequenced Approach for Determining Wafer Path QualityPDF SOLUTIONS INC·Filed 2024·Application pending·0 cites
- 5082US11715672B2Endpoint detection for chemical mechanical polishing based on spectrometryAPPLIED MATERIALS INC·Filed 2021·Granted Aug 1, 2023·0 cites·11 claims
Showing the top 50 of 129 patent records by PatentIndex Score.
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