Inventor · disambiguated record
Kook-Jin Oh
Also filed as: OH KOOK-JIN
4 granted patents·4 pending applications·16 citations·filing 2004–2013
67Inventor score
Top patents by PatentIndex Score
8 records- 0181US7793408B2Apparatus for transferring semiconductor chipSAMSUNG ELECTRONICS CO LTD·Filed 2007·Granted Sep 14, 2010·12 cites·16 claims
- 0245US7631795B2System and method for automated wire bondingSAMSUNG ELECTRONICS CO LTD·Filed 2004·Granted Dec 15, 2009·3 cites·20 claims
- 0341US7481351B2Wire bonding apparatus and method for clamping a wireSAMSUNG ELECTRONICS CO LTD·Filed 2004·Granted Jan 27, 2009·1 cites·23 claims
- 0437US2013248905A1Led package and method of manufacturing the sameLEE JU-KYUNG·Filed 2012·Application pending·0 cites
- 0533US2005269713A1Apparatus and method for wire bonding and die attachingOH KOOK-JIN·Filed 2005·Application pending·0 cites
- 0632US2013177998A1Method of manufacturing light emitting device and phosphor-containing fluid resin dispensing apparatusSAMSUNG ELECTRONICS CO LTD·Filed 2013·Application pending·0 cites
- 0732US2005126696A1Snap cure device for semiconductor chip attachmentFiled 2004·Application pending·0 cites
- 0830US8829691B2Light-emitting device package and method of manufacturing the sameLIM JAE-YUN·Filed 2011·Granted Sep 9, 2014·0 cites·8 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →