Inventor · disambiguated record
Jingyi Bai
Also filed as: BAI JINGYI · BAI JINGYI JENNY
22 granted patents·3 pending applications·471 citations·filing 2003–2022
96Inventor score
Top patents by PatentIndex Score
25 records- 0198US7390746B2Multiple deposition for integration of spacers in pitch multiplication processMICRON TECHNOLOGY INC·Filed 2005·Granted Jun 24, 2008·67 cites·55 claims
- 0298US7253118B2Pitch reduced patterns relative to photolithography featuresMICRON TECHNOLOGY INC·Filed 2005·Granted Aug 7, 2007·161 cites·52 claims
- 0397US7651951B2Pitch reduced patterns relative to photolithography featuresMICRON TECHNOLOGY INC·Filed 2007·Granted Jan 26, 2010·46 cites·28 claims
- 0495US7718540B2Pitch reduced patterns relative to photolithography featuresROUND ROCK RES LLC·Filed 2007·Granted May 18, 2010·22 cites·5 claims
- 0594US8048812B2Pitch reduced patterns relative to photolithography featuresROUND ROCK RES LLC·Filed 2010·Granted Nov 1, 2011·11 cites·20 claims
- 0694US7884022B2Multiple deposition for integration of spacers in pitch multiplication processROUND ROCK RES LLC·Filed 2007·Granted Feb 8, 2011·20 cites·21 claims
- 0793US8207576B2Pitch reduced patterns relative to photolithography featuresTRAN LUAN·Filed 2007·Granted Jun 26, 2012·18 cites·25 claims
- 0892US9876045B2Back side illuminated CMOS image sensor arraysCISTA SYS CORP·Filed 2016·Granted Jan 23, 2018·7 cites·17 claims
- 0992US8598632B2Integrated circuit having pitch reduced patterns relative to photoithography featuresTRAN LUAN·Filed 2012·Granted Dec 3, 2013·10 cites·6 claims
- 1092US7270917B2Prevention of photoresist scummingMICRON TECHNOLOGY INC·Filed 2006·Granted Sep 18, 2007·10 cites·23 claims
- 1191US7175944B2Prevention of photoresist scummingMICRON TECHNOLOGY INC·Filed 2004·Granted Feb 13, 2007·27 cites·22 claims
- 1288US8129093B2Prevention of photoresist scummingYIN ZHIPING·Filed 2010·Granted Mar 6, 2012·4 cites·25 claims
- 1388US8119535B2Pitch reduced patterns relative to photolithography featuresTRAN LUAN·Filed 2009·Granted Feb 21, 2012·8 cites·19 claims
- 1486US8878264B2Global shutter pixel with improved efficiencyVELICHKO SERGEY·Filed 2011·Granted Nov 4, 2014·12 cites·11 claims
- 1584US7259079B2Methods for filling high aspect ratio trenches in semiconductor layersMICRON TECHNOLOGY INC·Filed 2005·Granted Aug 21, 2007·11 cites·26 claims
- 1679US7344975B2Method to reduce charge buildup during high aspect ratio contact etchMICRON TECHNOLOGY INC·Filed 2005·Granted Mar 18, 2008·5 cites·41 claims
- 1776US6982207B2Methods for filling high aspect ratio trenches in semiconductor layersMICRON TECHNOLOGY INC·Filed 2003·Granted Jan 3, 2006·20 cites·29 claims
- 1875US8123968B2Multiple deposition for integration of spacers in pitch multiplication processBAI JINGYI·Filed 2008·Granted Feb 28, 2012·6 cites·25 claims
- 1975US7704673B2Prevention of photoresist scummingMICRON TECHNOLOGY INC·Filed 2007·Granted Apr 27, 2010·2 cites·19 claims
- 2073US8673787B2Method to reduce charge buildup during high aspect ratio contact etchSANDHU GURTEJ S·Filed 2011·Granted Mar 18, 2014·2 cites·18 claims
- 2169US7985692B2Method to reduce charge buildup during high aspect ratio contact etchMICRON TECHNOLOGY INC·Filed 2008·Granted Jul 26, 2011·2 cites·24 claims
- 2263US10741602B2Back side illuminated CMOS image sensor arraysCISTA SYS CORP·Filed 2017·Granted Aug 11, 2020·0 cites·12 claims
- 2349US2024071846A1Test key transistor for deep trench isolation depth detectionCISTA SYS CORP·Filed 2022·Application pending·0 cites
- 2449US2024072094A1Centrally symmetric vertical transfer gateCISTA SYS CORP·Filed 2022·Application pending·0 cites
- 2549US2011117743A1Multiple deposition for integration of spacers in pitch multiplication processROUND ROCK RES LLC·Filed 2011·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →