Inventor · disambiguated record
Wonll Kwon
Also filed as: KWON WONLL
3 granted patents·9 citations·filing 2011–2013
60Inventor score
Technology areasH10W
Top patents by PatentIndex Score
3 records- 0181US8710670B2Integrated circuit packaging system with coupling features and method of manufacture thereofKIM MINJUNG·Filed 2011·Granted Apr 29, 2014·7 cites·20 claims
- 0266US8642469B2Semiconductor device and method of forming multi-layered UBM with intermediate insulating buffer layer to reduce stress for semiconductor waferCHOI DAESIK·Filed 2011·Granted Feb 4, 2014·2 cites·31 claims
- 0352US9252093B2Semiconductor device and method of forming multi-layered UBM with intermediate insulating buffer layer to reduce stress for semiconductor waferSTATS CHIPPAC LTD·Filed 2013·Granted Feb 2, 2016·0 cites·25 claims
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →