Inventor · disambiguated record
Bau-Ru Lu
Also filed as: LU BAU-RU
43 granted patents·7 pending applications·93 citations·filing 2006–2025
97Inventor score
Top patents by PatentIndex Score
50 records- 0196US9984996B2Three-dimensional (3D) package structure with electronic components encapsulated by a connection structure over an inductorCYNTEC CO LTD·Filed 2014·Granted May 29, 2018·20 cites·17 claims
- 0293US9514964B2Stack frame for electrical connections and the method to fabricate thereofLU BAU-RU·Filed 2015·Granted Dec 6, 2016·8 cites·20 claims
- 0391US9799722B1Inductive component and package structure thereofCYNTEC CO LTD·Filed 2016·Granted Oct 24, 2017·8 cites·20 claims
- 0489US9142426B2Stack frame for electrical connections and the method to fabricate thereofLU BAU-RU·Filed 2011·Granted Sep 22, 2015·8 cites·19 claims
- 0588US9978611B2Stack frame for electrical connections and the method to fabricate thereofCYNTEC CO LTD·Filed 2017·Granted May 22, 2018·4 cites·20 claims
- 0688US9741590B2Stack frame for electrical connections and the method to fabricate thereofCYNTEC CO LTD·Filed 2016·Granted Aug 22, 2017·4 cites·20 claims
- 0780US11134570B2Electronic module with a magnetic deviceCYNTEC CO LTD·Filed 2019·Granted Sep 28, 2021·2 cites·12 claims
- 0879US10199361B2Stacked electronic structureCYNTEC CO LTD·Filed 2018·Granted Feb 5, 2019·2 cites·20 claims
- 0975US10297573B2Three-dimensional package structure and the method to fabricate thereofCYNTEC CO LTD·Filed 2018·Granted May 21, 2019·1 cites·18 claims
- 1075US8247891B2Chip package structure including heat dissipation device and an insulation sheetWEN CHAU-CHUN·Filed 2009·Granted Aug 21, 2012·9 cites·19 claims
- 1174US8619428B2Electronic package structureLEE HAN-HSIANG·Filed 2011·Granted Dec 31, 2013·4 cites·15 claims
- 1273US11031255B2Stack frame for electrical connections and the method to fabricate thereofCYNTEC CO LTD·Filed 2020·Granted Jun 8, 2021·0 cites·18 claims
- 1373US9655253B2Method of fabrication of encapsulated electronics devices mounted on a redistribution layerLU BAU-RU·Filed 2013·Granted May 16, 2017·2 cites·11 claims
- 1472US10529680B2Encapsulated electronic device mounted on a redistribution layerCYNTEC CO LTD·Filed 2017·Granted Jan 7, 2020·1 cites·18 claims
- 1572US10433424B2Electronic module and the fabrication method thereofCYNTEC CO LTD·Filed 2015·Granted Oct 1, 2019·2 cites·13 claims
- 1672US7982304B2Chip package structureCYNTEC CO LTD·Filed 2009·Granted Jul 19, 2011·5 cites·12 claims
- 1770US10856417B2Power supply module used in a smart terminal and power supply module assembly structureDELTA ELECTRONICS SHANGHAI CO·Filed 2019·Granted Dec 1, 2020·1 cites·13 claims
- 1869US7551455B2Package structureCYNTEC CO LTD·Filed 2006·Granted Jun 23, 2009·5 cites·14 claims
- 1968US11419214B2Power supply module used in a smart terminal and power supply module assembly structureDELTA ELECTRONICS SHANGHAI CO·Filed 2020·Granted Aug 16, 2022·0 cites·13 claims
- 2068US9911715B2Three-dimensional package structure and the method to fabricate thereofCYNTEC CO LTD·Filed 2014·Granted Mar 6, 2018·1 cites·19 claims
- 2168US9859250B2Substrate and the method to fabricate thereofCYNTEC CO LTD·Filed 2014·Granted Jan 2, 2018·1 cites·11 claims
- 2266US9451701B2Electronic package structureCYNTEC CO LTD·Filed 2015·Granted Sep 20, 2016·1 cites·20 claims
- 2365US10034379B2Stacked electronic structureCYNTEC CO LTD·Filed 2016·Granted Jul 24, 2018·0 cites·20 claims
- 2465US9536798B2Package structure and the method to fabricate thereofLU BAU-RU·Filed 2012·Granted Jan 3, 2017·2 cites·11 claims
- 2565US8906741B2Electronic package structure having side-wing parts outside of a package layer for dissipating heat and method for making the sameLU BAU-RU·Filed 2011·Granted Dec 9, 2014·2 cites·26 claims
- 2665US2025227845A1Power supply moduleCYNTEC CO LTD·Filed 2025·Application pending·0 cites
- 2764US10212817B2Electronic module with a magnetic deviceCYNTEC CO LTD·Filed 2017·Granted Feb 19, 2019·0 cites·17 claims
- 2863US11744009B2Electronic moduleCYNTEC CO LTD·Filed 2021·Granted Aug 29, 2023·0 cites·19 claims
- 2961US10854575B2Three-dimensional (3D) package structure having an epoxy molding compound layer between a discrete inductor and an encapsulating connecting structureCYNTEC CO LTD·Filed 2018·Granted Dec 1, 2020·0 cites·8 claims
- 3061US10593561B2Stack frame for electrical connections and the method to fabricate thereofCYNTEC CO LTD·Filed 2018·Granted Mar 17, 2020·0 cites·20 claims
- 3159US10128214B2Substrate and the method to fabricate thereofCYNTEC CO LTD·Filed 2017·Granted Nov 13, 2018·0 cites·20 claims
- 3259US2025125319A1Stacked electronic structureCYNTEC CO LTD·Filed 2024·Application pending·0 cites
- 3357US10741531B2Method to form a stacked electronic structureCYNTEC CO LTD·Filed 2018·Granted Aug 11, 2020·0 cites·18 claims
- 3455US2025224788A1Power supply systemCYNTEC CO LTD·Filed 2025·Application pending·0 cites
- 3554US11017934B2Electronic moduleCYNTEC CO LTD·Filed 2017·Granted May 25, 2021·0 cites·18 claims
- 3653US9001527B2Electronic package structureCHEN DA-JUNG·Filed 2012·Granted Apr 7, 2015·0 cites·15 claims
- 3752US9538660B2Electronic package structureCYNTEC CO LTD·Filed 2015·Granted Jan 3, 2017·0 cites·18 claims
- 3851US9734944B2Electronic package structure comprising a magnetic body and an inductive element and method for making the sameCYNTEC CO LTD·Filed 2014·Granted Aug 15, 2017·0 cites·23 claims
- 3950US2018168045A1Electronic ModuleCYNTEC CO LTD·Filed 2017·Application pending·0 cites
- 4049US11024702B2Stacked electronic structureCYNTEC CO LTD·Filed 2019·Granted Jun 1, 2021·0 cites·20 claims
- 4149US9668359B2Circuit module having surface-mount pads on a lateral surface for connecting with a circuit boardCYNTEC CO LTD·Filed 2015·Granted May 30, 2017·0 cites·19 claims
- 4248US11153973B2Electronic moduleCYNTEC CO LTD·Filed 2019·Granted Oct 19, 2021·0 cites·20 claims
- 4347US10373894B2Package structure and the method to fabricate thereofCYNTEC CO LTD·Filed 2016·Granted Aug 6, 2019·0 cites·18 claims
- 4445US2008179722A1Electronic package structureCYNTEC CO LTD·Filed 2007·Application pending·0 cites
- 4544US2008180921A1Electronic package structureCYNTEC CO LTD·Filed 2007·Application pending·0 cites
- 4643US2012262074A1Driving circuit of light emitting diodes having at least one bypass circuit, and driving method thereofWANG WEI-CHENG·Filed 2012·Application pending·0 cites
- 4739US10063098B2Electronic module and method for forming packageCYNTEC CO LTD·Filed 2017·Granted Aug 28, 2018·0 cites·20 claims
- 4839US9386686B2Metal core printed circuit board and electronic package structureHUANG CHI-FENG·Filed 2012·Granted Jul 5, 2016·0 cites·9 claims
- 4935US10636735B2Package structure and the method to fabricate thereofLU BAU RU·Filed 2011·Granted Apr 28, 2020·0 cites·12 claims
- 5034US10373930B2Package structure and the method to fabricate thereofLI JENG JEN·Filed 2012·Granted Aug 6, 2019·0 cites·12 claims
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →