Inventor · disambiguated record
David Watts
Also filed as: WATTS DAVID · WATTS DAVID K · WATTS DAVID K H
19 granted patents·3 pending applications·1,025 citations·filing 1997–2023
95Inventor score
Top patents by PatentIndex Score
22 records- 0196US6001730AChemical mechanical polishing (CMP) slurry for polishing copper interconnects which use tantalum-based barrier layersMOTOROLA INC·Filed 1997·Granted Dec 14, 1999·324 cites·32 claims
- 0295US5897375AChemical mechanical polishing (CMP) slurry for copper and method of use in integrated circuit manufactureMOTOROLA INC·Filed 1997·Granted Apr 27, 1999·338 cites·32 claims
- 0386US5985748AMethod of making a semiconductor device using chemical-mechanical polishing having a combination-step processMOTOROLA INC·Filed 1997·Granted Nov 16, 1999·98 cites·21 claims
- 0481US6096652AMethod of chemical mechanical planarization using copper coordinating ligandsMOTOROLA INC·Filed 1997·Granted Aug 1, 2000·69 cites·32 claims
- 0580US7544609B2Method for integrating liner formation in back end of line processingIBM·Filed 2007·Granted Jun 9, 2009·9 cites·20 claims
- 0678US7820051B2Recycling of electrochemical-mechanical planarization (ECMP) slurries/electrolytesIBM·Filed 2007·Granted Oct 26, 2010·4 cites·18 claims
- 0777US6372111B1Method and apparatus for reclaiming a metal from a CMP process for use in an electroplating processFiled 2000·Granted Apr 16, 2002·19 cites·26 claims
- 0874US9219819B1Load balancing and sharing of contextual information in a multi-vendor and/or multiple contact center environmentCAFEX COMMUNICATIONS LTD·Filed 2015·Granted Dec 22, 2015·7 cites·20 claims
- 0974US5935871AProcess for forming a semiconductor deviceMOTOROLA INC·Filed 1997·Granted Aug 10, 1999·47 cites·21 claims
- 1073US6362103B1Method and apparatus for rejuvenating a CMP chemical solutionFiled 2000·Granted Mar 26, 2002·16 cites·18 claims
- 1171US6045435ALow selectivity chemical mechanical polishing (CMP) process for use on integrated circuit metal interconnectsMOTOROLA INC·Filed 1997·Granted Apr 4, 2000·44 cites·18 claims
- 1268US6071816AMethod of chemical mechanical planarization using a water rinse to prevent particle contaminationMOTOROLA INC·Filed 1997·Granted Jun 6, 2000·35 cites·27 claims
- 1367US12101530B2Methods and apparatus to identify user presence to a meterNIELSEN CO US LLC·Filed 2023·Granted Sep 24, 2024·0 cites·20 claims
- 1466US11895363B2Methods and apparatus to identify user presence to a meterNIELSEN CO US LLC·Filed 2022·Granted Feb 6, 2024·0 cites·24 claims
- 1563US7807036B2Method and system for pad conditioning in an ECMP processIBM·Filed 2007·Granted Oct 5, 2010·1 cites·1 claims
- 1658US11363334B2Methods and apparatus to identify user presence to a meterNIELSEN CO US LLC·Filed 2019·Granted Jun 14, 2022·0 cites·27 claims
- 1753US6379463B1Web coating material supply apparatus and methodROYSE MFG CO·Filed 1999·Granted Apr 30, 2002·14 cites·6 claims
- 1851US7883395B2Electrical contact structures and methods for useIBM·Filed 2007·Granted Feb 8, 2011·0 cites·7 claims
- 1946US8137158B2Electrical contact methodFANG RUI·Filed 2011·Granted Mar 20, 2012·0 cites·5 claims
- 2045US2002007302A1Method and apparatus for tracking vendor compliance with purchaser guidelines and related method for the commercial distribution of software and hardware implementing sameFiled 2001·Application pending·0 cites
- 2140US2005260855A1Method and apparatus for planarizing a semiconductor waferACUTE INC·Filed 2005·Application pending·0 cites
- 2224US2015350428A1Pushing web and application pages during video/audio callsCAFEX COMMUNICATIONS LTD·Filed 2015·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →