Inventor · disambiguated record
Bernie Jord Yang
Also filed as: YANG BERNIE · YANG BERNIE JORD
2 granted patents·1 pending application·12 citations·filing 2013–2019
53Inventor score
Technology areasH10W
Files withQUALCOMM INC3
Top patents by PatentIndex Score
3 records- 0188US9324397B1Common die for supporting different external memory types with minimal packaging complexityQUALCOMM INC·Filed 2015·Granted Apr 26, 2016·11 cites·29 claims
- 0258US9871012B2Method and apparatus for routing die signals using external interconnectsQUALCOMM INC·Filed 2013·Granted Jan 16, 2018·1 cites·31 claims
- 0339US2020381405A1Passive device embedded in a fan-out package-on-package assemblyQUALCOMM INC·Filed 2019·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →