Inventor · disambiguated record
Yasushi Akutsu
Also filed as: AKUTSU YASUSHI
52 granted patents·11 pending applications·167 citations·filing 1999–2023
97Inventor score
Files withDEXERIALS CORP49AKUTSU YASUSHI7SONY CHEMICALS CORP3MIYAUCHI KOUICHI1SONY CHEM & INF DEVICE CORP1
Top patents by PatentIndex Score
63 records- 0193US10026709B2Anisotropic electrically conductive filmDEXERIALS CORP·Filed 2015·Granted Jul 17, 2018·8 cites·18 claims
- 0290US10304796B2Anisotropic electrically conductive film having electrically conductive particles disposed in a lattice point region of a planar lattice patternDEXERIALS CORP·Filed 2018·Granted May 28, 2019·4 cites·15 claims
- 0387US10272598B2Method of producing anisotropic conductive film and anisotropic conductive filmDEXERIALS CORP·Filed 2013·Granted Apr 30, 2019·7 cites·16 claims
- 0484US9997486B2Anisotropic conductive film including oblique region having lower curing ratioDEXERIALS CORP·Filed 2015·Granted Jun 12, 2018·5 cites·16 claims
- 0584US9960139B2Anisotropic conductive film, method for producing anisotropic conductive film, method for producing connection body, and connection methodDEXERIALS CORP·Filed 2013·Granted May 1, 2018·5 cites·26 claims
- 0683US11591499B2Anisotropic conductive filmDEXERIALS CORP·Filed 2016·Granted Feb 28, 2023·2 cites·20 claims
- 0783US9673168B2Connection bodyDEXERIALS CORP·Filed 2015·Granted Jun 6, 2017·5 cites·4 claims
- 0880US6344156B1Anisotropic conductive adhesive filmSONY CHEMICALS CORP·Filed 1999·Granted Feb 5, 2002·63 cites·15 claims
- 0979US10199358B2Multilayer substrateDEXERIALS CORP·Filed 2016·Granted Feb 5, 2019·3 cites·12 claims
- 1078US9960138B2Connection bodyDEXERIALS CORP·Filed 2017·Granted May 1, 2018·3 cites·13 claims
- 1178US6641928B2Adhesives and electric devicesSONY CHEMICALS CORP·Filed 2001·Granted Nov 4, 2003·27 cites·11 claims
- 1277US11923333B2Anisotropic electrically conductive filmDEXERIALS CORP·Filed 2022·Granted Mar 5, 2024·0 cites·18 claims
- 1376US9991614B2Anisotropic electrically conductive film and connection structureDEXERIALS CORP·Filed 2015·Granted Jun 5, 2018·2 cites·14 claims
- 1473US10121756B2Anisotropic conductive film and connection structureDEXERIALS CORP·Filed 2015·Granted Nov 6, 2018·2 cites·15 claims
- 1572US12480024B2Anisotropic conductive filmDEXERIALS CORP·Filed 2023·Granted Nov 25, 2025·0 cites·21 claims
- 1672US6518095B1Process for producing semiconductor deviceSONY CHEMICALS CORP·Filed 2000·Granted Feb 11, 2003·19 cites·5 claims
- 1769US11787976B2Method of producing anisotropic conductive film and anisotropic conductive filmDEXERIALS CORP·Filed 2021·Granted Oct 17, 2023·0 cites·8 claims
- 1869US10553554B2Anisotropic conductive filmDEXERIALS CORP·Filed 2017·Granted Feb 4, 2020·1 cites·10 claims
- 1969US8067514B2Anisotropic conductive filmMIYAUCHI KOUICHI·Filed 2008·Granted Nov 29, 2011·5 cites·6 claims
- 2069US2016149366A1Method for manufacturing electrically conductive adhesive film, electrically conductive adhesive film, and method for manufacturing connectorDEXERIALS CORP·Filed 2014·Application pending·0 cites
- 2166US2021280548A1Anisotropic conductive film and manufacturing method thereofDEXERIALS CORP·Filed 2021·Application pending·0 cites
- 2265US11248148B2Method for manufacturing electrically conductive adhesive film, electrically conductive adhesive film, and method for manufacturing connectorDEXERIALS CORP·Filed 2014·Granted Feb 15, 2022·0 cites·16 claims
- 2364US10388624B2Anisotropic conductive film and connection structureDEXERIALS CORP·Filed 2016·Granted Aug 20, 2019·1 cites·10 claims
- 2463US2022084975A1Anisotropic conductive film and production method of the sameDEXERIALS CORP·Filed 2021·Application pending·0 cites
- 2562US12087722B2Anisotropic electrically conductive filmDEXERIALS CORP·Filed 2019·Granted Sep 10, 2024·0 cites·18 claims
- 2662US11139629B2Method for manufacturing electrically conductive adhesive film, electrically conductive adhesive film, and method for manufacturing connectorDEXERIALS CORP·Filed 2019·Granted Oct 5, 2021·0 cites·10 claims
- 2762US9585247B2Anisotropic conductive film and method of producing the sameDEXERIALS CORP·Filed 2013·Granted Feb 28, 2017·1 cites·15 claims
- 2861US10714444B2Anisotropic conductive filmDEXERIALS CORP·Filed 2019·Granted Jul 14, 2020·0 cites·19 claims
- 2960US11136476B2Method of producing anisotropic conductive film and anisotropic conductive filmDEXERIALS CORP·Filed 2019·Granted Oct 5, 2021·0 cites·13 claims
- 3060US8221880B2Adhesive compositionAKUTSU YASUSHI·Filed 2008·Granted Jul 17, 2012·0 cites·6 claims
- 3159US2019067234A1Anisotropic conductive film and manufacturing method thereofDEXERIALS CORP·Filed 2018·Application pending·0 cites
- 3258US8524032B2Connecting film, and joined structure and method for producing the sameAKUTSU YASUSHI·Filed 2012·Granted Sep 3, 2013·0 cites·2 claims
- 3357US9023464B2Connecting film, and joined structure and method for producing the sameAKUTSU YASUSHI·Filed 2010·Granted May 5, 2015·1 cites·12 claims
- 3457US8846142B2Conductive particle, anisotropic conductive interconnection material that uses the conductive particle, and method for producing the conductive particleAKUTSU YASUSHI·Filed 2010·Granted Sep 30, 2014·0 cites·3 claims
- 3557US8361614B2Anisotropic electrically conductive film and connection structureSONY CHEM & INF DEVICE CORP·Filed 2008·Granted Jan 29, 2013·0 cites·8 claims
- 3656US11049842B2Alignment method, method for connecting electronic component, method for manufacturing connection body, connection body and anisotropic conductive filmDEXERIALS CORP·Filed 2019·Granted Jun 29, 2021·0 cites·21 claims
- 3755US2019096844A1Anisotropic conductive film and manufacturing method thereofDEXERIALS CORP·Filed 2018·Application pending·0 cites
- 3854US10373926B2Anisotropic conductive film, method for producing anisotropic conductive film, method for producing connection body, and connection methodDEXERIALS CORP·Filed 2018·Granted Aug 6, 2019·0 cites·20 claims
- 3953US2016155717A1Anisotropic conductive film and manufacturing method thereforDEXERIALS CORP·Filed 2014·Application pending·0 cites
- 4052US11732105B2Filler disposition filmDEXERIALS CORP·Filed 2021·Granted Aug 22, 2023·0 cites·21 claims
- 4152US8319222B2Adhesive compositionAKUTSU YASUSHI·Filed 2011·Granted Nov 27, 2012·0 cites·7 claims
- 4250US12066458B2Conductive particle-disposed film having conductive particles disposed within an elastomer film, method for producing the same, test probe unit, and continuity test methodDEXERIALS CORP·Filed 2017·Granted Aug 20, 2024·0 cites·14 claims
- 4350US8309224B2Conductive particle, anisotropic conductive interconnection material that uses the conductive particle, and method for producing the conductive particleAKUTSU YASUSHI·Filed 2008·Granted Nov 13, 2012·0 cites·7 claims
- 4448US11309270B2Anisotropic conductive film and production method of the sameDEXERIALS CORP·Filed 2015·Granted Apr 19, 2022·0 cites·12 claims
- 4548US10154587B2Electrical connection materialDEXERIALS CORP·Filed 2014·Granted Dec 11, 2018·0 cites·8 claims
- 4648US7041237B2Adhesive and electric deviceSONY CORP·Filed 2002·Granted May 9, 2006·0 cites·11 claims
- 4747US8715833B2Anisotropic conductive filmYAMADA YASUNOBU·Filed 2009·Granted May 6, 2014·3 cites·11 claims
- 4846US10854571B2Anisotropic conductive film with conductive particles forming repeating units of polygonsDEXERIALS CORP·Filed 2017·Granted Dec 1, 2020·0 cites·16 claims
- 4945US2016351532A1Alignment method, method for connecting electronic component, method for manufacturing connection body, connection body and anisotropic conductive filmDEXERIALS CORP·Filed 2015·Application pending·0 cites
- 5043US11794444B2Anisotropic conductive filmDEXERIALS CORP·Filed 2017·Granted Oct 24, 2023·0 cites·19 claims
Showing the top 50 of 63 patent records by PatentIndex Score.
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