Inventor · disambiguated record
Cristina Somma
Also filed as: SOMMA CRISTINA
8 granted patents·2 pending applications·9 citations·filing 2018–2023
78Inventor score
Files withST MICROELECTRONICS SRL10
Top patents by PatentIndex Score
10 records- 0192US11276628B2Semiconductor package with die stacked on surface mounted devicesST MICROELECTRONICS SRL·Filed 2020·Granted Mar 15, 2022·4 cites·20 claims
- 0289US10593612B2SMDs integration on QFN by 3D stacked solutionST MICROELECTRONICS SRL·Filed 2018·Granted Mar 17, 2020·5 cites·20 claims
- 0381US12354932B2SMDs integration on QFN by 3D stacked solutionST MICROELECTRONICS SRL·Filed 2023·Granted Jul 8, 2025·0 cites·20 claims
- 0470US11842948B2SMDs integration on QFN by 3D stacked solutionST MICROELECTRONICS SRL·Filed 2021·Granted Dec 12, 2023·0 cites·20 claims
- 0569US11810839B2Semiconductor package with die stacked on surface mounted devicesST MICROELECTRONICS SRL·Filed 2022·Granted Nov 7, 2023·0 cites·19 claims
- 0668US11004775B2SMDS integration on QFN by 3D stacked solutionST MICROELECTRONICS SRL·Filed 2020·Granted May 11, 2021·0 cites·20 claims
- 0749US2019287881A1Semiconductor package with die stacked on surface mounted devicesST MICROELECTRONICS SRL·Filed 2018·Application pending·0 cites
- 0848US2024145364A1Semiconductor device and corresponding methodST MICROELECTRONICS SRL·Filed 2023·Application pending·0 cites
- 0947US11705388B2Assortment of substrates for semiconductor circuits, corresponding assortment of devices and methodST MICROELECTRONICS SRL·Filed 2020·Granted Jul 18, 2023·0 cites·13 claims
- 1042US11990442B2Semiconductor device and corresponding methodST MICROELECTRONICS SRL·Filed 2021·Granted May 21, 2024·0 cites·21 claims
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →