Inventor · disambiguated record
Bruce Greenwood
Also filed as: GREENWOOD BRUCE · GREENWOOD BRUCE B · GREENWOOD BRUCE BLAIR
10 granted patents·2 pending applications·48 citations·filing 2017–2025
85Inventor score
Files withSEMICONDUCTOR COMPONENTS IND LLC12
Top patents by PatentIndex Score
12 records- 0195US10431614B2Edge seals for semiconductor packagesSEMICONDUCTOR COMPONENTS IND LLC·Filed 2017·Granted Oct 1, 2019·21 cites·10 claims
- 0295US10026728B1Semiconductor device having biasing structure for self-isolating buried layer and method thereforSEMICONDUCTOR COMPONENTS IND LLC·Filed 2017·Granted Jul 17, 2018·21 cites·20 claims
- 0389US11545583B2Process of forming an electronic device including a non-volatile memory cellSEMICONDUCTOR COMPONENTS IND LLC·Filed 2021·Granted Jan 3, 2023·2 cites·19 claims
- 0487US10276556B2Semiconductor device having biasing structure for self-isolating buried layer and method thereforSEMICONDUCTOR COMPONENTS IND LLC·Filed 2018·Granted Apr 30, 2019·4 cites·20 claims
- 0584US12211865B2Edge seals for semiconductor packagesSEMICONDUCTOR COMPONENTS IND LLC·Filed 2024·Granted Jan 28, 2025·0 cites·20 claims
- 0680US11961859B2Edge seals for semiconductor packagesSEMICONDUCTOR COMPONENTS IND LLC·Filed 2023·Granted Apr 16, 2024·0 cites·20 claims
- 0775US2025151431A1Edge seals for semiconductor packagesSEMICONDUCTOR COMPONENTS IND LLC·Filed 2025·Application pending·0 cites
- 0861US11670655B2Edge seals for semiconductor packagesSEMICONDUCTOR COMPONENTS IND LLC·Filed 2019·Granted Jun 6, 2023·0 cites·11 claims
- 0961US10818516B2Semiconductor device having biasing structure for self-isolating buried layer and method thereforSEMICONDUCTOR COMPONENTS IND LLC·Filed 2019·Granted Oct 27, 2020·0 cites·20 claims
- 1061US2025374673A1Single-die galvanic isolation using silicon-on-insulator and deep trenchesSEMICONDUCTOR COMPONENTS IND LLC·Filed 2024·Application pending·0 cites
- 1153US12376333B2Configurable low ohmic power circuitsSEMICONDUCTOR COMPONENTS IND LLC·Filed 2022·Granted Jul 29, 2025·0 cites·20 claims
- 1247US11120941B2Methods of forming capacitorsSEMICONDUCTOR COMPONENTS IND LLC·Filed 2019·Granted Sep 14, 2021·0 cites·20 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →