Inventor · disambiguated record
Lejun Hu
Also filed as: HU LEJUN
3 granted patents·58 citations·filing 2011–2013
70Inventor score
Top patents by PatentIndex Score
3 records- 0195US8441104B1Electrical overstress protection using through-silicon-via (TSV)HU LEJUN·Filed 2011·Granted May 14, 2013·52 cites·20 claims
- 0273US9200968B2On-chip temperature sensor using interconnect metalCOLN MICHAEL·Filed 2012·Granted Dec 1, 2015·3 cites·16 claims
- 0373US8525299B2Electrical overstress protection using through-silicon-via (TSV)HU LEJUN·Filed 2013·Granted Sep 3, 2013·3 cites·17 claims
Join the waitlist — get patent alerts
Get an alert when Lejun Hu files or is granted a new patent.
We store only your email — no account needed. See our privacy policy.
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →