Inventor · disambiguated record
Haibing (Robin) Liu
Also filed as: LIU HAIBING ROBIN
1 granted patent·1 pending application·0 citations·filing 2010–2015
13Inventor score
Technology areasH10W
Top patents by PatentIndex Score
2 records- 0138US2015340435A1Multi-chip Package Module And A Doped Polysilicon Trench For Isolation And ConnectionMICROCHIP TECH INC·Filed 2015·Application pending·0 cites
- 0237US9048104B2Multi-chip package module and a doped polysilicon trench for isolation and connectionCHOY BENEDICT C K·Filed 2010·Granted Jun 2, 2015·0 cites·6 claims
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