Inventor · disambiguated record
Jiaming Ye
Also filed as: YE JIAMING
19 granted patents·1 pending application·10 citations·filing 2012–2021
88Inventor score
Top patents by PatentIndex Score
20 records- 0182US11742268B2Package structure applied to power converterSILERGY SEMICONDUCTOR TECHNOLOGY HANGZHOU LTD·Filed 2021·Granted Aug 29, 2023·1 cites·20 claims
- 0282US9559043B2Multi-level leadframe with interconnect areas for soldering conductive bumps, multi-level package assembly and method for manufacturing the sameSILERGY SEMICONDUCTOR TECHNOLOGY HANGZHOU LTD·Filed 2014·Granted Jan 31, 2017·6 cites·12 claims
- 0368US12438066B2Package structure for power converter and manufacture method thereofSILERGY SEMICONDUCTOR TECHNOLOGY HANGZHOU LTD·Filed 2021·Granted Oct 7, 2025·0 cites·19 claims
- 0465US9508677B2Chip package assembly and manufacturing method thereofSILERGY SEMICONDUCTOR TECHNOLOGY HANGZHOU LTD·Filed 2016·Granted Nov 29, 2016·2 cites·20 claims
- 0563US9595453B2Chip package method and package assemblySILERGY SEMICONDUCTOR TECHNOLOGY HANGZHOU LTD·Filed 2016·Granted Mar 14, 2017·1 cites·10 claims
- 0662US11232999B2Chip package structure and method for forming chip packageSILERGY SEMICONDUCTOR TECHNOLOGY HANGZHOU LTD·Filed 2020·Granted Jan 25, 2022·0 cites·8 claims
- 0757US11056421B2Package structure for power converter and manufacture method thereofSILERGY SEMICONDUCTOR TECHNOLOGY HANGZHOU LTD·Filed 2018·Granted Jul 6, 2021·0 cites·12 claims
- 0853US12394743B2Die attachment structure and method for manufacturing the sameSILERGY SEMICONDUCTOR TECHNOLOGY HANGZHOU LTD·Filed 2021·Granted Aug 19, 2025·0 cites·17 claims
- 0952US10741481B2Integrated package assembly for switching regulatorSILERGY SEMICONDUCTOR TECHNOLOGY HANGZHOU LTD·Filed 2018·Granted Aug 11, 2020·0 cites·12 claims
- 1051US10083895B2Package structure for power converter and manufacture method thereofSILERGY SEMICONDUCTOR TECHNOLOGY HANGZHOU LTD·Filed 2016·Granted Sep 25, 2018·0 cites·16 claims
- 1148US10615106B2Chip package structure and method for forming chip packageSILERGY SEMICONDUCTOR TECHNOLOGY HANGZHOU LTD·Filed 2016·Granted Apr 7, 2020·0 cites·8 claims
- 1246US10758903B2Microfluidic devices for multi-index biochemical detectionCAPITALBIO CORP·Filed 2013·Granted Sep 1, 2020·0 cites·26 claims
- 1345US10043738B2Integrated package assembly for switching regulatorSILERGY SEMICONDUCTOR TECHNOLOGY HANGZHOU LTD·Filed 2015·Granted Aug 7, 2018·0 cites·9 claims
- 1441US9671317B2Automatic injection device for microarray chip and automatic injection hybridization microarray chipYE JIAMING·Filed 2012·Granted Jun 6, 2017·0 cites·14 claims
- 1541US9101924B2Interface device for bio-chipYE JIAMING·Filed 2012·Granted Aug 11, 2015·0 cites·10 claims
- 1640US10128221B2Package assembly having interconnect for stacked electronic devices and method for manufacturing the sameSILERGY SEMICONDUCTOR TECHNOLOGY HANGZHOU LTD·Filed 2015·Granted Nov 13, 2018·0 cites·10 claims
- 1740US9699918B2Package assembly and method for manufacturing the sameSILERGY SEMICONDUCTOR TECHNOLOGY HANGZHOU LTD·Filed 2015·Granted Jul 4, 2017·0 cites·20 claims
- 1836US10333019B2Package structure of light emitter and light sensor with light-blocking layer and method for manufacturing the sameSILERGY SEMICONDUCTOR TECHNOLOGY HANGZHOU LTD·Filed 2017·Granted Jun 25, 2019·0 cites·23 claims
- 1932US9677133B2Biological chip hybridization systemYE JIAMING·Filed 2012·Granted Jun 13, 2017·0 cites·20 claims
- 2032US2015249068A1Chip package structureSILERGY SEMICONDUCTOR TECHNOLOGY HANGZHOU LTD·Filed 2015·Application pending·0 cites
Join the waitlist — get patent alerts
Get an alert when Jiaming Ye files or is granted a new patent.
We store only your email — no account needed. See our privacy policy.
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →