Inventor · disambiguated record
Charles R. Davis
Also filed as: DAVIS CHARLES MICHAEL · DAVIS CHARLES R · DAVIS CHARLES ROBERT · DAVIS JR CHARLES R
34 granted patents·4 pending applications·2,115 citations·filing 1978–2025
98Inventor score
Top patents by PatentIndex Score
38 records- 0197US5848143ACommunications system using a central controller to control at least one network and agent systemGEOTEL COMMUNICATIONS CORP·Filed 1996·Granted Dec 8, 1998·401 cites·51 claims
- 0297US5546452ACommunications system using a central controller to control at least one network and agent systemGEOTEL COMMUNICATIONS CORP·Filed 1995·Granted Aug 13, 1996·372 cites·72 claims
- 0397US5208068ALamination method for coating the sidewall or filling a cavity in a substrateIBM·Filed 1990·Granted May 4, 1993·143 cites·29 claims
- 0496US5878130ACommunications system and method for operating sameGEOTEL COMMUNICATIONS CORP·Filed 1998·Granted Mar 2, 1999·291 cites·28 claims
- 0591US5384690AFlex laminate package for a parallel processorIBM·Filed 1993·Granted Jan 24, 1995·61 cites·11 claims
- 0689US7098676B2Multi-functional structure for enhanced chip manufacturibility and reliability for low k dielectrics semiconductors and a crackstop integrity screen and monitorIBM·Filed 2003·Granted Aug 29, 2006·49 cites·12 claims
- 0789US5620782AMethod of fabricating a flex laminate packageIBM·Filed 1995·Granted Apr 15, 1997·59 cites·1 claims
- 0886US6486557B1Hybrid dielectric structure for improving the stiffness of back end of the line structuresIBM·Filed 2000·Granted Nov 26, 2002·48 cites·11 claims
- 0985US6650010B2Unique feature design enabling structural integrity for advanced low K semiconductor chipsIBM·Filed 2002·Granted Nov 18, 2003·42 cites·13 claims
- 1085US5280414AAu-Sn transient liquid bonding in high performance laminatesIBM·Filed 1990·Granted Jan 18, 1994·52 cites·6 claims
- 1184US5357005AReactive surface functionalizationIBM·Filed 1991·Granted Oct 18, 1994·51 cites·35 claims
- 1281US5460921AHigh density pattern template: materials and processes for the application of conductive pastesIBM·Filed 1993·Granted Oct 24, 1995·44 cites·15 claims
- 1380US5833666ACatheter fixation assemblyURESIL CORP·Filed 1995·Granted Nov 10, 1998·193 cites·17 claims
- 1479US4230906ASpeech digitizerTIME AND SPACE PROCESSING INC·Filed 1978·Granted Oct 28, 1980·33 cites·14 claims
- 1577US7009280B2Low-k interlevel dielectric layer (ILD)IBM·Filed 2004·Granted Mar 7, 2006·15 cites·17 claims
- 1676US4787077AProcess for optically storing information using materials having a single phase in both the crystalline state and the amorphous stateIBM·Filed 1987·Granted Nov 22, 1988·21 cites·4 claims
- 1774US7294565B2Method of fabricating a wire bond pad with Ni/Au metallizationIBM·Filed 2003·Granted Nov 13, 2007·18 cites·20 claims
- 1872US6531759B2Alpha particle shield for integrated circuitIBM·Filed 2001·Granted Mar 11, 2003·19 cites·6 claims
- 1971US5789121AHigh density template: materials and processes for the application of conductive pastesIBM·Filed 1997·Granted Aug 4, 1998·28 cites·5 claims
- 2071US5421507AAu-Sn transient liquid bonding in high performance laminatesIBM·Filed 1993·Granted Jun 6, 1995·27 cites·6 claims
- 2168US5509196AMethod of fabricating a flex laminate packageIBM·Filed 1994·Granted Apr 23, 1996·24 cites·3 claims
- 2266US6815346B2Unique feature design enabling structural integrity for advanced low k semiconductor chipsIBM·Filed 2003·Granted Nov 9, 2004·13 cites·7 claims
- 2365US5679444AMethod for producing multi-layer circuit board and resulting article of manufactureIBM·Filed 1996·Granted Oct 21, 1997·21 cites·5 claims
- 2461US5340451AProcess for producing a metal organic polymer combinationIBM·Filed 1993·Granted Aug 23, 1994·22 cites·35 claims
- 2561US2025322942A1Computer-implemented, ai-based recognition platformDAVIS HOLDINGS OF NORTH CAROLINA INC·Filed 2025·Application pending·0 cites
- 2651US6912281B2Route delay sensitive echo cancellationTEXAS INSTRUMENTS INC·Filed 2002·Granted Jun 28, 2005·2 cites·14 claims
- 2751US5536579ADesign of high density structures with laser etch stopIBM·Filed 1994·Granted Jul 16, 1996·16 cites·8 claims
- 2849US5709805AMethod for producing multi-layer circuit board and resulting article of manufactureIBM·Filed 1996·Granted Jan 20, 1998·11 cites·14 claims
- 2949US2008073790A1METHOD OF FABRICATING A WIRE BOND PAD WITH Ni/Au METALLIZATIONIBM·Filed 2007·Application pending·0 cites
- 3046US6975722B2Dual echo canceller with fast reflector identificationTEXAS INSTRUMENTS INC·Filed 2002·Granted Dec 13, 2005·2 cites·5 claims
- 3146US5206074AAdhesives on polymide films and methods of preparing themIBM·Filed 1991·Granted Apr 27, 1993·12 cites·4 claims
- 3244US11439969B2Accelerated cooling process for reactorsCHEVRON USA INC·Filed 2020·Granted Sep 13, 2022·0 cites·17 claims
- 3343US5626771ADesign of high density structures with laser etch stopIBM·Filed 1995·Granted May 6, 1997·10 cites·7 claims
- 3440US2003182464A1Management of message queuesFiled 2002·Application pending·0 cites
- 3540US2002021838A1Adaptively weighted, partitioned context edit distance string matchingLIAISON TECHNOLOGY INC·Filed 2001·Application pending·0 cites
- 3633US5059363AMethod for extruding silicone tubingURESIL INC·Filed 1991·Granted Oct 22, 1991·8 cites·7 claims
- 3729US5872337AChip carrier and cable assembly reinforced at edgesIBM·Filed 1996·Granted Feb 16, 1999·0 cites·16 claims
- 3828US4722160ACombination grave marker and flower receptacleDAVIS CHARLES R·Filed 1986·Granted Feb 2, 1988·7 cites·11 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →