Inventor · disambiguated record
Wai Yew Lo
Also filed as: LO WAI · LO WAI Y · LO WAI YEW
31 granted patents·16 pending applications·324 citations·filing 2002–2018
97Inventor score
Top patents by PatentIndex Score
47 records- 0195US7160755B2Method of forming a substrateless semiconductor packageFREESCALE SEMICONDUCTOR INC·Filed 2005·Granted Jan 9, 2007·58 cites·17 claims
- 0293US8378435B2Pressure sensor and method of assembling sameLO WAI YEW·Filed 2010·Granted Feb 19, 2013·16 cites·20 claims
- 0392US6885093B2Stacked die semiconductor deviceFREESCALE SEMICONDUCTOR INC·Filed 2002·Granted Apr 26, 2005·80 cites·14 claims
- 0487US7211466B2Stacked die semiconductor deviceFREESCALE SEMICONDUCTOR INC·Filed 2005·Granted May 1, 2007·16 cites·8 claims
- 0586US9297713B2Pressure sensor device with through silicon viaLO WAI YEW·Filed 2014·Granted Mar 29, 2016·8 cites·10 claims
- 0686US7473586B1Method of forming flip-chip bump carrier type packageFREESCALE SEMICONDUCTOR INC·Filed 2007·Granted Jan 6, 2009·15 cites·14 claims
- 0786US7378298B2Method of making stacked die packageFREESCALE SEMICONDUCTOR INC·Filed 2006·Granted May 27, 2008·14 cites·16 claims
- 0885US7452750B2Capacitor attachment methodFREESCALE SEMICONDUCTOR INC·Filed 2006·Granted Nov 18, 2008·13 cites·20 claims
- 0984US7554185B2Flip chip and wire bond semiconductor packageFREESCALE SEMICONDUCTOR INC·Filed 2005·Granted Jun 30, 2009·21 cites·9 claims
- 1083US9190352B2Multi-die sensor deviceTIU KONG BEE·Filed 2013·Granted Nov 17, 2015·8 cites·10 claims
- 1183US7741196B2Semiconductor wafer with improved crack protectionFREESCALE SEMICONDUCTOR INC·Filed 2007·Granted Jun 22, 2010·9 cites·15 claims
- 1280US9362479B2Package-in-package semiconductor sensor deviceLO WAI YEW·Filed 2014·Granted Jun 7, 2016·5 cites·7 claims
- 1380US7531383B2Array quad flat no-lead package and method of forming sameFREESCALE SEMICONDUCTOR INC·Filed 2006·Granted May 12, 2009·9 cites·16 claims
- 1478US8778704B1Solar powered IC chipLAU TECK BENG·Filed 2013·Granted Jul 15, 2014·6 cites·19 claims
- 1578US7955953B2Method of forming stacked die packageFREESCALE SEMICONDUCTOR INC·Filed 2007·Granted Jun 7, 2011·8 cites·16 claims
- 1677US8941194B1Pressure sensor device having bump chip carrier (BCC)LO WAI YEW·Filed 2013·Granted Jan 27, 2015·4 cites·10 claims
- 1777US8716846B2Pressure sensor and method of packaging sameYAO JINZHONG·Filed 2011·Granted May 6, 2014·4 cites·7 claims
- 1877US7745260B2Method of forming semiconductor packageFREESCALE SEMICONDUCTOR INC·Filed 2008·Granted Jun 29, 2010·7 cites·20 claims
- 1975US11056457B2Semiconductor device with bond wire reinforcement structureNXP USA INC·Filed 2018·Granted Jul 6, 2021·2 cites·15 claims
- 2072US8809078B1Solar powered IC chipLAU TECK BENG·Filed 2013·Granted Aug 19, 2014·4 cites·17 claims
- 2169US9029999B2Semiconductor sensor device with footed lidLO WAI YEW·Filed 2011·Granted May 12, 2015·2 cites·8 claims
- 2269US8981541B2Quad flat semiconductor device with additional contactsTIU KONG BEE·Filed 2013·Granted Mar 17, 2015·3 cites·9 claims
- 2369US8802474B1Pressure sensor and method of packaging sameYAO JINZHONG·Filed 2014·Granted Aug 12, 2014·2 cites·10 claims
- 2469US7886609B2Pressure sensor packageFREESCALE SEMICONDUCTOR INC·Filed 2009·Granted Feb 15, 2011·7 cites·20 claims
- 2560US8283780B2Surface mount semiconductor deviceLO WAI YEW·Filed 2010·Granted Oct 9, 2012·2 cites·7 claims
- 2654US9105469B2Defect mitigation structures for semiconductor devicesPATEL ZUBIN P·Filed 2011·Granted Aug 11, 2015·1 cites·100 claims
- 2753US2015024535A1Semiconductor sensor device with footed lidFREESCALE SEMICONDUCTOR INC·Filed 2014·Application pending·0 cites
- 2848US9638596B2Cavity-down pressure sensor deviceLO WAI YEW·Filed 2014·Granted May 2, 2017·0 cites·12 claims
- 2947US8546169B1Pressure sensor device and method of assembling sameLO WAI YEW·Filed 2012·Granted Oct 1, 2013·0 cites·10 claims
- 3045US9209120B2Semiconductor package with lead mounted power barTIU KONG BEE·Filed 2014·Granted Dec 8, 2015·0 cites·14 claims
- 3145US2016069763A1Semiconductor sensor device formed with gel sheetLO WAI YEW·Filed 2014·Application pending·0 cites
- 3244US2015340305A1Stacked die package with redistribution layerLO WAI YEW·Filed 2014·Application pending·0 cites
- 3343US2015162269A1Semiconductor die package with insulated wires for routing power signalsLO WAI YEW·Filed 2013·Application pending·0 cites
- 3443US2007092996A1Method of making semiconductor package with reduced moisture sensitivityFREESCALE SEMICONDUCTOR INC·Filed 2006·Application pending·0 cites
- 3543US2014374855A1Pressure sensor and method of packaging sameLO WAI YEW·Filed 2013·Application pending·0 cites
- 3642US2007281397A1Method of forming semiconductor packaged deviceLO WAI YEW·Filed 2006·Application pending·0 cites
- 3742US2015069537A1Package-on-package semiconductor sensor deviceLO WAI YEW·Filed 2013·Application pending·0 cites
- 3841US2016086880A1Copper wire through silicon via connectionKALANDAR NAVAS KHAN ORATTI·Filed 2014·Application pending·0 cites
- 3939US8460972B2Method of forming semiconductor packageLO WAI YEW·Filed 2010·Granted Jun 11, 2013·0 cites·7 claims
- 4039US2012139067A1Pressure sensor and method of packaging sameLO WAI YEW·Filed 2011·Application pending·0 cites
- 4139US2012306031A1Semiconductor sensor device and method of packaging sameLO WAI YEW·Filed 2011·Application pending·0 cites
- 4238US2014374848A1Semiconductor sensor device with metal lidKOH WEN SHI·Filed 2013·Application pending·0 cites
- 4337US2007026573A1Method of making a stacked die packageISMAIL AMINUDDIN·Filed 2005·Application pending·0 cites
- 4434US9698093B2Universal BGA substrateFREESCALE SEMICONDUCTOR INC·Filed 2015·Granted Jul 4, 2017·0 cites·9 claims
- 4534US2012073859A1Polymer core wireLO WAI YEW·Filed 2010·Application pending·0 cites
- 4633US2006012055A1Semiconductor package including rivet for bonding of lead postsFOONG CHEE S·Filed 2004·Application pending·0 cites
- 4729US2003160311A1Stacked die semiconductor deviceFiled 2002·Application pending·0 cites
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