Inventor · disambiguated record
Jeffrey A. Ridley
Also filed as: RIDLEY JEFFREY A · RIDLEY JEFFREY ALAN
23 granted patents·1,116 citations·filing 1987–2010
97Inventor score
Top patents by PatentIndex Score
23 records- 0197US6036872AMethod for making a wafer-pair having sealed chambersHONEYWELL INC·Filed 1998·Granted Mar 14, 2000·170 cites·24 claims
- 0297US5895233AIntegrated silicon vacuum micropackage for infrared devicesHONEYWELL INC·Filed 1997·Granted Apr 20, 1999·252 cites·4 claims
- 0395US4784721AIntegrated thin-film diaphragm; backside etchHONEYWELL INC·Filed 1988·Granted Nov 15, 1988·189 cites·13 claims
- 0491US6287940B1Dual wafer attachment processHONEYWELL INT INC·Filed 1999·Granted Sep 11, 2001·106 cites·17 claims
- 0590US7875944B2Integral topside vacuum packageHONEYWELL INT INC·Filed 2007·Granted Jan 25, 2011·12 cites·8 claims
- 0690US6582985B2SOI/glass process for forming thin silicon micromachined structuresHONEYWELL INT INC·Filed 2000·Granted Jun 24, 2003·56 cites·35 claims
- 0787US6359333B1Wafer-pair having deposited layer sealed chambersHONEYWELL INT INC·Filed 1998·Granted Mar 19, 2002·87 cites·17 claims
- 0885US6888233B2Systems for buried electrical feedthroughs in a glass-silicon MEMS processHONEYWELL INT INC·Filed 2003·Granted May 3, 2005·31 cites·11 claims
- 0984US7396698B2Methods and systems for providing MEMS devices with a top cap and upper sense plateHONEYWELL INT INC·Filed 2005·Granted Jul 8, 2008·11 cites·11 claims
- 1080US8188561B2Integral topside vacuum packageHIGASHI ROBERT E·Filed 2010·Granted May 29, 2012·2 cites·6 claims
- 1179US4914742AThin film orthogonal microsensor for air flow and methodHONEYWELL INC·Filed 1987·Granted Apr 3, 1990·53 cites·7 claims
- 1274US7549206B2Shell flow sensorHONEYWELL INT INC·Filed 2007·Granted Jun 23, 2009·8 cites·13 claims
- 1374US7005732B2Methods and systems for providing MEMS devices with a top cap and upper sense plateHONEYWELL INT INC·Filed 2003·Granted Feb 28, 2006·23 cites·14 claims
- 1473US6924165B2Methods and systems for buried electrical feedthroughs in a glass-silicon MEMS processHONEYWELL INT INC·Filed 2004·Granted Aug 2, 2005·23 cites·17 claims
- 1572US7396476B2Method for reducing harmonic distortion in comb drive devicesHONEYWELL INT INC·Filed 2006·Granted Jul 8, 2008·6 cites·22 claims
- 1669US6808956B2Thin micromachined structuresHONEYWELL INT INC·Filed 2000·Granted Oct 26, 2004·15 cites·42 claims
- 1767US7276798B2Integral topside vacuum packageHONEYWELL INT INC·Filed 2003·Granted Oct 2, 2007·9 cites·5 claims
- 1861US4895616AMethod for making thin film orthogonal microsensor for air flowHONEYWELL INC·Filed 1989·Granted Jan 23, 1990·26 cites·12 claims
- 1958USRE39143EMethod for making a wafer-pair having sealed chambersHONEYWELL INT INC·Filed 2001·Granted Jun 27, 2006·2 cites·66 claims
- 2055US4891977AMicrobridge sensor bonding pad design for improved adhesionHONEYWELL INC·Filed 1988·Granted Jan 9, 1990·14 cites·14 claims
- 2150US6040749AApparatus and method for operating a micromechanical switchHONEYWELL INC·Filed 1998·Granted Mar 21, 2000·11 cites·21 claims
- 2244US6246305B1Apparatus and method for operating a micromechanical switchHONEYWELL INT INC·Filed 1999·Granted Jun 12, 2001·8 cites·18 claims
- 2343US7012322B2Method for reducing harmonic distortion in comb drive devicesHONEYWELL INT INC·Filed 2003·Granted Mar 14, 2006·2 cites·32 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →