Inventor · disambiguated record
Flynn Carson
Also filed as: CARSON FLYNN · CARSON FLYNN P
45 granted patents·10 pending applications·1,133 citations·filing 1996–2025
98Inventor score
Top patents by PatentIndex Score
55 records- 0199US7429786B2Semiconductor package including second substrate and having exposed substrate surfaces on upper and lower sidesSTATS CHIPPAC LTD·Filed 2006·Granted Sep 30, 2008·177 cites·15 claims
- 0299US7354800B2Method of fabricating a stacked integrated circuit package systemSTATS CHIPPAC LTD·Filed 2006·Granted Apr 8, 2008·119 cites·17 claims
- 0398US7247519B2Method for making a semiconductor multi-package module having inverted bump chip carrier second packageCHIPPAC INC·Filed 2006·Granted Jul 24, 2007·42 cites·6 claims
- 0498US7053477B2Semiconductor multi-package module having inverted bump chip carrier second packageCHIPPAC INC·Filed 2003·Granted May 30, 2006·125 cites·14 claims
- 0597US9679801B2Dual molded stack TSV packageAPPLE INC·Filed 2015·Granted Jun 13, 2017·25 cites·17 claims
- 0696US9721903B2Vertical interconnects for self shielded system in package (SiP) modulesAPPLE INC·Filed 2015·Granted Aug 1, 2017·31 cites·20 claims
- 0796US9589936B23D integration of fanout wafer level packagesAPPLE INC·Filed 2015·Granted Mar 7, 2017·19 cites·20 claims
- 0895US7494847B2Method for making a semiconductor multi-package module having inverted wire bond carrier second packageCHIPPAC INC·Filed 2007·Granted Feb 24, 2009·18 cites·6 claims
- 0994US8067268B2Stacked integrated circuit package system and method for manufacturing thereofCARSON FLYNN·Filed 2010·Granted Nov 29, 2011·26 cites·15 claims
- 1094US6967126B2Method for manufacturing plastic ball grid array with integral heatsinkCHIPPAC INC·Filed 2003·Granted Nov 22, 2005·80 cites·17 claims
- 1194US6661083B2Plastic semiconductor packageCHIPPAC INC·Filed 2002·Granted Dec 9, 2003·102 cites·10 claims
- 1293US8598690B2Semiconductor device having conductive vias in peripheral region connecting shielding layer to groundCHANDRA HARRY·Filed 2012·Granted Dec 3, 2013·20 cites·19 claims
- 1393US8110441B2Method of electrically connecting a shielding layer to ground through a conductive via disposed in peripheral region around semiconductor dieCHANDRA HARRY·Filed 2008·Granted Feb 7, 2012·37 cites·12 claims
- 1493US7253511B2Semiconductor multipackage module including die and inverted land grid array package stacked over ball grid array packageCHIPPAC INC·Filed 2004·Granted Aug 7, 2007·67 cites·44 claims
- 1592US7750454B2Stacked integrated circuit package systemSTATS CHIPPAC LTD·Filed 2008·Granted Jul 6, 2010·21 cites·5 claims
- 1691US8409920B2Integrated circuit package system for package stacking and method of manufacture thereforPENDSE RAJENDRA D·Filed 2008·Granted Apr 2, 2013·20 cites·10 claims
- 1791US7692279B2Semiconductor multipackage module including die and inverted land grid array package stacked over ball grid array packageCHIPPAC INC·Filed 2007·Granted Apr 6, 2010·18 cites·8 claims
- 1889US9899239B2Carrier ultra thin substrateAPPLE INC·Filed 2015·Granted Feb 20, 2018·6 cites·17 claims
- 1988US10115677B2Vertical interconnects for self shielded system in package (SiP) modulesAPPLE INC·Filed 2017·Granted Oct 30, 2018·5 cites·18 claims
- 2088US7687315B2Stacked integrated circuit package system and method of manufacture thereforSTATS CHIPPAC LTD·Filed 2008·Granted Mar 30, 2010·14 cites·20 claims
- 2187US9484279B2Semiconductor device and method of forming EMI shielding layer with conductive material around semiconductor diePAGAILA REZA A·Filed 2010·Granted Nov 1, 2016·8 cites·5 claims
- 2286US10522475B2Vertical interconnects for self shielded system in package (SiP) modulesAPPLE INC·Filed 2018·Granted Dec 31, 2019·4 cites·19 claims
- 2385US12074077B2Flexible package architecture concept in fanoutAPPLE INC·Filed 2020·Granted Aug 27, 2024·2 cites·12 claims
- 2485US11395408B2Wafer-level passive array packagingAPPLE INC·Filed 2020·Granted Jul 19, 2022·2 cites·13 claims
- 2584US8723302B2Integrated circuit package system with input/output expansionCHANDRA HARRY·Filed 2008·Granted May 13, 2014·14 cites·20 claims
- 2682US7829382B2Method for making semiconductor multipackage module including die and inverted land grid array package stacked over ball grid array packageCHIPPAC INC·Filed 2010·Granted Nov 9, 2010·5 cites·20 claims
- 2780US8241965B2Integrated circuit packaging system with pad connection and method of manufacture thereofBATHAN HENRY DESCALZO·Filed 2010·Granted Aug 14, 2012·5 cites·20 claims
- 2878US5868301ASemiconductor inner lead bonding toolTESSERA INC·Filed 1996·Granted Feb 9, 1999·52 cites·19 claims
- 2977US10643952B2Semiconductor device and method of forming EMI shielding layer with conductive material around semiconductor dieJCET SEMICONDUCTOR SHAOXING CO LTD·Filed 2016·Granted May 5, 2020·2 cites·25 claims
- 3077US10631410B2Stacked printed circuit board packagesAPPLE INC·Filed 2017·Granted Apr 21, 2020·2 cites·16 claims
- 3177US6614123B2Plastic ball grid array package with integral heatsinkCHIPPAC INC·Filed 2001·Granted Sep 2, 2003·18 cites·21 claims
- 3276US8030756B2Plastic ball grid array package with integral heatsinkCHIPPAC INC·Filed 2007·Granted Oct 4, 2011·5 cites·27 claims
- 3373US7741154B2Integrated circuit package system with stacking moduleSTATS CHIPPAC LTD·Filed 2008·Granted Jun 22, 2010·5 cites·20 claims
- 3473US2025183127A1Molded Silicon on Passive PackageAPPLE INC·Filed 2024·Application pending·0 cites
- 3572US9331007B2Semiconductor device and method of forming conductive ink layer as interconnect structure between semiconductor packagesSTATS CHIPPAC LTD·Filed 2012·Granted May 3, 2016·3 cites·19 claims
- 3671US9236319B2Stacked integrated circuit package systemHA JONG-WOO·Filed 2008·Granted Jan 12, 2016·5 cites·16 claims
- 3770US2025266611A1System packaging for millimeter wave antennasAPPLE INC·Filed 2025·Application pending·0 cites
- 3867US12165956B2Molded silicon on passive packageAPPLE INC·Filed 2021·Granted Dec 10, 2024·0 cites·15 claims
- 3965US12107283B2Cell packaging techniquesAPPLE INC·Filed 2021·Granted Oct 1, 2024·0 cites·20 claims
- 4065US10535611B2Substrate-less integrated componentsAPPLE INC·Filed 2016·Granted Jan 14, 2020·1 cites·18 claims
- 4165US7217598B2Method for manufacturing plastic ball grid array package with integral heatsinkCHIPPAC INC·Filed 2005·Granted May 15, 2007·2 cites·18 claims
- 4262US12266846B2System packaging for millimeter wave antennasAPPLE INC·Filed 2021·Granted Apr 1, 2025·0 cites·20 claims
- 4361US2025300120A1Wafer Level Land Grid ArrayAPPLE INC·Filed 2024·Application pending·0 cites
- 4460US10109593B2Self shielded system in package (SiP) modulesAPPLE INC·Filed 2015·Granted Oct 23, 2018·1 cites·18 claims
- 4558US2025096096A1Electronic Package Molded Vertical InterconnectionAPPLE INC·Filed 2023·Application pending·0 cites
- 4657US6791169B2Compliant semiconductor package with anisotropic conductive material interconnects and methods thereforTESSERA INC·Filed 2002·Granted Sep 14, 2004·6 cites·18 claims
- 4757US6468830B1Compliant semiconductor package with anisotropic conductive material interconnects and methods thereforTESSERA INC·Filed 1999·Granted Oct 22, 2002·19 cites·16 claims
- 4856US10991659B2Substrate-less integrated componentsAPPLE INC·Filed 2019·Granted Apr 27, 2021·0 cites·18 claims
- 4954US2025328010A1Light Projector Module with Directly Bonded and Orthogonal Rigid ComponentsAPPLE INC·Filed 2025·Application pending·0 cites
- 5050US2018082858A1Carrier ultra thin substrateAPPLE INC·Filed 2017·Application pending·0 cites
Showing the top 50 of 55 patent records by PatentIndex Score.
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