Inventor · disambiguated record
Ran Fu
Also filed as: FU RAN
5 granted patents·33 citations·filing 2004–2022
78Inventor score
Technology areasH10W
Top patents by PatentIndex Score
5 records- 0177US7462926B2Leadframe comprising tin plating or an intermetallic layer formed therefromASM ASSEMBLY AUTOMATION LTD·Filed 2005·Granted Dec 9, 2008·9 cites·16 claims
- 0272USD1055973SDisplay screen or portion thereof with animated graphical user interfaceYAHOO JAPAN CORP·Filed 2022·Granted Dec 31, 2024·5 cites·1 claims
- 0370US7246735B2Wire clamping plateASM ASSEMBLY AUTOMATION LTD·Filed 2005·Granted Jul 24, 2007·5 cites·8 claims
- 0455US6991967B2Apparatus and method for die attachmentASM ASSEMBLY AUTOMATION LTD·Filed 2004·Granted Jan 31, 2006·8 cites·16 claims
- 0552US7458495B2Flip chip bonding toolASM ASSEMBLY AUTOMATION LTD·Filed 2004·Granted Dec 2, 2008·6 cites·12 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →