Inventor · disambiguated record
Phillip Duane Isaacs
Also filed as: ISAACS PHILLIP · ISAACS PHILLIP D · ISAACS PHILLIP DUANE
50 granted patents·1,360 citations·filing 1993–2021
99Inventor score
Top patents by PatentIndex Score
50 records- 0198US9858776B1Tamper-respondent assembly with nonlinearity monitoringIBM·Filed 2016·Granted Jan 2, 2018·14 cites·17 claims
- 0298US9560737B2Electronic package with heat transfer element(s)IBM·Filed 2015·Granted Jan 31, 2017·34 cites·18 claims
- 0398US8961280B2Method of manufacturing a venting device for tamper resistant electronic modulesDANGLER JOHN RICHARD·Filed 2012·Granted Feb 24, 2015·65 cites·26 claims
- 0498US8287336B2Method of manufacturing a venting device for tamper resistant electronic modulesDANGLER JOHN RICHARD·Filed 2007·Granted Oct 16, 2012·72 cites·18 claims
- 0597US9911012B2Overlapping, discrete tamper-respondent sensorsIBM·Filed 2015·Granted Mar 6, 2018·14 cites·9 claims
- 0696US9936573B2Tamper-respondent assembliesIBM·Filed 2015·Granted Apr 3, 2018·13 cites·13 claims
- 0796US9924591B2Tamper-respondent assembliesIBM·Filed 2015·Granted Mar 20, 2018·13 cites·20 claims
- 0896US9916744B2Multi-layer stack with embedded tamper-detect protectionIBM·Filed 2016·Granted Mar 13, 2018·13 cites·11 claims
- 0995US7214874B2Venting device for tamper resistant electronic modulesIBM·Filed 2004·Granted May 8, 2007·77 cites·22 claims
- 1093US6302596B1Small form factor optoelectronic transceiversIBM·Filed 1999·Granted Oct 16, 2001·142 cites·29 claims
- 1192US10217336B2Multi-layer stack with embedded tamper-detect protectionIBM·Filed 2018·Granted Feb 26, 2019·5 cites·10 claims
- 1292US6300578B1Pad-on-via assembly techniqueIBM·Filed 2000·Granted Oct 9, 2001·52 cites·7 claims
- 1392US5275330ASolder ball connect pad-on-via assembly processIBM·Filed 1993·Granted Jan 4, 1994·231 cites·11 claims
- 1491US10136519B2Circuit layouts of tamper-respondent sensorsIBM·Filed 2016·Granted Nov 20, 2018·6 cites·12 claims
- 1591US9978231B2Tamper-respondent assembly with protective wrap(s) over tamper-respondent sensor(s)IBM·Filed 2015·Granted May 22, 2018·14 cites·20 claims
- 1691US6127204AColumn grid array or ball grid array pad on viaIBM·Filed 1998·Granted Oct 3, 2000·83 cites·15 claims
- 1790US10169968B1Multi-layer stack with embedded tamper-detect protectionIBM·Filed 2018·Granted Jan 1, 2019·4 cites·11 claims
- 1890US10169967B1Multi-layer stack with embedded tamper-detect protectionIBM·Filed 2018·Granted Jan 1, 2019·4 cites·13 claims
- 1990US10143090B2Circuit layouts of tamper-respondent sensorsIBM·Filed 2015·Granted Nov 27, 2018·6 cites·19 claims
- 2089US10115275B2Multi-layer stack with embedded tamper-detect protectionIBM·Filed 2017·Granted Oct 30, 2018·4 cites·9 claims
- 2187US5905636AHeat dissipation apparatus and method for attaching a heat dissipation apparatus to an electronic deviceIBM·Filed 1998·Granted May 18, 1999·72 cites·9 claims
- 2286US10331915B2Overlapping, discrete tamper-respondent sensorsIBM·Filed 2017·Granted Jun 25, 2019·3 cites·2 claims
- 2386US10172239B2Tamper-respondent sensors with formed flexible layer(s)IBM·Filed 2015·Granted Jan 1, 2019·4 cites·19 claims
- 2485US11812562B2Creating a standoff for a low-profile component without adding a process stepIBM·Filed 2021·Granted Nov 7, 2023·1 cites·15 claims
- 2585US10242543B2Tamper-respondent assembly with nonlinearity monitoringIBM·Filed 2017·Granted Mar 26, 2019·3 cites·20 claims
- 2685US10237964B2Manufacturing electronic package with heat transfer element(s)IBM·Filed 2015·Granted Mar 19, 2019·4 cites·10 claims
- 2785US6076726APad-on-via assembly techniqueIBM·Filed 1998·Granted Jun 20, 2000·50 cites·7 claims
- 2885US5745344AHeat dissipation apparatus and method for attaching a heat dissipation apparatus to an electronic deviceIBM·Filed 1995·Granted Apr 28, 1998·67 cites·12 claims
- 2983US5446960AAlignment apparatus and method for placing modules on a circuit boardIBM·Filed 1994·Granted Sep 5, 1995·51 cites·10 claims
- 3082US6261404B1Heat dissipation apparatus and method for attaching a heat dissipation apparatus to an electronic deviceIBM·Filed 1999·Granted Jul 17, 2001·52 cites·13 claims
- 3180US11238726B2Control of driverless vehicles in construction zonesIBM·Filed 2016·Granted Feb 1, 2022·4 cites·17 claims
- 3280US10334722B2Tamper-respondent assembliesIBM·Filed 2017·Granted Jun 25, 2019·2 cites·5 claims
- 3376US10685146B2Overlapping, discrete tamper-respondent sensorsIBM·Filed 2019·Granted Jun 16, 2020·1 cites·16 claims
- 3476US5873512AApplication of low temperature metallurgical paste to form a bond structure to attach an electronic component to a carrierIBM·Filed 1997·Granted Feb 23, 1999·42 cites·11 claims
- 3571US10395067B2Method of fabricating a tamper-respondent sensor assemblyIBM·Filed 2016·Granted Aug 27, 2019·1 cites·12 claims
- 3671US10257939B2Method of fabricating tamper-respondent sensorIBM·Filed 2016·Granted Apr 9, 2019·1 cites·10 claims
- 3771US5789930AApparatus and method to test for known good dieIBM·Filed 1995·Granted Aug 4, 1998·33 cites·8 claims
- 3868US5557503ACircuit card having a large module strain relief and heat sink supportIBM·Filed 1995·Granted Sep 17, 1996·29 cites·12 claims
- 3964US5806753AApplication of low temperature metallurgical paste to form a bond structure to attach an electronic component to a carrierIBM·Filed 1995·Granted Sep 15, 1998·26 cites·24 claims
- 4061US11404287B2Fixture facilitating heat sink fabricationIBM·Filed 2020·Granted Aug 2, 2022·0 cites·16 claims
- 4160US10825051B2Dynamic billboard advertisement for vehicular trafficIBM·Filed 2017·Granted Nov 3, 2020·0 cites·7 claims
- 4259US9462703B2Solder void reduction between electronic packages and printed circuit boardsIBM·Filed 2013·Granted Oct 4, 2016·0 cites·14 claims
- 4358US10956941B2Dynamic billboard advertisement for vehicular trafficIBM·Filed 2017·Granted Mar 23, 2021·0 cites·13 claims
- 4457US5651493AMethod of performing solder joint analysis of semi-conductor componentsIBM·Filed 1995·Granted Jul 29, 1997·22 cites·15 claims
- 4556US9839128B2Solder void reduction between electronic packages and printed circuit boardsIBM·Filed 2016·Granted Dec 5, 2017·0 cites·8 claims
- 4656US9426900B2Solder void reduction for component attachment to printed circuit boardsGLOBALFOUNDRIES INC·Filed 2013·Granted Aug 23, 2016·0 cites·14 claims
- 4754US6572009B2Passive and active heat retention device for solder fountain reworkIBM·Filed 2002·Granted Jun 3, 2003·4 cites·8 claims
- 4851US10978313B2Fixture facilitating heat sink fabricationIBM·Filed 2018·Granted Apr 13, 2021·0 cites·15 claims
- 4950US5861663AColumn grid array or ball grid array pad on viaIBM·Filed 1997·Granted Jan 19, 1999·12 cites·21 claims
- 5046US6343732B1Passive and active heat retention device for solder fountain reworkIBM·Filed 1999·Granted Feb 5, 2002·10 cites·10 claims
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