Inventor · disambiguated record
Hwan Pil Park
Also filed as: PARK HWAN PIL
7 granted patents·2 pending applications·21 citations·filing 2003–2024
74Inventor score
Top patents by PatentIndex Score
9 records- 0177US7022628B2Method for forming quantum dots using metal thin film or metal powderUNIV SOGANG IND UNIV COOP FOUN·Filed 2003·Granted Apr 4, 2006·20 cites·22 claims
- 0274US11239175B2Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2020·Granted Feb 1, 2022·1 cites·20 claims
- 0359US11876083B2Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2021·Granted Jan 16, 2024·0 cites·20 claims
- 0457US2025096201A1Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 0556US12283578B2Semiconductor package and method of fabricating sameSAMSUNG ELECTRONICS CO LTD·Filed 2022·Granted Apr 22, 2025·0 cites·18 claims
- 0656US11948873B2Semiconductor package including a support solder ballSAMSUNG ELECTRONICS CO LTD·Filed 2021·Granted Apr 2, 2024·0 cites·20 claims
- 0754US11908806B2Semiconductor package and method of fabricating the sameSAMSUNG ELECTRONICS CO LTD·Filed 2021·Granted Feb 20, 2024·0 cites·19 claims
- 0853US2024055405A1Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2023·Application pending·0 cites
- 0952US11854989B2Semiconductor package substrate and semiconductor package including the sameSAMSUNG ELECTRONICS CO LTD·Filed 2021·Granted Dec 26, 2023·0 cites·20 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →