Inventor · disambiguated record
Chang Beom Chung
Also filed as: CHUNG CHANG B · CHUNG CHANG BEOM
4 granted patents·6 pending applications·14 citations·filing 2007–2011
68Inventor score
Top patents by PatentIndex Score
10 records- 0176US8309219B2Multi-function tape for a semiconductor package and method of manufacturing a semiconductor device using the sameHWANG YONG HA·Filed 2010·Granted Nov 13, 2012·7 cites·16 claims
- 0267US8211540B2Adhesive film composition, associated dicing die bonding film, die package, and associated methodsHONG YONG WOO·Filed 2008·Granted Jul 3, 2012·6 cites·23 claims
- 0362US8394493B2Bonding film composition for semiconductor assembly, bonding film therefrom, and dicing die bond film comprising the sameHONG YONG WOO·Filed 2007·Granted Mar 12, 2013·1 cites·10 claims
- 0457US8193259B2UV-curable pressure-sensitive adhesive composition with a fluorinated acrylic binder resin and pressure-sensitive adhesive film using the sameCHOI SEUNG JIB·Filed 2008·Granted Jun 5, 2012·0 cites·20 claims
- 0546US2008108721A1Photocurable pressure-sensitive adhesive composition including acrylic binder resin, adhesive tape using the same, and associated methodsHA KYOUNG J·Filed 2007·Application pending·0 cites
- 0645US2009141472A1Adhesive composition for die bonding in semiconductor assembly, adhesive film prepared therefrom, device including the same, and associated methodsCHOI HAN NIM·Filed 2008·Application pending·0 cites
- 0740US2009162650A1Adhesive film composition for semiconductor assembly, adhesive film, dicing die bonding film, device package, and associated methodsHONG YONG WOO·Filed 2008·Application pending·0 cites
- 0840US2009136748A1Adhesive compostion for die bonding in semiconductor assembly, adhesive film prepared therefrom, dicing die-bonding film prepared therefrom, device package including the same, and associated methodsCHOI HAN NIM·Filed 2008·Application pending·0 cites
- 0938US2008160300A1Composition for pressure sensitive adhesive film, pressure sensitive adhesive film, and dicing die bonding film including the sameHWANG YONG HA·Filed 2007·Application pending·0 cites
- 1035US2012029117A1Adhesive film for semiconductor assemblyCHOI HAN NIM·Filed 2011·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →